Patents by Inventor Kang-Chia Peng

Kang-Chia Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for fabricating metal wires
    Patent number: 7666291
    Abstract: A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially exposed. Next, an electroplating process is performed to form a second metal layer on top of the partially exposed first metal layer. Next, the mask with patterns is removed and an etching process is performed to remove part of the first metal layer by utilizing the second metal layer as a mask for forming a metal wire.
    Type: Grant
    Filed: September 28, 2005
    Date of Patent: February 23, 2010
    Assignee: Chunghwa Picture Tubes, Ltd.
    Inventor: Kang-Chia Peng
  • Method for Fabricating Metal Wires
    Publication number: 20070068822
    Abstract: A method for fabricating metal wires is disclosed. A substrate is first provided, and a first metal layer is formed over the surface of the substrate. Next, a mask with patterns is formed on the surface of the substrate, in which the first metal layer is partially exposed. Next, an electroplating process is performed to form a second metal layer on top of the partially exposed first metal layer. Next, the mask with patterns is removed and an etching process is performed to remove part of the first metal layer by utilizing the second metal layer as a mask for forming a metal wire.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 29, 2007
    Inventor: Kang-Chia Peng