Abstract: A circuit device with a ball grid array (BGA) package structure includes an interposer substrate, at least a flip chip, a unitary mold resin and a heat spreader. The interposer substrate has a plurality of first connecting pads arrayed on an upper surface thereof in a first density. The flip chip has a plurality of second connecting pads arrayed on a lower surface thereof in the first density, and is mounted on the interposer substrate via solder bumps for connecting the plurality of first connecting pads and the plurality of second connecting pads. The unitary mold resin fills a space between the lower surface of the flip chip and the upper surface of the interposer substrate and peripheral portions of the flip chip on the upper surface of the interposer substrate. The heat spreader has a lower surface directly coupled to an upper surface of the flip chip with a metal paste and coupled to upper surfaces of the peripheral portions.

Abstract: A solid-state image sensing element is disposed below and tightly enclosed with an optically transparent cover in order to protect the element from the outside, the cover being integrally formed into an inverse U-shape in a cross-section. The cover is made of plastics having good light transmissivity. The solid-state image sensing element is mounted on a substrate and is electrically connected thereto through metal wires. The above-mentioned transparent cover is adhered on the substrate through an adhesive such as an epoxy resin or the like so that the element is tightly enclosed. Thus, there is provided a solid-state image sensing device which is light in weight and can be fabricated at a low cost.

Abstract: For protecting a semiconductor chips from an electric destruction due to electrostatic charges. A card-shaped information storage medium used for providing data information to an information processing unit comprising (a) a board member of an insulating material having an first occupation area for at least one semiconductor chip capable of preserving the data informations and a second occupation area for a plurality of communication terminals electrically coupled to the semiconductor chip, (b) a protective member covering the semiconductor chip and exposing the communication terminals to the outside thereof, and (c) a protective shutter movable into or out of the protective member for shifting a position of the information storage medium between a closed state and an open state. The communication terminals are covered with the protective shutter in the closed state, thereby preventing the communication terminals from a human body with the electrostatic charges.