Patents by Inventor Kangmin Jung

Kangmin Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11415876
    Abstract: The present disclosure relates to a fabrication method of a photomask. The method of fabricating a photomask provides for a layout of patterns to be designed. The layout of patterns may be formed on a wafer on which chips are formed. The layout of patterns are corrected to provide a layout of a photoresist pattern serving as an etching mask for forming the patterns on the wafer while generating a flare map of the patterns. An optical proximity correction (OPC) may be performed at a chip level on the corrected layout of patterns to perform a secondary correction of the layout of patterns. A second OPC may be performed at a level of a shot which includes a plurality of ones of the chips by reflecting the flare map on the second corrected layout of patterns to a third corrected layout of patterns.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: August 16, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kangmin Jung, Sangwook Park, Youngdeok Kwon, Myungsoo Noh
  • Publication number: 20220155674
    Abstract: An optical proximity correction method of a lithography system includes dividing a transmission cross coefficient (TCC) for each slit region; generating an optical proximity correction (OPC) model to which the divided TCC is applied; measuring an apodization value for each slit position; fitting critical dimension (CD) data for each slit position to a simulation CD of the OPC model; and correcting the OPC model using the fitted CD data.
    Type: Application
    Filed: August 31, 2021
    Publication date: May 19, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kangmin JUNG, Sangwook PARK
  • Publication number: 20210181617
    Abstract: The present disclosure relates to a fabrication method of a photomask. The method of fabricating a photomask provides for a layout of patterns to be designed. The layout of patterns may be formed on a wafer on which chips are formed. The layout of patterns are corrected to provide a layout of a photoresist pattern serving as an etching mask for forming the patterns on the wafer while generating a flare map of the patterns. An optical proximity correction (OPC) may be performed at a chip level on the corrected layout of patterns to perform a secondary correction of the layout of patterns. A second OPC may be performed at a level of a shot which includes a plurality of ones of the chips by reflecting the flare map on the second corrected layout of patterns to a third corrected layout of patterns.
    Type: Application
    Filed: September 24, 2020
    Publication date: June 17, 2021
    Inventors: KANGMIN JUNG, Sangwook Park, Youngdeok Kwon, Myungsoo Noh
  • Patent number: 9238879
    Abstract: Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: January 19, 2016
    Assignee: SK INNOVATION CO., LTD.
    Inventors: Yongrak Moon, Kangmin Jung
  • Publication number: 20150119545
    Abstract: Provided is a method of fabricating a thermal conductive polymer, including: a) fabricating a gel filament by primarily elongating a solution filament formed by spinning a mixed solution containing an ultra high molecular weight polyolefin (UHMWPO) resin and a first solvent, followed by cooling; b) secondarily elongating the gel filament; c) fabricating a dry filament by removing the solvent from the gel filament, followed by tertiary elongation; and d) converting the dry filament into the gel filament by adding the first solvent to the dry filament; e) removing the first solvent from the converted gel filament; and f) quaternarily elongating the gel filament from which the first solvent is removed.
    Type: Application
    Filed: October 29, 2014
    Publication date: April 30, 2015
    Inventors: Yongrak MOON, Kangmin JUNG
  • Publication number: 20150025163
    Abstract: The present invention is directed to a polyalkylene carbonate resin composition for producing a decorating material and an environment-friendly polyalkylene carbonate resin decorating material produced therefrom. More particularly, the invention is directed to polyalkylene carbonate resin composition for producing a decorating material in which including a polymer additive to impart heat resistance and shape stability to the decorating material, a crosslinker and a chain extender to improve the processability at the processing temperature, and a flame retardant agent to impart a flame retardant effect, and an environment-friendly polyalkylene carbonate resin decorating material produced therefrom. The environment-friendly polyalkylene carbonate resin decorating material produced using the inventive composition has excellent thermal stability, processability, and dimensional stability.
    Type: Application
    Filed: May 28, 2014
    Publication date: January 22, 2015
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Younghyo Park, Inhun Son, Kangmin Jung, Jaekoo Kim, Kwangjin Chung, Myungahn Ok
  • Patent number: 8252886
    Abstract: Provided is a resin composition for a sheet to an eco-friendly poly(alkylene carbonate) resin composition containing a poly(alkylene carbonate) resin developed by efficiently utilizing carbon dioxide, which is a major contributor to global warming, as a main material, and including an strength controller, a flexibilizer and a filler. The present invention can solve problems related to environment harmfulness of the existing polyvinyl chloride resin products and have excellent flameproofing property and stretching property. In addition, the present invention can employ a calender processing method, which allows mass production and overcome a small production type extrusion processing method, which is regarded as the biggest disadvantage of thermoplastics emerging as alternatives for the existing polyvinyl chloride products.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: August 28, 2012
    Assignee: SK Innovation Co., Ltd.
    Inventors: Jaekoo Kim, Myungahn Ok, Inhun Son, Kangmin Jung, Kwangjin Chung
  • Publication number: 20120196958
    Abstract: Provided is a polyalkylene carbonate resin composition for producing a decorating material and an environment-friendly polyalkylene carbonate resin decorating material produced therefrom, and more particularly to polyalkylene carbonate resin composition for producing a decorating material in which a polymer additive is input to impart heat resistance and shape stability of the decorating material, a crosslinker and a chain extender is input to improve the processability at a processing temperature, and a flame retardant agent is added to impart a flame retardant effect, and an environment-friendly polyalkylene carbonate resin decorating material produced therefrom. An environment-friendly polyalkylene carbonate resin decorating material having excellent thermal stability, processability, and dimensional stability can be produced by using the composition according to the present invention.
    Type: Application
    Filed: January 26, 2012
    Publication date: August 2, 2012
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Younghyo Park, Inhun Son, Kangmin Jung, Jaekoo Kim, Kwangjin Chung, Myung Ahn Ok
  • Publication number: 20120059078
    Abstract: Provided is a resin composition for a sheet to an eco-friendly poly(alkylene carbonate) resin composition containing a poly(alkylene carbonate) resin developed by efficiently utilizing carbon dioxide, which is a major contributor to global warming, as a main material, and including an strength controller, a flexibilizer and a filler. The present invention can solve problems related to environment harmfulness of the existing polyvinyl chloride resin products and have excellent flameproofing property and stretching property. In addition, the present invention can employ a calender processing method, which allows mass production and overcome a small production type extrusion processing method, which is regarded as the biggest disadvantage of thermoplastics emerging as alternatives for the existing polyvinyl chloride products.
    Type: Application
    Filed: September 2, 2011
    Publication date: March 8, 2012
    Applicant: SK INNOVATION CO., LTD.
    Inventors: Jaekoo KIM, Myungahn OK, Inhun SON, Kangmin JUNG, Kwangjin CHUNG