Abstract: The subject matter disclosed herein relates to structures formed on semiconductor chips that are used for at least partially addressing the thermally induced stresses and metallization system cracking problems in a semiconductor chip that may be caused by the presence of through-silicon vias (TSV's), and which may be due primarily to the significant differences in thermal expansion between the materials of the TSV's and the semiconductor-based materials that generally make up the remainder of the semiconductor chip. One device disclosed herein includes a substrate and a crack-arresting structure positioned above the substrate, the crack-arresting structure comprising a plurality of crack-arresting elements and having a perimeter when viewed from above.

Abstract: Semiconductor devices and methods for forming a semiconductor device are presented. The semiconductor device includes a die which includes a die substrate having first and second major surfaces. The semiconductor device includes a passive component disposed below the second major surface of the die substrate. The passive component is electrically coupled to the die through through silicon via (TSV) contacts.

Abstract: An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.

Abstract: A system and method for collating and presenting information including at least one structured data source on a non-transitory computer readable medium; at least one unstructured data source on a non-transitory computer readable medium; an analytical engine in data communication with the at least one structured data source and the at least one unstructured data source; wherein the analytical engine combines and transforms data from the at least one structured data source and from the at least one unstructured data source into newly structured data; the newly structured data being stored on a computer readable medium; an engine data handler adapted to correspond with the analytical engine and to access the newly structured data; a schema definition stored on a computer readable medium accessible by the analytical engine and executed by a computer processor to define a domain of the newly structured data and one or more state views within the domain; a processor for configuring the at least one or more state vi

Abstract: A method for sorting a light source is to be implemented by a computer and includes configuring the computer to determine whether or not a to-be-sorted light source is different from a reference light source by comparing features of a curve associated with measured spectral data of the to-be-sorted light source, with features of a reference curve associated with reference spectral data of a reference light source.

Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.

Abstract: A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed.

Abstract: The subject matter disclosed herein relates to structures formed on semiconductor chips that are used for at least partially addressing the thermally induced stresses and metallization system cracking problems in a semiconductor chip that may be caused by the presence of through-silicon vias (TSV's), and which may be due primarily to the significant differences in thermal expansion between the materials of the TSV's and the semiconductor-based materials that generally make up the remainder of the semiconductor chip. One device disclosed herein includes a substrate and a crack-arresting structure positioned above the substrate, the crack-arresting structure comprising a plurality of crack-arresting elements and having a perimeter when viewed from above.

Abstract: An electronic device connected with at least one digital video camera dynamically monitors an area where the digital video camera covers. The electronic device displays a monitor point tree, where each node corresponds to a digital video camera. The electronic device can dynamically create an icon control component of a selected digital video camera on an electronic map by dragging and dropping the node corresponding to the one selected on a electronic map. The electronic device can play a video feed of the digital video camera by clicking on the created icon control component.

Abstract: A method for operating an AC LED is disclosed. The method operates with an assumption that a linear relationship exists between the voltage and current of the AC LED operating at an active region. Hence, a first driving voltage and a second driving voltage are applied to the AC LED for respectively measuring a first driving current and a second driving current, and an interpolation is used for obtaining a third driving voltage. The third driving voltage is the predicted driving voltage for the AC LED. The method is capable of determining the actual driving voltage precisely and rapidly before the follow-up tests for other AC LEDs may proceed.

Abstract: Generally, the subject matter disclosed herein relates to interconnect structures used for making electrical connections between semiconductor chips in a stacked or 3D chip configuration, and methods for forming the same. One illustrative method disclosed herein includes forming a conductive via element in a semiconductor substrate, wherein the conductive via element is formed from a front side of the semiconductor substrate so as to initially extend a partial distance through the semiconductor substrate. The illustrative method also includes forming a via opening in a back side of the semiconductor substrate to expose a surface of the conductive via element, and filling the via opening with a layer of conductive contact material.

Abstract: A packaging substrate device includes: a first laminate including a first ceramic substrate and a first copper pattern disposed on an upper surface of the first ceramic substrate; and a second laminate disposed over the first copper pattern and including a second ceramic substrate, a second copper pattern that is disposed on an upper surface of the second ceramic substrate, and a through hole extending through the second ceramic substrate and the second copper pattern to expose a copper portion of the first copper pattern. A light emitting semiconductor die can be mounted on the copper portion within the through hole. Efficient heat dissipation can be achieved through the first laminate.

