Abstract: A backsheet of a solar cell module including a substrate, a first protection layer, and a second protection layer is provided. The substrate includes a first surface and a second surface opposite to each other. The first protection layer is disposed on the first surface of the substrate. The second protection layer is disposed on the second surface of the substrate, wherein the first protection layer and the second protection layer include a silicone layer. At least one of the first protection layer and the second protection layer includes diffusion particles, wherein the diffusion particles include zinc oxide, titanium dioxide modified with silicon dioxide, or a combination thereof. A thickness of the first protection layer and a thickness of the second protection layer are respectively 10 ?m to 30 ?m. A solar cell module including the backsheet is also provided.

Abstract: The present disclosure generally relates to memory devices and methods of forming the same. More particularly, the present disclosure relates to resistive random-access (ReRAM) memory devices incorporating reference cells for achieving high sensing yield. The present disclosure provides a memory device including a main cell structure including a switching element arranged between a pair of conductors, and a reference cell structure electrically coupled to the main cell structure. The reference cell structure includes a switching element arranged between a pair of conductors, in which the switching element of the reference cell structure has a dimension that is different from a dimension of the switching element of the main cell structure.

Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: One aspect provides a method and system for saturation of multiple I/O slots by multiple testing ports and verification of link health in between. During operation, the system detects a testing card with a plurality of test ports which are coupled to a plurality of input/output (I/O) slots of a computing device. The system communicates with the plurality of test ports via the plurality of I/O slots. The system generates, by the computing device, a script for each test port, wherein the script comprises a series of read and write operations to be executed by the testing card on a memory device associated with the computing device. The system allows the plurality of test ports to execute the script and perform the corresponding read operations and write operations, thereby facilitating testing of the I/O slots of the computing device in parallel by the test ports of the single testing card.

Abstract: An antenna structure with multiple frequency capabilities applied to an electronic device includes frame body, first feed point, a first switch point, and second switch point. The frame body has at least one portion made of metal material and defines two gaps. The frame body between gaps form a first radiation portion. The first feed point from a source feeds current and signal to the first radiation portion. The first switch point and the second switch point are located at two ends of the frame body adjacent to the first gap. The first switch point and the second switch point are grounded through a switch circuit.

Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.

Abstract: An antenna structure applied in a wireless communication device includes a metal frame, a first feed portion, a second feed portion, and a ground portion. The metal frame defines a first gap and a second gap. A portion of the metal frame positioned between the first gap and the second gap forms the first radiation portion. The first feed portion is electrically connected to the first radiation portion and a first signal feed point for feeding current and signals to the first radiation portion. The second feed portion is positioned apart from the first feed portion, electrically connected to the first radiation portion and a second signal feed point for feeding current and signal to the first radiation portion. The ground portion is positioned between the first feed portion and the second feed portion and is connected to the first radiation portion for grounding the first radiation portion.

Abstract: An antenna module includes a substrate, a radiation portion, and an active circuit. The radiation portion and the active circuit are both arranged on the substrate. The radiation portion is a complete sheet body made of conductive material, at least one signal feed point is arranged on one side of the radiation portion to feed electrical signals to the radiation portion. The radiation portion defines at least one slot, the slot divides the radiation portion into radiation branches arranged at intervals. Each radiation branch is electrically connected to a signal feeding point, so as to feed electric signals to the radiation branch. The active circuit is electrically connected to the radiation portion to switch radiation modes of the radiation portion. The application also provides an electronic device with the antenna module.

Abstract: A microminiaturized antenna feed module includes a substrate, a plurality of coupled feed portions, and an active circuit. The substrate defines a plurality of visa penetrating the substrate. The coupled feed portions, made of conductive material and have different coupling areas, are electrically connected to the active circuit through the holes, to feed in electrical signals, the coupled feed portions couple the electrical signals to the metal frame to radiate wireless signals; the active circuit controls the switching of radiation modes of the metal frame. The application also provides an electronic device with the microminiaturized antenna feed module.

Abstract: An electronic device includes a metal frame, a middle frame, and at least one antenna feed module. The metal frame includes an upper metal frame, a first side metal frame, a bottom metal frame, and a second side metal frame sequentially connected. The middle frame, spaced apart from the first side metal frame and the second side metal frame, forms a slit, the at least one antenna feed module is received in the slit.

