Patents by Inventor Kang Liu

Kang Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250136217
    Abstract: A bike trailer frame structure includes a rear frame and a base frame. The rear side of the base frame is mounted with left and right pivot bases, that have a fixing hole (fixing groove) respectively connected to the bottom side of the rear frame through a respective positioning element. Thereby, when the right positioning elements are released, the rear frame can pivot toward the base frame and fold, or can pivot in the direction opposite to the base frame, and then fix the positioning elements to the fixing holes or fixing grooves of the pivot bases to complete the unfolding action. Therefore, the invention simplifies the folding structure of the rear frame and the base frame in the front and rear directions. It has the practicality of streamlined components, uncomplicated manufacturing, simple and convenient assembly, and saving transportation space.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 1, 2025
    Inventor: Cheh-Kang Liu
  • Publication number: 20250113042
    Abstract: The present disclosure provides a video processing method, apparatus and electronic device. The method includes: acquiring a first video; processing the first video based on a video processing model to obtain a second video, wherein a training stage of the video processing model includes a differentiable encoder which is configured to simulate quantization and encoding processes performed by an encoder on a video, and the differentiable encoder is capable of performing gradient backpropagation; and encoding the second video.
    Type: Application
    Filed: September 24, 2024
    Publication date: April 3, 2025
    Inventors: Mengxi GUO, Fei ZHAO, Kang LIU, Shijie ZHAO, Hongbin LIU, Junlin LI, Li ZHANG
  • Publication number: 20250102734
    Abstract: A semiconductor photonics device includes a plurality of grating couplers, each configured to couple a particular wavelength (or wavelength range) of an optical signal to a waveguide of the semiconductor photonics device. In some implementations, various implementations of optical signal splitters or filters described herein enable respective wavelengths (or respective wavelength ranges) to be passed to each of the grating couplers (while filtering out other wavelengths or other wavelength ranges), thereby enabling the grating couplers to each handle a respective wavelength (or respective wavelength range). This enables multiple wavelengths (or multiple wavelength ranges) to be distributed across multiple grating couplers, which may increase the bandwidth of the semiconductor photonics device relative to a semiconductor photonics device that includes only a single grating coupler.
    Type: Application
    Filed: September 26, 2023
    Publication date: March 27, 2025
    Inventors: Chih-Tsung SHIH, Wei-kang LIU, Hau-Yan LU, Chi-Yuan SHIH, Ming-Fa CHEN, YingKit Felix TSUI
  • Patent number: 12235490
    Abstract: A semiconductor structure includes a waveguide and an optical attenuator. The waveguide is disposed over an insulating layer and configured to guide light. The optical attenuator is connected to the waveguide. The optical attenuator has a first surface and a second surface opposite the first surface, and a cross-sectional width of the optical attenuator decreases from the first surface to the second surface.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: February 25, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Kang Liu, Lee-Shian Jeng, Chih-Tsung Shih, Hau-Yan Lu, Yingkit Felix Tsui
  • Publication number: 20250044518
    Abstract: An edge coupler includes a substrate, a first cladding layer over the substrate, a core layer over the first cladding layer, and an ARC layer. The substrate has a first sidewall, the first cladding layer has a second sidewall aligned with the first sidewall, and the core layer has a third sidewall aligned with the second sidewall. The ARC layer lines the first sidewall, the second sidewall and the third sidewall. The ARC layer physically contacts and covers a surface of the substrate. A first height of the ARC layer varies along the surface of the substrate.
    Type: Application
    Filed: October 22, 2024
    Publication date: February 6, 2025
    Inventors: WEI-KANG LIU, CHIH-TSUNG SHIH, HAU-YAN LU, YINGKIT FELIX TSUI
  • Patent number: 12202570
    Abstract: A bike trailer with improved top cover includes a trailer frame installed with a seat, a top cover, a left panel and a right panel. One side of the top cover is fixed to one side of the trailer frame. A connecting member and a connected member are respectively provided between the other side of the top cover and the other side of the trailer frame so that the top cover can be opened when the connecting member is disengaged from the connected member. The top cover is provided with an accommodating space along the direction of opening to receiving direction, and a stretched and straightened coiled leaf spring is installed in the accommodating space and fixed on the top cover.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: January 21, 2025
    Inventor: Cheh-Kang Liu
  • Publication number: 20240418941
    Abstract: A method of forming a grating coupler includes: providing an initial design layout of the grating coupler, wherein the initial design layout includes: a taper section, comprising a pair of tapers; and a grating section coupled to the taper section, the grating section having an array of gratings, wherein the gratings includes gradually changing shapes, from a top-view perspective, from a first non-convex octagonal shape of a central grating, at a center of the grating section, of one of a second non-convex octagonal shape, a convex octagonal shape, and a quadrilateral shape, to an edge grating near an edge of the grating section. The method further includes: converting the initial design layout into a revised design layout through an optical proximity correction operation; and manufacturing the grating coupler using the revised design layout.