Abstract: Generally, the subject matter disclosed herein relates to interconnect structures used for making electrical connections between semiconductor chips in a stacked or 3D chip configuration, and methods for forming the same. One illustrative method disclosed herein includes forming a conductive via element in a semiconductor substrate, wherein the conductive via element is formed from a front side of the semiconductor substrate so as to initially extend a partial distance through the semiconductor substrate. The illustrative method also includes forming a via opening in a back side of the semiconductor substrate to expose a surface of the conductive via element, and filling the via opening with a layer of conductive contact material.

Abstract: A method for making a packaging device for an electronic element includes: preparing a ceramic frame body defined with a hollow space for receiving the electronic element therein; preparing a ceramic substrate having a copper layer formed thereon; etching the copper layer to form a predetermined copper pattern on an upper surface of the ceramic substrate; placing the ceramic frame body onto the upper surface of the ceramic substrate and in contact with the copper pattern; and heating the ceramic frame body and the ceramic substrate such that the copper pattern bonds the ceramic frame body to the ceramic substrate. A packaging device for an electronic element is also disclosed.

Abstract: A method and an apparatus for controlling a distributed automation system, wherein the method comprises determining global constraint rules according to the cooperative relationships between function blocks in the distributed automation system, and establishing a mathematical model based on Membrane Calculus, performing the instantiation of the established mathematical model based on Membrane Calculus according to an executor corresponding to each of the function blocks in the distributed automation system, so as to produce control logics for output to the distributed automation system. If disturbance information is received from the distributed automation system, altering the parameters of the instantiation of the mathematical model based on Membrane Calculus are altered using the disturbance information, so as to produce control logics for outputting to said distributed automation system.

Abstract: An alternating current (AC) light-emitting device includes a waveform generating unit and an AC light-emitting unit. The waveform generating unit is configured to receive an AC electrical signal and to generate a drive signal by adjusting one of: voltage amplitude of the AC electrical signal during one of positive and negative half-cycles of the AC electrical signal, and waveform level of the AC electrical signal. The AC light-emitting unit includes a first light-emitting component and a second light-emitting component, and the second light-emitting component emits a different wavelength light compared to that emitted by the first light-emitting component. The first and second light-emitting components are electrically coupled to the waveform generating unit to receive the drive signal, and emit light according to the drive signal.

Abstract: A client computer may be configured to perform computer security operation services, such as malicious code scanning and protection against online threats, using one of several remotely located server computers. The client computer may be configured to determine an operational state of the server computers and determine a protection status of the client computer resulting from use of a server computer of a particular operational state. The protection status may have one of at least three levels and indicate vulnerability of the client computer. The client computer may determine the operational state of a server computer based on available bandwidth for network communication between the client computer and the server computer. The client computer may be configured to allow for automatic or manual selection of another server computer when the currently selected server computer results in the client computer having a protection status below a threshold level.

Abstract: An LED module includes at least two LED package units and at least one connecting unit. Each LED package unit includes at least one first engaging portion, at least one first conductive portion, and at least one LED chip connected electrically to the first engaging portion. The connecting unit includes at least two second engaging portions, and at least one second conductive portion having two opposite end sections extending respectively to the second engaging portions. When the second engaging portions of the connecting unit engaged with the first engaging portions of the LED package units, respectively, the end sections of the second conductive portion contact electrically and respectively the corresponding first conductive portions so as to connect electrically the LED chips of the LED package units.

Abstract: A method for operating an AC LED is disclosed. The method operates with an assumption that a linear relationship exists between the voltage and current of the AC LED operating at an active region. Hence, a first driving voltage and a second driving voltage are applied to the AC LED for respectively measuring a first driving current and a second driving current, and an interpolation is used for obtaining a third driving voltage. The third driving voltage is the predicted driving voltage for the AC LED. The method is capable of determining the actual driving voltage precisely and rapidly before the follow-up tests for other AC LEDs may proceed.

Abstract: An electronic device connected with at least one digital video camera dynamically monitors an area where the digital video camera covers. The electronic device displays a monitor point tree, where each node corresponds to a digital video camera. The electronic device can dynamically create an icon control component of a selected digital video camera on an electronic map by dragging and dropping the node corresponding to the one selected on a electronic map. The electronic device can play a video feed of the digital video camera by clicking on the created icon control component.