Patents by Inventor Kang Hou
Kang Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240141766Abstract: A bidirectional self-regulating chemical flooding method and system for enhancing oil recovery includes: determining the average particle size of dispersed phase droplets under stable seepage flow of an oil-in-water emulsion according to the average reservoir permeability; determining injection concentration of an emulsifier which matches a target reservoir according to reservoir seepage velocity; under a condition of keeping the injection concentration of the emulsifier constant, determining the optimal injection concentration of a polymer which matches the injection concentration of the emulsifier through core flooding experiments with the maximum equivalent ton oil accumulation as a target; determining total injection amount of the emulsifier and total injection amount of the polymer for implementing well group units; and optimizing injection amount of the emulsifier and the polymer in each single well by using a numerical simulator of a chemical flooding reservoir.Type: ApplicationFiled: November 21, 2022Publication date: May 2, 2024Inventors: Jian Hou, Kang Zhou, Zhinbin An, Qingjun Du, Yongge Liu, Bei Wei, Dejun Wu, Shuai Liu
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Patent number: 11967546Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.Type: GrantFiled: July 21, 2022Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
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Publication number: 20240119559Abstract: The present disclosure discloses an image enlarging apparatus having deep learning mechanism. A deep learning circuit includes an image downsizing circuit, an image characteristic analyzing circuit, a weighting reallocating circuit and an image upsizing circuit. The image downsizing circuit downsizes an input image to generate a downsized image. The image characteristic analyzing circuit analyzes the downsized image according to image characteristics to generate categorized images. The weighting reallocating circuit performs weighting reallocating on the categorized images according to image weighting parameters corresponding to the image characteristics to generate weighting reallocated images. The image upsizing circuit upsizes the weighting reallocated images to generate adjusted images. A concatenating circuit concatenates the input image and the adjusted images to generate concatenated images.Type: ApplicationFiled: October 3, 2023Publication date: April 11, 2024Inventors: CHON-HOU SIO, CHIA-WEI YU, KANG-YU LIU, YEN-YING CHEN
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Patent number: 11916009Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, a molding compound and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The at least one semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The molding compound is disposed over the interposer and laterally encapsulates the at least one semiconductor die. The molding compound laterally wraps around the interposer and the molding compound at least physically contacts a portion of the sidewalls of the interposer. The connectors are disposed on the second surface of the interposer, and are electrically connected with the at least one semiconductor die through the interposer.Type: GrantFiled: May 30, 2022Date of Patent: February 27, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chi-Ming Huang, Ping-Kang Huang, Sao-Ling Chiu, Shang-Yun Hou
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Patent number: 11912932Abstract: An encapsulated polymer flooding method and system for enhancing oil recovery includes: (1) determining reservoir parameters, a well deployment, and a development dynamic state of a target oil reservoir; (2) determining a near-wellbore targeted profile control area and a far-wellbore targeted viscosification area; (3) designing and synthesizing an encapsulated polymer according to conditions of the target oil reservoir; (4) evaluating and determining whether the anti-shearing performance, the sustained release and viscosification performance, the injection performance, and the profile control performance of the encapsulated polymer meet expected performance requirements based on laboratory tests; (5) formulating an injection scheme for an encapsulated polymer flooding field; and (6) monitoring the development dynamic state of the oil reservoir; according to the present disclosure, the polymer is wrapped with a shell layer, which greatly reduces the shear degradation during injection of the polymer and effectiType: GrantFiled: June 21, 2023Date of Patent: February 27, 2024Assignee: CHINA UNIVERSITY OF PETROLEUM (EAST CHINA)Inventors: Jian Hou, Bei Wei, Yongsheng Liu, Kang Zhou, Qingjun Du, Yongge Liu
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Patent number: 10638217Abstract: An audio appliance includes a microphone transducer having an acoustically sensitive region to convert incident acoustic energy to a corresponding output signal and a barometric transducer having a pressure-responsive region to convert an ambient pressure to a corresponding output signal. The audio appliance also has an acoustic housing defining a chamber to fluidly couple the microphone transducer with the barometric transducer, together with a processor and a memory containing instructions. The instructions, when executed by the processor, cause the audio appliance to determine a presence or an absence of an ambient impairment to the microphone transducer based at least in part on the output signal from the barometric transducer. Responsive to a determined presence of an ambient impairment to the microphone transducer, the instructions, when executed by the processor, cause the audio appliance to mitigate effects of the ambient impairment.Type: GrantFiled: November 5, 2018Date of Patent: April 28, 2020Assignee: Apple Inc.Inventors: Kang Hou, Guohua Sun, Xiang Zhou, Yu-Chun Hsu, Junye Wang
