Abstract: Embodiments of the present application provide a testing equipment and a testing method. The testing equipment includes: a plurality of pad groups and a plurality of source measure units. Each of the pad groups has a stress pad. The stress pad is configured to connect an element under test. The source measure unit is configured to send an input signal to the element under test through the stress pad and measure an output signal of the element under test to acquire performance parameters of the element under test. The stress pads of at least two of the pad groups are connected to the corresponding source measure units at the same time. The embodiments of the present application help improve the testing efficiency.

Abstract: Embodiments of the present application provide an evaluation method for hot carrier effect degraded performance, which includes: providing at least one wordline and at least one wordline driver; performing an electrical test on the wordline; performing a characteristic test on a sample passing the electrical test, to obtain a first performance parameter; inputting an AC signal to an input end of the wordline driver, to control the wordline to be repeatedly on and off through the wordline driver; performing the electrical test on the wordline; and performing the characteristic test on the sample passing the electrical test, to obtain a second performance parameter, and evaluating the hot carrier effect degraded performance of the wordline driver according to the first performance parameter and the second performance parameter.

Abstract: Embodiments of the present application provide a testing equipment and a testing method. The testing equipment includes: a plurality of pad groups and a plurality of source measure units. Each of the pad groups has a stress pad. The stress pad is configured to connect an element under test. The source measure unit is configured to send an input signal to the element under test through the stress pad and measure an output signal of the element under test to acquire performance parameters of the element under test. The stress pads of at least two of the pad groups are connected to the corresponding source measure units at the same time. The embodiments of the present application help improve the testing efficiency.