Abstract: A GPS (Global Positioning System) antenna module includes a substrate, a first insulating layer, and a second insulating layer. The substrate is set on a bottom surface of a patch antenna. The first insulating layer is coated on the substrate and a layout circuit is formed thereon. A plurality of electronic elements are integrated on the substrate according to the layout circuit. Furthermore, the second insulating layer is coated on the first insulating layer to completely shield the electronic elements integrated on the substrate. Hence, the distance between the electronic elements and the antenna of the present invention can be shortened, space on the PCB and in the shielding case is saved. Moreover, an optimal high frequency character can be achieved, the volume of the antenna module is effectively reduced, the process is simplified, and production costs are reduced.

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a metal layer with at least two spiral structures on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and at least two spiral structures. The metal layer is formed on the surface of the column body, and the at least two spiral structures are formed on the metal layer for increasing bandwidth of low frequency. Each spiral structure is formed by removing a part of the metal layer, and the column body is exposed via the at least two spiral structures.

Abstract: An overload alarm device is provided. The device is disposed in an electric auxiliary system for avoiding overload of the system. The device includes a current detection unit, a voltage comparison unit and an alarm unit. The current detection unit includes a non-contact sensor connected to the circuit of the system for sensing the current of the system so as to output a voltage signal corresponding to the current. The voltage comparison unit compares the value of the voltage signal with a preset value. As the value of the voltage signal exceeds the preset value, the voltage comparison unit drives the alarm unit to generate an alarm signal.

Abstract: A GPS (Global Positioning System) antenna module includes a substrate, a first insulating layer, and a second insulating layer. The substrate is set on a bottom surface of a patch antenna. The first insulating layer is coated on the substrate and a layout circuit is formed thereon. A plurality of electronic elements are integrated on the substrate according to the layout circuit. Furthermore, the second insulating layer is coated on the first insulating layer to completely shield the electronic elements integrated on the substrate. Hence, the distance between the electronic elements and the antenna of the present invention can be shortened, space on the PCB and in the shielding case is saved. Moreover, an optimal high frequency character can be achieved, the volume of the antenna module is effectively reduced, the process is simplified, and production costs are reduced.

Abstract: The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: An antenna apparatus includes a hollow column, a conductive cable, a first metal wire, a column structure, and a second metal wire. The conductive cable is received in the hollow column, and the conductive cable electrically contacts the hollow column via a second conductive wire layer thereof. One side of the first metal wire is electrically connected with a first conductive wire layer of the conductive cable. The column structure has a column body, a metal layer formed on the column body, at least one spiral groove formed on the metal layer for exposing a part of the column body, and two conductive covers respectively disposed on two sides of the column body. Moreover, one of the two conductive covers is electrically connected with the other side of the first metal wire. Furthermore, one side of the second metal wire is electrically connected with the other conductive cover.

Abstract: An antenna apparatus includes a hollow column, a conductive cable, a first metal wire, a column structure, and a second metal wire. The conductive cable is received in the hollow column, and the conductive cable electrically contacts the hollow column via a second conductive wire layer thereof. One side of the first metal wire is electrically connected with a first conductive wire layer of the conductive cable. The column structure has a column body, a metal layer formed on the column body, at least one spiral groove formed on the metal layer for exposing a part of the column body, and two conductive covers respectively disposed on two sides of the column body. Moreover, one of the two conductive covers is electrically connected with the other side of the first metal wire. Furthermore, one side of the second metal wire is electrically connected with the other conductive cover.

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a spiral metal layer on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and a spiral structure. The metal layer is formed on the surface of the column body, and the spiral structure is formed on the metal layer. The spiral structure is implemented by removing part of the metal layer to form a pitch structure. The column body is exposed between the pitches. The column antenna apparatus can be applied to a single, dual, three or multi frequencies wireless communication device. Furthermore, the column antenna apparatus can be installed at outside of the wireless communication device to be an external antenna or at inside of the wireless communication device to be a built-in antenna.

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a metal layer with at least two spiral structures on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and at least two spiral structures. The metal layer is formed on the surface of the column body, and the at least two spiral structures are formed on the metal layer for increasing bandwidth of low frequency. Each spiral structure is formed by removing a part of the metal layer, and the column body is exposed via the at least two spiral structures.

Abstract: A column antenna apparatus and a manufacturing method thereof are disclosed. This invention forms a spiral metal layer on a column body. The column antenna apparatus can simplify the manufacturing process and enhance the yield rate. The column antenna apparatus includes a column body, a metal layer and a spiral structure. The metal layer is formed on the surface of the column body, and the spiral structure is formed on the metal layer. The spiral structure is implemented by removing part of the metal layer to form a pitch structure. The column body is exposed between the pitches. The column antenna apparatus can be applied to a single, dual, three or multi frequencies wireless communication device. Furthermore, the column antenna apparatus can be installed at outside of the wireless communication device to be an external antenna or at inside of the wireless communication device to be a built-in antenna.

Abstract: The present invention relates to a chip-type resettable over-current protection device structure using a substrate composed of a Polymeric Positive Temperature Coefficient (PPTC) material and covered by an upper electrode and a lower electrode, mainly characterized in that the overall area of the Polymeric Positive Temperature Coefficient (PPTC) material may be used to fabricate a main electrode structure of the device, so as to produce an over-current protection device with a higher rated current. Furthermore, the present invention does not need a through-hole or etching process which is generally needed for fabricating the over-current protection device.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

Abstract: The invention relates to resettable chip-type over-current protection devices and methods of making the same, characterized by directly forming upper and lower electrode conductor and connection electrode conductor on a PPTC substrate so as to constitute a simplified three-layer structure of “electrode conductor-PPTC substrate-electrode conductor.

Abstract: The present invention relates to a resetable over-current protection device. The device is characterized in that: disconnected areas are maintained at end faces of formed cutting regions of the protection device, wherein one or two of the end faces of the formed cutting regions are partly formed with electrically conductive layers so as to increase the lifespan of the device and allows easy manufacturing of the device. The present invention also provides a method of manufacturing the resetable over-current protection device. The method is characterized in that a polymer-based sheet is divided into a plurality of components from which resetable over-current protection devices are subsequently manufactured into the resetable over-current protection devices to save the cost of material.

Abstract: A kind of transient voltage suppressor structure that prevents the edge of the signal electrode from contacting with the variable impedance material by using an insulation layer to remove the point discharge existing on the edge of the signal electrode and increase the capability of the transient voltage suppressor to sustain higher transient voltage energy.

Abstract: A kind of transient voltage suppressor structure that prevents the edge of the signal electrode from contacting with the variable impedance material by using an insulation layer to remove the point discharge existing on the edge of the signal electrode and increase the capability of the transient voltage suppressor to sustain higher transient voltage energy.

Abstract: Stack up type low capacitance overvoltage protective device is composed of a substrate; a conductive low electrode layer formed on the substrate; a voltage sensitive material layer formed on the conductive lower electrode layer; and a conductive upper electrode layer formed on the voltage sensitive material layer.

Abstract: Stack up type low capacitance overvoltage protective device is composed of a substrate; a conductive low electrode layer formed on the substrate; a voltage sensitive material layer formed on the conductive lower electrode layer; and a conductive upper electrode layer formed on the voltage sensitive material layer.