Patents by Inventor Kang Tae Seo

Kang Tae Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220065543
    Abstract: A heat exchanger according to a concept of the disclosure includes an inlet pipe, an outlet pipe, and a connecting pipe connecting a first header to a second header, to perform heat exchange while a refrigerant flows in one direction of a up direction or a down direction in the heat exchanger to thereby improve circulation of the refrigerant, wherein each of the first header and the second header includes a plurality of partitioned chambers therein to distribute the refrigerant several times according to a flow of the refrigerant passing through each chamber, thereby improving distribution and mixing of the refrigerant.
    Type: Application
    Filed: October 14, 2019
    Publication date: March 3, 2022
    Inventors: Kang Tae SEO, Young In SON
  • Patent number: 10627165
    Abstract: Disclosed herein is a heat exchanger, and more particularly to a heat exchanger having an improved refrigerant flow structure. The heat exchanger includes a plurality of tubes arranged in a first row and a second row, a first header connected to one end of the plurality of the first row tubes and a second header connected to one end of the plurality of the second row tubes, a first baffle dividing an inside of the first header into a first channel and a second channel in a vertical direction and dividing an inside of the second header into a third channel and a fourth channel in a vertical direction, an inlet pipe connected to the second channel to allow the refrigerant to flow therein, and an outlet pipe connected to the third channel to discharge the refrigerant.
    Type: Grant
    Filed: September 13, 2017
    Date of Patent: April 21, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang Tae Seo, Jeung Ku Choi, Young Min Kim, Yong-Hwa Choi, Hayase Gaku
  • Publication number: 20180073809
    Abstract: Disclosed herein is a heat exchanger, and more particularly to a heat exchanger having an improved refrigerant flow structure. The heat exchanger includes a plurality of tubes arranged in a first row and a second row, a first header connected to one end of the plurality of the first row tubes and a second header connected to one end of the plurality of the second row tubes, a first baffle dividing an inside of the first header into a first channel and a second channel in a vertical direction and dividing an inside of the second header into a third channel and a fourth channel in a vertical direction, an inlet pipe connected to the second channel to allow the refrigerant to flow therein, and an outlet pipe connected to the third channel to discharge the refrigerant.
    Type: Application
    Filed: September 13, 2017
    Publication date: March 15, 2018
    Inventors: Kang Tae Seo, Jeung Ku Choi, Young Min Kim, Yong-Hwa Choi, Hayase Gaku
  • Patent number: 9863714
    Abstract: A heat exchanger including a plurality of horizontally arranged tubes, headers to support the tubes and to enable a refrigerant to flow in the tubes, and a corrugated fin horizontally disposed between the tubes, wherein the corrugated fins includes a vertical fin body, flat contact parts formed at an upper part and a lower part of the fin body, the flat contact parts being in surface contact with a top and a bottom of the tubes, and curved contact parts extending from opposite ends of the flat contact parts, the curved contact parts being in surface contact with the sides of the tubes, the fin body includes drainage guides formed outside the flat contact parts in a lateral direction, and each drainage guide includes protruding parts protruding more upward and downward than the flat contact parts.
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: January 9, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae Seo, Yong Ki Baek, Gaku Hayase
  • Patent number: 9546824
    Abstract: A heat exchanger includes first and second heat exchanging units arranged between first and second header units, and a plurality of refrigerant circuits each defining a refrigerant path, through which refrigerant introduced into the first header unit is discharged out of the first header unit after exchanging heat in the first and second heat exchanging units.
    Type: Grant
    Filed: October 27, 2011
    Date of Patent: January 17, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku
  • Publication number: 20160209130
    Abstract: Disclosed herein is a heat exchanger according to the spirit of the present disclosure which includes an inlet pipe, an outlet pipe and a connection pipe configured to connect a first header with a second header. In the heat exchanger, since a refrigerant exchanges heat while flowing in only one of an upward direction and a downward direction, circulation of the refrigerant may be improved, and since each of the first header and the second header includes a plurality of divided chambers formed therein, and the refrigerant may be repeatedly distributed according to a flow of the refrigerant passing through each chamber, distribution and mixing of the refrigerant may be improved.
    Type: Application
    Filed: January 20, 2016
    Publication date: July 21, 2016
    Inventors: Kang Tae Seo, Young In Son, Gaku Hayase
  • Patent number: 8973647
    Abstract: A heat exchange fin in a heat exchanger is disposed between two refrigerant pipes spaced apart from each other includes a guide protrusion including first inclined planes inclined upward along opposite sides of a center line of a refrigerant pipe row in a symmetric fashion and second inclined planes inclined downward from upper ends of the first inclined planes, and the first inclined planes and the second inclined planes are provided with louver members, thereby improving heat exchange efficiency.
    Type: Grant
    Filed: October 26, 2010
    Date of Patent: March 10, 2015
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kang Tae Seo, Hayase Gaku, Young Min Kim, Dong Ho Park
  • Publication number: 20150034289
    Abstract: A heat exchanger including a plurality of horizontally arranged tubes, headers to support the tubes and to enable a refrigerant to flow in the tubes, and a corrugated fin horizontally disposed between the tubes, wherein the corrugated fins includes a vertical fin body, flat contact parts formed at an upper part and a lower part of the fin body, the flat contact parts being in surface contact with a top and a bottom of the tubes, and curved contact parts extending from opposite ends of the flat contact parts, the curved contact parts being in surface contact with the sides of the tubes, the fin body includes drainage guides formed outside the flat contact parts in a lateral direction, and each drainage guide includes protruding parts protruding more upward and downward than the flat contact parts.
