Patents by Inventor Kang-rong Chiang

Kang-rong Chiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of rapid wafer bumping
    Patent number: 6403399
    Abstract: A method for wafer bumping includes the steps of spreading a layer of an electrically conductive paste on a surface having a plurality of electrical contacts and exposing a beam-paste interaction volume to a beam of energy to bond a portion of the layer of the electrically conductive paste to at least one of the plurality of electrical contacts for forming a wafer bump.
    Type: Grant
    Filed: August 11, 2000
    Date of Patent: June 11, 2002
    Assignee: LSI Logic Corporation
    Inventors: Senol Pekin, Kang-rong Chiang