    Type: Application
    Filed: June 14, 2023
    Publication date: December 19, 2024
    Inventors: CHENG-TSE TANG, WEI-KANG LIU, HAU-YAN LU, YINGKIT FELIX TSUI
  • Publication number: 20240403382
    Abstract: Provided are a method and a device of multivariable time series processing. The method comprises obtaining a time series set comprising a plurality of first time series segments having a same length and being a multivariable time series; inputting the first time series segment into a graph neural network to predict a multivariable reference value corresponding to a first time point that is a next time point adjacent to a latest time point in the first time series segment; determining an optimization function based on multivariable reference values corresponding to a plurality of the first time points and corresponding multivariable series tags; determining values of respective parameters in the causal matrix with an objective of minimizing the optimization function; and determining, based on the values of the respective parameters in the causal matrix, a causal relationship between multiple variables in the multivariable time series.
    Type: Application
    Filed: August 13, 2024
    Publication date: December 5, 2024
    Inventors: Yang SUN, Yifan XIE, Kang LIU, Xuan LUO
  • Patent number: 12153261
    Abstract: An edge coupler, a waveguide structure and a method for forming a waveguide structure are provided. The edge coupler includes a substrate, a first cladding layer, a core layer and a first anti-reflection coating layer. The first cladding layer has a second sidewall aligned with a first sidewall of the substrate. The core layer has a third sidewall aligned with the second sidewall. The anti-reflection coating layer lines the first sidewall, the second sidewall and the third sidewall. A thickness of the anti-reflection coating layer varies along the first sidewall, the second sidewall and the third sidewall.
    Type: Grant
    Filed: July 13, 2022
    Date of Patent: November 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Wei-Kang Liu, Chih-Tsung Shih, Hau-Yan Lu, Yingkit Felix Tsui
  • Publication number: 20240385372
    Abstract: An edge coupler has a wide end, a narrow end, and a tapering thickness. The narrow end is coupled to a waveguide in a photonic integrated circuit (PIC). The wide end is coupled to an optical transmitter or receiver. The edge coupler thickens by tapering downward into the buried oxide layer of a BOX substrate. An upper surface of the edge coupler may be planar. A pedestal may be formed in the oxide layer so that a laser diode mounted on the pedestal will be vertically aligned to the edge coupler. Alternatively, the pedestal may be formed in a substrate under the oxide layer so that the core of an optical fiber mounted on the pedestal will be vertically aligned to the edge coupler. The pedestal may be in a cavity that facilitates horizontal alignment between the laser diode, optical fiber, or other such device and the edge coupler.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 21, 2024
    Inventors: Hau-Yan Lu, Wei-Kang Liu, Yingkit Felix Tsui
  • Publication number: 20240369764
    Abstract: A semiconductor structure includes a grating coupler structure, a circuit component separated from the grating coupler structure, an inter level dielectric layer, a capping layer over the inter level dielectric layer, and a passivation layer over the capping layer. The inter level dielectric layer has a first refractive index, the capping layer has second refractive index, and the passivation layer has a third refractive index. The second refractive index is greater than the first refractive index, and is greater than the third refractive index.
    Type: Application
    Filed: July 21, 2024
    Publication date: November 7, 2024
    Inventors: CHIH-TSUNG SHIH, WEI-KANG LIU, SUI-YING HSU, JING-HWANG YANG, YINGKIT FELIX TSUI
  • Publication number: 20240361524
    Abstract: Some implementations described herein include a photonics integrated circuit device including a photonics structure. The photonics structure includes a waveguide structure and an optical attenuator structure. In some implementation, the optical attenuator structure is formed on an end region of the waveguide structure and includes a metal material or a doped material. In some implementations, the optical attenuator structure includes a gaussian doping profile within a portion of the waveguide structure. The optical attenuator structure may absorb electromagnetic waves at the end of the waveguide structure with an efficiency that is improved relative to a spiral optical attenuator structure or metal cap optical attenuator structure.
    Type: Application
    Filed: July 8, 2024
    Publication date: October 31, 2024
    Inventors: Wei-kang LIU, Chih-Tsung SHIH, Hau-Yan LU, YingKit Felix TSUI, Lee-Shian JENG
  • Publication number: 20240360551
    Abstract: A semiconductor processing tool includes: a process chamber into which a semiconductor wafer is loaded; a support for securing the wafer loaded into the chamber tool; an inlet which introduces a first gas into the chamber for processing the wafer; and an exhaust system that exhausts gas from the chamber. The exhaust system includes: a first line coupled to the chamber to exhaust gas from the chamber; and a pump to draw gas through the first line from the chamber. The tool further includes a heating module having: a second line coupled to the first and a supply of a second gas, the second gas being flowed through the second line from the supply into the first line; and a heating element contained in the second line, the heating element heating the second gas in the second line before the second gas is flowed into the first line.
