Abstract: A semiconductor device includes: a substrate; an adhesive member arranged on a surface of the substrate; a first chip stacked on the adhesive member with a first adhesive piece interposed therebetween; and a second chip stacked on the first chip with a second adhesive piece interposed therebetween. The adhesive member has a multilayer structure including a pair of surface layers formed of a cured product of a thermosetting resin composition and an intermediate layer arranged between the pair of surface layers.

Abstract: A thermosetting resin composition for a friction material includes a thermosetting resin and a lignocellulose nanofiber dispersed in the thermosetting resin. A method for producing a thermosetting resin composition for a friction material includes a first step and a second step. In the first step, a plant-based biomass containing a lignocellulose is mixed with a dispersion medium to obtain a mixture thereof, and the mixture is subjected to a defibration treatment to obtain a slurry of a lignocellulose nanofiber. In the second step, phenol is reacted with an aldehyde in the presence of an acid catalyst to obtain a thermosetting resin, and the slurry is added to the thermosetting resin. The lignocellulose nanofiber is dispersed in the thermosetting resin while removing the dispersion medium and unreacted phenol.

Abstract: A thermosetting resin composition for a friction material includes a thermosetting resin and a lignocellulose nanofiber dispersed in the thermosetting resin. A method for producing a thermosetting resin composition for a friction material includes a first step and a second step. In the first step, a plant-based biomass containing a lignocellulose is mixed with a dispersion medium to obtain a mixture thereof, and the mixture is subjected to a defibration treatment to obtain a slurry of a lignocellulose nanofiber. In the second step, phenol is reacted with an aldehyde in the presence of an acid catalyst to obtain a thermosetting resin, and the slurry is added to the thermosetting resin. The lignocellulose nanofiber is dispersed in the thermosetting resin while removing the dispersion medium and unreacted phenol.