Abstract: An efficient process for partial electroless plating that causes plating film to deposit only a specific part of substrate which needs plating, without requiring the corrosion step. The process includes five steps of forming a coating film on which electroless plating is performed, activating said coating film, imparting a catalyst to said coating film, activating said catalyst, and performing electroless plating, and said coating film is formed from any one of the following four resin compositions:1. composed of a low-molecular weight compound having an N--H bond, an adhesive polymer having a C.dbd.C double bond, and a polybasic acid having a C.dbd.C double bond;2. composed of an adhesive polymer dense with N--H bonds, and a polybasic acid compatible with said polymer or a monobasic acid having a C.dbd.C double bond;3. composed of a resin component which gives rise to an N--H bond upon curing reaction, and a polybasic acid having a C.dbd.C double bond; or4.

Abstract: Disclosed is a method for electroless metal deposition, which comprises steps of: forming, on the surface of a non-conductive body to be plated, a coating of a resin composition for the electroless metal deposition containing therein a polymer (A) having a chemical structure of at least one compound selected from the group consisting of the below-listed (a), and at least one compound selected from the group of the below-listed (b)1 and (b)2; applying a negative electrostatic voltage to the film coating of the resin composition at a temperature level above the glass transition point of said resin composition; thereafter removing the applied voltage at a temperature lower than the glass transition temperature; and successively carrying out the metal deposition steps inclusive of the catalyst imparting step and the activating step:(a) a chemical structure, in which a part of hydrogen in the main chain of polymer is substituted with the halogen group or the nitrile group, and a chemical structure having a double

Abstract: This invention relates to a novel electroless plating method which requires no pre-treatment step for the surface-corrosion on the surface to be plated, wherein a metal layer is formed by applying, onto the surface to be plated, a solution of a composition consisting of a styrene type elastomer used generally as a component for the hot melt type adhesive agent, or the styrene type elastomer and a stickiness imparting resin of a molecular structure similar to that of the elastomer; drying the solution as applied; and effecting the electroless plating on the coated film thus obtained, the method being able to substitute the conventional electroless plating as an advance step of the electrolytic plating for synthetic resin. The particular object of the present invention is to utilize the method in the field of the electroless plating for the purpose of preventing the plating operation from the electromagnetic wave disturbances.

Abstract: A polyolefin composition comprising 100 parts by weight of polyolefin, not less than 0.5 part by weight of a polyamide selected from the group consisting of nylon 6 and nylon 66, and from 3 to 30 percent by weight of novolak based on the weight of the polyamide; and a method of making polyolefin molded articles having surface improved in secondary processable property, which is characterized by treating the surface of molded articles of the polyolefin composition with a solution comprising: (a) not less than 2 percent by weight of a monomer having at least one carbon-carbon double bond and a glycidyl group, (b) 1 to 5 percent by weight of chlorinated polyolefin, and (c) not more than 97 percent by weight of a mixed solvent of 30 to 70 percent by weight of terpenic solvent and 70 to 30 percent by weight of aromatic or chlorinated hydrocarbon solvent.

Abstract: A reactive polyolefin composition comprising a polyolefin and a rubber component dispersed in the polyolefin in fine granular form, at least a portion of the particles of the rubber component containing at least one type of polymer having a functional group in the molecular structure thereof, a molding thereof and a process for producing the same, are disclosed.