    Type: Application
    Filed: April 28, 2023
    Publication date: October 31, 2024
    Inventors: Sheng-chun Yang, Yi-Ming Lin, Chun Chang, Che Kang Liu, Kaijun Jan, Xuan-Yang Zheng, Tzu-Chuan Chao, Weigang Wu, Chih-Yuan Wang, Ren-Jyue Wang
  • Publication number: 20240353625
    Abstract: Some embodiments relate to an integrated chip (IC) including a handle substrate; a semiconductor layer comprising a grating coupler region and an edge coupler region; an insulative layer between the handle substrate and the semiconductor layer; a grating coupler in the grating coupler region comprising a plurality of trenches arranged in the semiconductor layer; and an edge coupler in the edge coupler region of the semiconductor layer including: a base structure having an end proximate to an edge of the insulative layer, and tapered sidewalls extending laterally from the end; and an upper structure extending over the base structure, the upper structure having an end proximate to the edge of the insulative layer, and tapered sidewalls extending laterally from the end between the tapered sidewalls of the base structure; where the handle substrate continuously extends from directly beneath the plurality of trenches to directly beneath the upper structure.
    Type: Application
    Filed: April 18, 2023
    Publication date: October 24, 2024
    Inventors: Hau-Yan Lu, Wei-Kang Liu, Yingkit Felix Tsui
  • Patent number: 12124083
    Abstract: A semiconductor structure includes a substrate, a grating coupler structure over the substrate, a multi-layers film structure over the grating coupler structure. The multi-layers film structure include a first layer including a first refractive index, a second layer over the first layer and including a second refractive index and a third layer over the second layer and including a third refractive index. The second refractive index is greater than the first refractive index and is greater than the third refractive index of the third layer, and a thickness of each layer of the multi-layers film structure is within a range from ?/4 to ?2, ? is a wavelength of light.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: October 22, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chih-Tsung Shih, Wei-Kang Liu, Sui-Ying Hsu, Jing-Hwang Yang, Yingkit Felix Tsui
  • Publication number: 20240345320
    Abstract: Various embodiments of the present disclosure are directed towards a photonic device including a temperature adjustment element. A first waveguide overlies an insulating layer. A second waveguide overlies the insulating layer. The temperature adjustment element includes a heater structure aligned with a segment of the first waveguide and a cooler structure aligned with a segment of the second waveguide. The heater structure is configured to increase a temperature of the segment of the first waveguide to a first temperature. The cooler structure is configured to reduce a temperature of the segment of the second waveguide to a second temperature less than the first temperature.
    Type: Application
    Filed: April 14, 2023
    Publication date: October 17, 2024
    Inventors: Wei-Kang Liu, Hau-Yan Lu, Yingkit Felix Tsui
  • Publication number: 20240329298
    Abstract: An integrated chip including a base dielectric layer and a multi-tiered semiconductor waveguide layer over the base dielectric layer. The multi-tiered semiconductor waveguide layer has a first waveguide tier having a first width at a first height over the base dielectric layer. The multi-tiered semiconductor waveguide layer has a second waveguide tier having a second width, greater than the first width, at a second height, less than the first height, over the base dielectric layer. A cladding layer is over the multi-tiered semiconductor waveguide layer. A multi-tiered conductive heater layer is over the cladding layer. The multi-tiered conductive heater layer has a first heater tier over the first waveguide tier. The multi-tiered conductive heater layer has a pair of second heater tiers at the first height, over the second waveguide tier, and on opposite sides of the first waveguide tier.
    Type: Application
    Filed: April 3, 2023
    Publication date: October 3, 2024
    Inventors: Wei-Kang Liu, Hau-Yan Lu, Ying Kit Felix Tsui
  • Publication number: 20240324135
    Abstract: An easily mountable device bracket assembly includes a first bracket having a side that can be provided with at least one mounting member, a second bracket, and a third bracket having a side that can be fixed to a device housing and at least one bent portion having an inner wall spaced apart from an outer wall of the third bracket to form a slide groove. At least one gap formed by the mounting member and the side of the first bracket forms another slide groove. The second bracket can extend into the another slide groove in a connecting direction to be connected with the first bracket. When the device mounted with the third bracket is placed into an open rack or rack-type cabinet, the slide groove is in contact with the first bracket, and the third bracket is connected to the first bracket slidingly along the connecting direction.
    Type: Application
    Filed: July 14, 2023
    Publication date: September 26, 2024
    Applicant: Alpha Networks Inc.
    Inventors: SHAO-KANG LIU, CHIH-KUANG WANG
  • Publication number: 20240310579
    Abstract: A method for forming an optical waveguide structure includes following operations. A substrate is received. A semiconductor layer is formed on the substrate. The semiconductor layer is patterned to form at least a waveguide in the substrate and at least a trench in the semiconductor layer. A first gap-filling operation is performed to form a first dielectric portion in the trench. A second gap-filling operation is performed to form a second dielectric portion over the first dielectric portion. An air seam is sealed within the second dielectric portion. A third gap-filling operation is performed to form a third dielectric portion over the second dielectric portion.
    Type: Application
    Filed: May 24, 2024
    Publication date: September 19, 2024
    Inventors: CHIH-TSUNG SHIH, HAU-YAN LU, WEI-KANG LIU, YINGKIT FELIX TSUI
  • Patent number: D1050412
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: November 5, 2024
    Inventor: Kang Liu