Abstract: An apparatus for automated wafer carrier handling includes a base plate and an active expansion component movably coupled to the base plate. The active expansion component is configured to change from a contracted form to an expanded form so as to be engaged with a top flange mounted on a wafer carrier.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: This application discloses a method for updating a virtual environment picture performed by a computer device. The method includes: displaying a first virtual environment picture of a virtual environment using a first observation position as an observation center, wherein a virtual character is located at a first position in the first virtual environment picture; in response to receiving a first directional operation on the virtual character, displaying a skill indicator in accordance with the first directional operation; and when at least a portion of the skill indicator is going to exceed the first virtual environment picture, replacing the first virtual environment picture with displaying a second virtual environment picture, wherein the virtual character is relocated from the first position in the first virtual environment picture to a second position in the second virtual environment picture so as to present the skill indicator in the second virtual environment picture.

Abstract: An image analysis device may align an image to determine a position of a wafer within the image. The wafer may include a plurality of wafer bumps. The image analysis device may mask, based on the position of the wafer, the image to obtain an image of a portion of the wafer. The image analysis device may binarize the image of the portion of the wafer to create a binarized image of the portion of the wafer. The image analysis device may determine a bump pattern, associated with the plurality of wafer bumps, based on the binarized image of the portion of the wafer. The image analysis device may perform a defect analysis of the determined bump pattern. The defect analysis may be associated with detecting regions of the portion of the wafer in which one or more wafer bumps have abnormal bump heights.

Abstract: Provided are a virtual object control method, apparatus, device, and computer-readable storage medium, belonging to the field of computer technologies. The method includes controlling a first virtual object to cast a first skill in response to a first operation on a first skill control, wherein the first virtual object moves from a first position to a second position when casting the first skill; obtaining a second operation on a second skill control during casting of the first skill by the first virtual object; displaying a skill casting indicator of a second skill based on the second position for the second operation, the skill casting indicator indicating an influence range of the second skill; and controlling the first virtual object to cast the second skill at the second position according to the influence range after the first virtual object completes casting of the first skill.

Abstract: A method for preparing carbon black from pyrolysis char of waste tires by a molten salt thermal treatment and a product thereof are provided. The method includes heating one or two groups of a metal chloride salt group and a metal sulfate group to obtain a molten salt; adding pyrolysis char of waste tires into the molten salt and subjecting same to a molten salt thermal treatment under a preset reaction atmosphere; after the reaction is complete, separating the reaction product to obtain a secondary molten salt and treated pyrolysis char, washing the treated pyrolysis char with hot water and then drying same so as to obtain carbon black, and at the same time, recycling the secondary molten salt.

Abstract: An apparatus for inspecting wafer carriers is disclosed. In one example, the apparatus includes: a housing; a load port; a robot arm inside the housing; and a processor. The load port is configured to load a wafer carrier into the housing. The robot arm is configured to move a first camera connected to the robot arm. The first camera is configured to capture a plurality of images of the wafer carrier. The processor is configured to process the plurality of images to inspect the wafer carrier.

Abstract: This application discloses a method for operating virtual characters within a virtual environment performed by a computer device.

Abstract: An apparatus and an operating method for automated wafer carrier handling are provided. The operation method includes bring a base frame and an engaging mechanism of an automated wafer carrier handling apparatus into abutting contact with a top flange mounted on a wafer carrier to limit at least one degree of freedom of movement of the top flange, where the engaging mechanism is disposed on the base frame; transporting the wafer carrier to a destination location by the automated wafer carrier handling apparatus; and releasing the top flange mounted on the wafer carrier from the automated wafer carrier handling apparatus at the destination location.

Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

Abstract: Disclosed are a method for cooling a passenger compartment and a battery, comprising: step S101, determining the current driving stage of a vehicle; S102, querying, according to a correlation between a driving stage and a cooling strategy, a target cooling strategy corresponding to the current driving stage of the vehicle, wherein different driving stages correspond to different cooling strategies, and each cooling strategy comprises passenger compartment cooling and battery cooling; and S103, cooling a passenger compartment and/or a battery according to the target cooling strategy. Also disclosed are an apparatus for cooling a passenger compartment and a battery, and a vehicle to which the method is applied.

