Abstract: A semiconductor fabrication method includes performing a first treatment process on a substrate, inspecting the substrate using a spectroscopic system that includes a light entrance part, a light exit part, a diffraction grating, and a controllable mirror device, and performing a second treatment process of the substrate. The step of performing the inspection process includes separating incident light into a plurality of light rays each having different wavelengths, the incident light being provided to the light entrance part and diffracted at the diffraction grating, and moving the controllable mirror device to reflect a first light ray from among the plurality of light rays having a first wavelength to the light exit part.

Abstract: A method for measuring a semiconductor device is provided. A method for measuring a semiconductor device includes defining an interest area and an acceptable area in a chip area on a wafer; performing a first measurement of the chip area with a spectral imaging device to acquire spectrum data of the chip area; assuming the distribution of the spectrum data of a first pixel in the acceptable area is a normal distribution; calculating a distance from a central point on the normal distribution to second pixels in the interest area; selecting a position of a second pixel having a distance from the central point on the normal distribution greater than a predetermined range, among the second pixels, as a candidate position; and performing a second measurement of the candidate position.

Abstract: A method for measuring a semiconductor device is provided. A method for measuring a semiconductor device includes defining an interest area and an acceptable area in a chip area on a wafer; performing a first measurement of the chip area with a spectral imaging device to acquire spectrum data of the chip area; assuming the distribution of the spectrum data of a first pixel in the acceptable area is a normal distribution; calculating a distance from a central point on the normal distribution to second pixels in the interest area; selecting a position of a second pixel having a distance from the central point on the normal distribution greater than a predetermined range, among the second pixels, as a candidate position; and performing a second measurement of the candidate position.

Abstract: A surface inspecting method includes: irradiating an incident light beam of a first polarized state on a target object, the incident light beam comprising parallel light and having a cross-sectional area: measuring a second polarized state of a reflected light beam reflected from the target object; and performing inspection on an entire area of the target object on which the incident light beam is irradiated, based on a variation between the first polarized state and the second polarized state.

Abstract: An optical inspection apparatus includes a broadband light source, a monochromator, an image obtaining apparatus, and an analysis device. The monochromator is configured to convert light from the broadband light source into a plurality of monochromatic beams of different wavelengths and sequentially output the monochromatic beams, where each beam has a preset wavelength width and corresponds to one of a plurality of different wavelength regions. The image obtaining apparatus is configured to allow each monochromatic beam output from the monochromator to be incident to a top surface of an inspection target without using a beam splitter, allow light reflected by the inspection target to travel in a form of light of an infinite light source, and generate 2D images of the inspection target. The analysis device is configured to analyze the 2D images of the inspection target in the plurality of wavelength regions.

Abstract: A method for detecting an overlay error includes: forming a first overlay key including a plurality of spaced apart first target patterns having a first pitch on a first layer of a substrate; forming a second overlay key including a plurality of spaced apart second target patterns having a second pitch different than the first pitch on a second layer of the substrate below the first layer; irradiating the first layer and the second layer with incident light having a first wavelength; obtaining a phase pattern of light reflected from the first layer and the second layer; calculating a position of a peak point or a valley point of the phase pattern of the reflected light; and detecting an overlay error of the first layer and the second layer using the position of the peak point or the valley point of the phase pattern.

Abstract: A method of inspecting a substrate includes irradiating light onto a substrate that has experienced a first process, obtaining spectral data of the light reflected from the substrate, detecting a defect region of the substrate from the spectral data, and extracting a first defect site that occurred in or during the first process from the defect region. Extracting the first defect site includes establishing an effective area where the first process affects the substrate, and extracting a superimposed area that is overlapped with the effective area from the defect region. The superimposed area is defined as the first defect site.

