Patents by Inventor Kang-Ming FAN

Kang-Ming FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12158308
    Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: December 3, 2024
    Assignee: AURAS TECHNOLOGY CO., LTD.
    Inventors: Chih-Wei Chen, Tien-Yao Chang, Che-Wei Kuo, Hsiang-Chih Chuang, Jyun-Wei Huang, Kang-Ming Fan
  • Publication number: 20240361083
    Abstract: A loop heat pipe one-way circulation device includes a lower cover plate and an upper casing closely connected to the lower cover plate. The upper casing includes a fluid inlet, a fluid outlet, a joint surface, a heat absorption area and a gas discharge cavity. The joint surface is in close contact with the lower cover plate, and the heat absorption area is formed between the fluid inlet and the fluid outlet. In addition, the heat absorption area includes a heat absorption area inner surface height, and the gas discharge cavity has a gas discharge cavity height, and the gas discharge cavity height is greater than the heat absorption area inner surface height.
    Type: Application
    Filed: April 26, 2024
    Publication date: October 31, 2024
    Inventors: Chih-Wei CHEN, Kang-Ming FAN
  • Publication number: 20240365500
    Abstract: A heat dissipation device includes an inclined heat pipe and a plurality of inclined heat dissipation fins. The inclined heat pipe includes an inclined heat dissipation area, and each inclined heat dissipation fin includes an inclined heat dissipation portion. In addition, the inclined heat dissipation area of the inclined heat pipe is fixed to the inclined heat dissipation portion so that the inclined heat dissipation area of the inclined heat pipe forms a predetermined angle relative to a horizontal plane.
    Type: Application
    Filed: April 11, 2024
    Publication date: October 31, 2024
    Inventors: Chih-Wei CHEN, Kang-Ming FAN, Tsung-Han TSAI, Fu-Hsuan HSIEH, Chien-Yu LIU
  • Publication number: 20230065137
    Abstract: A heat dissipation device is provided and includes: a first vapor chamber filled with a first working fluid therein and used for contacting at least one heat source; at least one heat transfer structure disposed on a side of the first vapor chamber; and a second vapor chamber filled with a second working fluid therein and connected to the first vapor chamber via the heat transfer structure, where the first working fluid absorbs heat of the heat source and then vaporizes, and the vaporized first working fluid transfers the heat to the second working fluid via the heat transfer structure.
    Type: Application
    Filed: July 7, 2022
    Publication date: March 2, 2023
    Inventors: Chih-Wei CHEN, Tien-Yao CHANG, Che-Wei KUO, Hsiang-Chih CHUANG, Jyun-Wei HUANG, Kang-Ming FAN