Abstract: A wafer cleaning apparatus includes a wafer roller to rotate a wafer in a first direction, first and second roller brushes disposed to be parallel to each other, the first and second roller brushes to be brought into contact with opposing surfaces of the wafer to clean the opposing surfaces of the wafer, respectively, while rotating in mutually opposing directions, first and second pipes having a longitudinal direction parallel to each other, the first and second pipes being above the first and second roller brushes and conveying a cleaning liquid for cleaning the wafer, first and second nozzle groups disposed along the longitudinal direction of the pipes, respectively, and including a plurality of nozzles to spray the cleaning liquid onto the opposing surfaces of the wafer at a predetermined angle, respectively, and a binding part connecting the first and second pipes to restrain movement of the first and second pipes.

Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust. The drying fluid line may be connected to the inlet.

Abstract: An apparatus for drying a substrate may include a spin chuck, a drying chamber and a drying fluid line. The spin chuck may be configured to support the substrate. The spin chuck may rotate the substrate. The drying chamber may be configured to receive the spin chuck. The drying chamber may have an inlet, an outlet and a vortex exhaust. A drying fluid may be supplied through the inlet into the drying chamber. The drying fluid may be drained through the outlet. A vortex of the drying fluid may be drained through the vortex exhaust The drying fluid line may be connected to the inlet.