    Type: Application
    Filed: July 25, 2014
    Publication date: February 5, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae SEO, Yong Ki Baek, Gaku Hayase
  • Publication number: 20140311714
    Abstract: A distribution structure of a heat exchanger includes one inlet pipe connected to a header. The heat exchanger includes a first header having a first chamber and a second chamber, a second header having a third chamber and a fourth chamber, and a plurality of tubes arranged in a plurality of rows. An inlet pipe is connected to the first chamber and an outlet pipe is connected to the second chamber. A distributer distributes the refrigerant flowing into the first chamber to the tubes of the front row, the distributor includes a first separating baffle dividing the first chamber into a mixing chamber in which the refrigerant is mixed and a supplying chamber for supplying the refrigerant to the tubes, a distribution pipe communicating the mixing chamber with the supplying chamber, and a second separating baffle dividing the supplying chamber into a plurality of independent chambers.
    Type: Application
    Filed: April 17, 2014
    Publication date: October 23, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae SEO, Yong Ki BAEK, Hayase GAKU
  • Publication number: 20140096944
    Abstract: A heat exchanger having an improved distribution structure in which one inlet pipe is connected to a header which is partitioned into a first sub-chamber in which a refrigerant flows through the inlet pipe and a second sub-chamber in which tubes communicate with each other, and a distribution pipe is installed at the header and causes the first sub-chamber and the second sub-chamber to communicate so that the refrigerant in the first sub-chamber can be distributed to the tubes. The distribution pipe can pass through and can be combined with a partitioning baffle that is combined with the header to partition a chamber of the header into the first sub-chamber and the second sub-chamber.
    Type: Application
    Filed: October 2, 2013
    Publication date: April 10, 2014
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kang Tae SEO, Yong Ki Baek, Seung Hee Ha, Hayase Gaku
  • Publication number: 20120103585
    Abstract: A heat exchanger includes first and second heat exchanging units arranged between first and second header units, and a plurality of refrigerant circuits each defining a refrigerant path, through which refrigerant introduced into the first header unit is discharged out of the first header unit after exchanging heat in the first and second heat exchanging units.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 3, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku
  • Publication number: 20120103583
    Abstract: A heat exchanger having a structure in which micro-channel tubes are respectively fitted into both sides of corresponding flat fins for heat exchange, thereby achieving enhancements in drainage and heat transfer performance. The heat exchanger includes a first header connected with an inflow tube and an outflow tube, a second header spaced apart from the first header by a desired distance and arranged parallel to the first header, a plurality of flat micro-channel tubes arranged in a front row and a rear row between the first header and the second header, and a plurality of plate type fins. Each of the micro-channel tubes includes micro-channels. Each of the fins includes slots arranged in a front row and a rear row to respectively fit the front row and rear row micro-channel tubes into the slots.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 3, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Min Kim, Hayase Gaku, Kang Tae Seo
  • Publication number: 20120103587
    Abstract: A heat exchanger includes a refrigerant pipe in which a refrigerant flows and a heat exchanger fin coupled to the outer circumference of the refrigerant pipe. The heat exchanger fin includes a plate, a protrusion protruding from the plate, slits disposed at opposite sides of the protrusion to guide air to the protrusion, and a louver unit provided at the protrusion to perform heat exchange with the air having passed through the slits.
    Type: Application
    Filed: October 24, 2011
    Publication date: May 3, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Ho Park, Hayase Gaku, Kang Tae Seo, Young Min Kim
  • Publication number: 20120103581
    Abstract: A header unit includes a body and a cover coupled to the body. The body supports outer and inner sides of the cover in a simultaneous manner. In accordance with this structure, refrigerant can flow in a heat exchanger for cooling/heating purposes requiring high operating pressure of refrigerant.
    Type: Application
    Filed: October 27, 2011
    Publication date: May 3, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae Seo, Hong Gi Cho, Hayase Gaku, Dong Hyun Kim, Yong Hwa Choi
  • Publication number: 20110120681
    Abstract: A heat exchange fin in a heat exchanger is disposed between two refrigerant pipes spaced apart from each other includes a guide protrusion including first inclined planes inclined upward along opposite sides of a center line of a refrigerant pipe row in a symmetric fashion and second inclined planes inclined downward from upper ends of the first inclined planes, and the first inclined planes and the second inclined planes are provided with rubber members, thereby improving heat exchange efficiency.
    Type: Application
    Filed: October 26, 2010
    Publication date: May 26, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kang Tae Seo, Hayase Gaku, Young Min Kim, Dong Ho Park
  • Patent number: 7013961
    Abstract: An end plate for heat exchangers, includes a plurality of bodies and a connecting part. Each of the plurality of bodies has a plurality of holes to allow a refrigerant pipe to pass through the plurality of bodies. The connecting part connects the plurality of bodies to each other, with a recess being provided on the connecting part to allow the connecting part to be easily bent. A manufacturing method includes preparing a plurality of fins arranged to provide two or more parallel rows of fin arrays, preparing an end plate provided on a side of the fin arrays to connect the fin arrays to each other, inserting a refrigerant pipe into the fin arrays and the end plate to provide an assembly including the refrigerant pipe, the fin arrays, and the end plate, and bending the assembly at a predetermined angle around the connecting part of the end plate.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: March 21, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chi Oh Song, Kang Tae Seo, Chang Bong Shin