Abstract: An antenna coupled feed module is received in a slit formed between a metal frame and at least one electronic component of an electronic device. The antenna coupled feed module includes a substrate, at least one coupled feed portion, an active circuit, a metal layer, and a non-conductive layer. The coupled feed portion and the active circuit are disposed on opposite surfaces of the substrate; the coupled feed portion couples the electrical signals to the metal layer, the metal layer conducts the electrical signals to the metal frame to radiate wireless signals; the non-conductive layer is arranged between the metal layer and the at least one coupled feed portion, and covers the coupled feed portion; the active circuit switches the electrical signals fed to the coupled feed portion. An electronic device with the antenna coupled feed module is also provided.

Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: A signal feeding assembly to a radiating element which is not formed from a metal frame or casing includes a substrate, a signal coupling unit, a switching unit, and a transmission unit. The switching unit includes at least two switching output ends. The transmission unit can transmit and receive a baseband signal and an RF signal. The signal coupling unit is spaced from a radiation element and can generate a plurality of radiation modes. The signal coupling unit includes at least two coupling pieces. Each coupling piece is electrically connected to a switching output end. The switching unit controls switching of the coupling pieces through the switching output ends and can switch a plurality of radiation modes. The application also provides an antenna module and an electronic device.

Abstract: An antenna structure applied in a wearable device includes a ceramic layer, a plastic layer, a radiating portion, a feed portion; and a connecting portion. The ceramic layer includes a first surface and a second surface corresponding to each other. The plastic layer is connected to the second surface. The radiating portion is a predetermined metal pattern and arranged in the first surface. The connecting portion passes through the plastic layer and is electrically connected to the feed portion. The feed portion feeds an electrical current to the radiating portion to generate radiation signals in at least one radiation frequency band. A wearable device having the antenna structure is also provided.

Abstract: An antenna structure applied in a wearable device includes a first radiating portion, a ceramic layer, a plastic layer, and a feed portion. The first radiating portion is a metal structure. The ceramic layer covers and contacts the first radiating portion. The first radiating portion is arranged between the ceramic layer and the plastic layer. The feed portion passes through the plastic layer and feeds an electric current into the first radiating portion, the first radiating portion and the ceramic layer cooperatively generate radiation signals in at least one radiation frequency band. A wearable device having the antenna structure is also provided.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: A securing structure is applicable in an electronic device for securing an antenna module in a slot defined between a side frame and a middle frame of the electronic device. The securing structure includes a first assembly, a second assembly, and a third assembly. The first assembly secures the antenna module in a first direction, the first assembly includes a plastic piece for spacing the antenna module from the side frame with a predetermined distance. The second assembly secures the antenna module in a second direction, the second assembly includes a limiting assembly formed by protruding from the middle frame. The third assembly secures the antenna module in a third direction, the third assembly includes a pressing piece for pressing the antenna module in the third direction. The application also provides an electronic device with the securing structure.

Abstract: An antenna structure for a metal-cased electronic device includes a radiator, a feed portion, and a slit. The feed portion can feed signals into the radiator, the radiator includes a first end and a second end, the first end disposes a first radiation portion, the second end disposes a second radiation portion and a third radiation portion, the second radiation portion and the third radiation portion are coupled to each other to radiate a radiation signal at a first frequency band, the slit and the radiator is spaced at intervals, and the slit is coupled to the first radiation portion to radiate the radiation signal at a second frequency band. The present disclosure also provides an electronic device with the antenna structure.

Abstract: An antenna structure with multiple frequency and MIMO capabilities applied to an electronic device includes back board, side frame, first feed point, second feed point, and first ground point. The side frame defines at least a first gap and a second gap. The first and second gaps create first and second radiation portions from the side frame. The first feed point from a source feeds current and signal to the first radiation portion. The second feed point from a source feeds current and signal to the second radiation portion. The first ground point is positioned between the first and second feed points. When the first feed point and the second feed point supply current, the first radiation portion and the second radiation generate at least one common radiation frequency band together with others.

Abstract: An antenna structure applied in a wireless communication device includes a frame, a first feed portion, a second feed portion, and a ground portion. The frame defines at least a first gap and a second gap. The first gap and the second gap collectively divide the frame into a first radiation portion and a second radiation portion. The first feed portion is electrically connected to the first radiation portion and a first signal feed point for feeding currents and signals to the first radiation portion. The second feed portion is electrically connected to the second radiation portion and a second signal feed point for feeding currents and signals to the second radiation portion. When the first radiation portion and the second radiation portion supply currents, respectively, the first radiation portion and the second radiation portion generate radiation signals in at least one same frequency band.