Patents by Inventor Kang-Tsun Liu

Kang-Tsun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thin-sheet resin-coated carrier
    Publication number: 20040202834
    Abstract: A resin-coated carrier having a sheet-like base, the sheet-like base corresponding to the shape of a PC board substrate on a relatively smaller scale, and a resin of a predetermined thickness covered over one side of the sheet-like base for bonding to a PC board substrate for making a PC board without causing an overflow of the resin.
    Type: Application
    Filed: September 19, 2002
    Publication date: October 14, 2004
    Applicant: S & S Technology Corp.
    Inventors: Ching-I Yu, Lang-Ching Chih, Kang-Tsun Liu, Kung-Ming Yen
  • Resin coated carrier fabrication method and the related apparatus for the fabrication
    Publication number: 20040194695
    Abstract: A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.
    Type: Application
    Filed: April 23, 2004
    Publication date: October 7, 2004
    Applicant: ULTRATERA CORPORATION
    Inventors: Ching-I Yu, Lang-Ching Chih, Kang-Tsun Liu, Kung-Ming Yen
  • Resin coated carrier fabrication method and the related apparatus for the fabrication
    Publication number: 20040047991
    Abstract: A resin coated carrier fabrication method and the related apparatus in which a metered material feeder is controlled to apply a bonding agent to the periphery of a continuously rotated material-transferring cylinder subject to a predetermined thickness and simultaneously a tape of carrier is extended over an impression cylinder, and then a driving mechanism is controlled to adjust the gap between the material-transferring cylinder and the impression cylinder for enabling the bonding agent to be transferred to the tape of carrier, leaving a blank area around the applied layer of bonding agent on the tape of carrier.
    Type: Application
    Filed: September 11, 2002
    Publication date: March 11, 2004
    Applicant: S & S Technology Corp.
    Inventors: Ching-I Yu, Lang-Ching Chih, Kang-Tsun Liu, Kung-Ming Yen
  • Printed circuit board micro hole processing method
    Patent number: 6638438
    Abstract: A PC board micro hole processing method using plasma technique to etch the substrate of the PC board, and then using chemical etching technique to remove residual material such as glass fibers.
    Type: Grant
    Filed: October 16, 2001
    Date of Patent: October 28, 2003
    Assignee: Ulisatera Corporation
    Inventors: Ching-Hua Tsao, Jou-Yuan Tseng, Kang-Tsun Liu
  • Printed circuit board micro hole processing method
    Publication number: 20030071013
    Abstract: A PC board micro hole processing method using plasma technique to etch the substrate of the PC board, and then using chemical etching technique to remove residual material such as glass fibers.
    Type: Application
    Filed: October 16, 2001
    Publication date: April 17, 2003
    Applicant: S & S TECHNOLOGY CORPORATION
    Inventors: Ching-Hua Tsao, Jou-Yuan Tseng, Kang-Tsun Liu