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Publication number: 20200107113Abstract: An audio appliance includes a microphone transducer having an acoustically sensitive region to convert incident acoustic energy to a corresponding output signal and a barometric transducer having a pressure-responsive region to convert an ambient pressure to a corresponding output signal. The audio appliance also has an acoustic housing defining a chamber to fluidly couple the microphone transducer with the barometric transducer, together with a processor and a memory containing instructions. The instructions, when executed by the processor, cause the audio appliance to determine a presence or an absence of an ambient impairment to the microphone transducer based at least in part on the output signal from the barometric transducer. Responsive to a determined presence of an ambient impairment to the microphone transducer, the instructions, when executed by the processor, cause the audio appliance to mitigate effects of the ambient impairment.Type: ApplicationFiled: November 5, 2018Publication date: April 2, 2020Inventors: Kang Hou, Guohua Sun, Xiang Zhou, Yu-Chun Hsu, Junye Wang
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Miniature loudspeaker module, method for enhancing frequency response thereof, and electronic device
Patent number: 9699548Abstract: The present invention discloses a miniature loudspeaker module, a method for enhancing frequency response of a miniature loudspeaker module, and an electronic device. The method comprises the steps of: additionally providing a passive driver in a cavity where an active driver of a miniature loudspeaker module is located, the passive driver and the active driver radiating together, wherein, after the passive driver is additionally provided in the miniature loudspeaker module, the amplitude of a vibrating diaphragm of the active driver shows a local dip on frequency bands below a resonant frequency point F0, and the lowest point of the local dip is corresponding to a frequency point Fb; and, perform, according to amplitude characteristics of the vibrating diaphragm of the active driver of the miniature loudspeaker module additionally provided with the passive driver, matching enhancement to an input signal of the active driver.Type: GrantFiled: June 5, 2014Date of Patent: July 4, 2017Assignee: Goertek Inc.Inventor: Kang Hou -
Patent number: 9485566Abstract: The present invention discloses a method for enhancing frequency response of a miniature speaker module, a miniature speaker module, and an electronic device. The method for enhancing frequency response of a miniature speaker module comprises the steps of: additionally providing an inverted tube in a rear cavity of the miniature speaker module to form a second driver in the inverted tube when an active driver works, the second driver and the active driver radiating jointly; and matching enhancement processing the input signals of the active driver according to the vibrating amplitude characteristics of the diaphragm of the active driver of the miniature speaker module additionally provided with the inverted tube.Type: GrantFiled: June 5, 2014Date of Patent: November 1, 2016Assignee: Goertek Inc.Inventor: Kang Hou
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MINIATURE LOUDSPEAKER MODULE, METHOD FOR ENHANCING FREQUENCY RESPONSE THEREOF, AND ELECTRONIC DEVICE
Publication number: 20160286305Abstract: The present invention discloses a miniature loudspeaker module, a method for enhancing frequency response of a miniature loudspeaker module, and an electronic device. The method comprises the steps of: additionally providing a passive driver in a cavity where an active driver of a miniature loudspeaker module is located, the passive driver and the active driver radiating together, wherein, after the passive driver is additionally provided in the miniature loudspeaker module, the amplitude of a vibrating diaphragm of the active driver shows a local dip on frequency bands below a resonant frequency point F0, and the lowest point of the local dip is corresponding to a frequency point Fb; and, perform, according to amplitude characteristics of the vibrating diaphragm of the active driver of the miniature loudspeaker module additionally provided with the passive driver, matching enhancement to an input signal of the active driver.Type: ApplicationFiled: June 5, 2014Publication date: September 29, 2016Applicant: Goertek Inc.Inventor: Kang Hou -
Publication number: 20160014501Abstract: The present invention discloses a method for enhancing frequency response of a miniature speaker module, a miniature speaker module, and an electronic device. The method for enhancing frequency response of a miniature speaker module comprises the steps of: additionally providing an inverted tube in a rear cavity of the miniature speaker module to form a second driver in the inverted tube when an active driver works, the second driver and the active driver radiating jointly; and matching enhancement processing the input signals of the active driver according to the vibrating amplitude characteristics of the diaphragm of the active driver of the miniature speaker module additionally provided with the inverted tube.Type: ApplicationFiled: June 5, 2014Publication date: January 14, 2016Inventor: Kang Hou