Patents by Inventor Kaneyoshi Oyama

Kaneyoshi Oyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5936010
    Abstract: A process for producing a highly reactive low-viscosity modified phenolic resin comprising the steps of polycondensating a petroleum heavy oil or pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst to prepare a modified phenolic resin; and reacting the resultant modified phenolic resin with the phenols at a temperature higher than 120.degree. C. and not more than 200.degree. C. in the presence of the acid catalyst to lower the molecular weight of the modified phenolic resin. The highly reactive low-viscosity modified phenolic resin obtained according to this process has high reactivity with epoxy resins and low resin melt viscosity. In addition, this resin can be used for producing a molding material having good moldability and considerably low moisture absorption when combined with an epoxy resin.
    Type: Grant
    Filed: April 17, 1998
    Date of Patent: August 10, 1999
    Assignee: Kashima Oil Co., Ltd.
    Inventors: Masao Tashima, Hiromi Miyasita, Makoto Hasegawa, Kaneyoshi Oyama, Tomoaki Fujii
  • Patent number: 5792826
    Abstract: A process for producing a highly reactive low-viscosity modified phenolic resin comprising the steps of polycondensating a petroleum heavy oil or pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst to prepare a modified phenolic resin; and reacting the resultant modified phenolic resin with the phenols at a temperature higher than 120.degree. C. and not more than 200.degree. C. in the presence of the acid catalyst to lower the molecular weight of the modified phenolic resin. The highly reactive low-viscosity modified phenolic resin obtained according to this process has high reactivity with epoxy resins and low resin melt viscosity. In addition, this resin can be used for producing a molding material having good moldability and considerably low moisture absorption when combined with an epoxy resin.
    Type: Grant
    Filed: February 7, 1997
    Date of Patent: August 11, 1998
    Assignee: Kashima Oil Co. Ltd.
    Inventors: Masao Tashima, Hiromi Miyasita, Makoto Hasegawa, Kaneyoshi Oyama, Tomoaki Fujii
  • Patent number: 5614600
    Abstract: A fiber-reinforced resin plate comprising a fibrous base material and a matrix bonding the fibers contained in the fibrous base material, the matrix being formed by curing a resin composition comprising a highly reactive modified phenolic resin (A) prepared by polycondensing a petroleum heavy oil or pitch, a formaldehyde polymer and a phenol in the presence of an acid catalyst to thereby prepare a modified phenolic resin and-reacting the resultant modified phenolic resin with a phenol in the presence of an acid catalyst to thereby lower the molecular weight of the modified phenolic resin, and an epoxy resin (B). Also, a prepreg and a process for producing the fiber-reinforced resin plate.
    Type: Grant
    Filed: March 15, 1995
    Date of Patent: March 25, 1997
    Assignee: Kashima Oil Co., Ltd.
    Inventors: Masahiro Tsumura, Hiromi Miyasita, Kaneyoshi Oyama