Abstract: A cart for wafer transportation includes a cart body, a separator disposed between first and second wafer holders, an airtight lock configured to seal the cart body. A wafer transfer system includes a cart including a space for holding a wafer holder, a first workstation configured to load the wafer holder into the space and pressurize the space, and a second workstation configured to depressurize the space and unload the wafer holder from the space, wherein the cart is transportable between the first workstation and the second workstation. A method for transporting wafers includes docking a cart in a workstation; loading a wafer holder into a space of the cart; pressurizing the space to cause a pressure of the space to be greater than an atmospheric pressure; maintaining the pressure of the space at the pressure; and moving the cart carrying the wafer holder away from the workstation.

Abstract: A cooling controller receives, from one or more sensors, wafer information associated with a wafer. The cooling controller determines a pattern mask area for the wafer based on the wafer information. The cooling controller determines a cooling time for the wafer based on the pattern mask area. The cooling controller causes a cooling plate to cool the wafer for a time duration equal to the cooling time. Determining the cooling time for a wafer based on a pattern mask area provides stable and consistent wafer temperatures for wafers having different mask and layout properties, which reduces mask overlay variation and increases wafer yield.

Abstract: In the method and the apparatus for thermal management and control, and the vehicle according to the present disclosure, an overtemperature threshold of the vehicle may be adjusted in off-road conditions, and/or an operating temperature of the vehicle may be obtained, and driving parameters of the vehicle may be adjusted according to the operating temperature, so as to enhance the heat dissipation performance of the vehicle in the off-road conditions, and avoid that an over-temperature protection of the engine is easily triggered when the engine is operated at a high speed and a high torque in the off-road conditions, resulting in driving experience being affected by limited torque of the engine and turn-off of an air conditioning occurring in the vehicle, and driving safety also being affected, with no high-power fan and large-size radiator being additionally installed, and thus reducing weight and manufacturing cost of the vehicles.

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

Abstract: Food products and systems and methods for their production involve microfiltration (“MF”) of fluid skim to form a MF retentate, combining the MF retentate with cream and subjecting the combination to ultrafiltration (“UF”) to form a UF retentate. Prior to UF, the composition is formed of non-acidified components. Following UF, the UF retentate is acidified and forms a food product including a high solids content. The solids content may be further increased using evaporation. The resulting cheese or cheese base contains a lower whey protein ratio in a fat:casein:whey protein ratio compared to systems and methods that do not employ MF.

Abstract: A load port receives a wafer carrier. An equipment front end module (EFEM) transfers semiconductor wafers to and from the wafer carrier via an access opening of a housing of the EFEM, and also transfers wafers to and from a semiconductor processing or characterization tool. A gas flow device disposed inside the housing of the EFEM is connected to receive a low humidity gas having relative humidity of 10% or less, and is positioned to flow the received low humidity gas across the access opening. A saturated pressure layer of the gas flow device has a permeability for the low humidity gas that increases with increasing distance from a gas inlet edge of the saturated pressure layer, for example due to holes of varying diameter and/or density passing through the saturated pressure layer. A filter layer of the gas flow device uniformizes the gas exiting the saturated pressure layer.

Abstract: An apparatus and method for debonding a pair of bonded wafers are disclosed herein. In some embodiments, the debonding apparatus, comprises: a wafer chuck having a preset maximum lateral dimension and configured to rotate the pair of bonded wafers attached to a top surface of the wafer chuck, a pair of circular plate separating blades including a first separating blade and a second separating blade arranged diametrically opposite to each other at edges of the pair of bonded wafers, wherein the first and the second separating blades are inserted between a first and a second wafers of the pair of bonded wafers, and at least two pulling heads configured to pull the second wafer upwardly so as to debond the second wafer from the first wafer.

Abstract: A system and method for defect detection in a hole array on a substrate is disclosed herein. In one embodiment, a method for defect detection in a hole array on a substrate, includes: scanning a substrate surface using at least one optical detector, generating at least one image of the substrate surface; and analyzing the at least one image to detect defects in the hole array on the substrate surface based on a set of predetermined criteria.

Abstract: A method for detecting a three-dimensional object in a two-dimensional image includes: inputting the two-dimensional image into an object detection model, and obtaining a resulting detection depth dataset; obtaining, based on the detection depth dataset, coordinate sets of a number of points-of-interest each associated with a to-be-detected object in a 3D camera centered coordinate system; and converting the coordinate sets of the number of points-of-interest in the 3D camera centered coordinate system into a number of coordinate sets in a 3D global coordinate system. Embodiments of this disclosure may be utilized in the field of self-driving cars with roadside traffic cameras.