Abstract: A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.

Abstract: Provided is a coil substrate having an asymmetric structure, in which the area of a coil pattern included in a first region is expanded relative to the area of a coil pattern included in a second region with respect to a virtual axis, and an electronic apparatus having the same. The coil substrate comprises a base layer; and a coil pattern spirally wound on the base layer, wherein an upper portion of the base layer is divided into a first region and a second region based on a void region formed inside the coil pattern, wherein an area of the coil pattern formed in the second region is larger than an area of the coil pattern formed in the first region.

Abstract: Provided is a coil apparatus having a plurality of coil patterns formed on one surface. The coil apparatus comprises at least one coil substrate, wherein the coil substrate comprises a base layer, and a coil pattern formed on the base layer and including a pattern portion, a via portion part or an external electrode portion, and a coil substrate, wherein the coil substrate is wound in a multi-helical structure in response to a plurality of coil patterns being provided.

Abstract: The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.

Abstract: The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.