Abstract: A method for detecting an overlay error includes: forming a first overlay key including a plurality of spaced apart first target patterns having a first pitch on a first layer of a substrate; forming a second overlay key including a plurality of spaced apart second target patterns having a second pitch different than the first pitch on a second layer of the substrate below the first layer; irradiating the first layer and the second layer with incident light having a first wavelength; obtaining a phase pattern of light reflected from the first layer and the second layer; calculating a position of a peak point or a valley point of the phase pattern of the reflected light; and detecting an overlay error of the first layer and the second layer using the position of the peak point or the valley point of the phase pattern.

Abstract: A surface inspecting method includes: irradiating an incident light beam of a first polarized state on a target object, the incident light beam comprising parallel light and having a cross-sectional area: measuring a second polarized state of a reflected light beam reflected from the target object; and performing inspection on an entire area of the target object on which the incident light beam is irradiated, based on a variation between the first polarized state and the second polarized state.

Abstract: An ellipsometer for detecting a surface including a light source irradiating a substrate with light, a polarization unit polarizing the light irradiated from the light source and analyzing the polarized light, a detector measuring a light quantity of the polarized light passing through the polarization unit, and a driver rotating the detector by an azimuth angle as the substrate rotates in a direction of the azimuth angle direction may be provided.

Abstract: An ellipsometer for detecting a surface including a light source irradiating a substrate with light, a polarization unit polarizing the light irradiated from the light source and analyzing the polarized light, a detector measuring a light quantity of the polarized light passing through the polarization unit, and a driver rotating the detector by an azimuth angle as the substrate rotates in a direction of the azimuth angle direction may be provided.

Abstract: In an embodiment of the apparatus, a transparent inkjet head includes a first plurality of nozzles, and a color inkjet head includes a second plurality of nozzles. A color value measurement unit is configured to measure color values of ink applied to a plurality of pixels based on signals applied to the second plurality of nozzles of the color inkjet head and signals applied to the first plurality of nozzles of the transparent inkjet head. A control unit is configured to compare the measured color values of the ink applied to the plurality of pixels with a target value and to change the signals applied to the first plurality of nozzles of the transparent inkjet head such that the measured color values of the ink applied to the plurality of pixels are uniform.

Abstract: According to an example embodiment, an inkjet head cleaning apparatus that removes ink residue from an inkjet head after a purging operation in a non-contact manner includes a cleaning blade and a drive unit. The cleaning blade is at a distance from a bottom of the inkjet head. The drive unit is configured to move the cleaning blade in a direction parallel to the inkjet head bottom. The cleaning blade includes a flat upper surface parallel to the inkjet head bottom, and an ink film is produced between the flat upper surface of the cleaning blade and the inkjet head bottom. The cleaning blade also includes an elongated groove longitudinally in the upper surface of the cleaning blade.

Abstract: Example embodiments are directed to an ink discharge device that discharges uniform amounts of ink droplets from an inkjet head, and a control method thereof. Voltages applied to plural nozzles of the ink-head are changed based on different characteristics of the respective nozzles to discharge uniform amounts of ink droplets from the nozzles. Voltage increments are calculated using a fixed target color value so as to set color value dispersion and voltage increments are calculated using different target color values according to the nozzles so as to satisfy color value differences between the neighboring pixels and thus time required for a DPN process is shortened, and excessive changes of the applied voltages are prevented and thus a preparatory period required to mass-produce an LCD panel is shortened and yield of the LCD panel is increased.

Abstract: In an embodiment of the apparatus, a transparent inkjet head includes a first plurality of nozzles, and a color inkjet head includes a second plurality of nozzles. A color value measurement unit is configured to measure color values of ink applied to a plurality of pixels based on signals applied to the second plurality of nozzles of the color inkjet head and signals applied to the first plurality of nozzles of the transparent inkjet head. A control unit is configured to compare the measured color values of the ink applied to the plurality of pixels with a target value and to change the signals applied to the first plurality of nozzles of the transparent inkjet head such that the measured color values of the ink applied to the plurality of pixels are uniform.

Abstract: According to an example embodiment, an inkjet head cleaning apparatus that removes ink residue from an inkjet head after a purging operation in a non-contact manner includes a cleaning blade and a drive unit. The cleaning blade is at a distance from a bottom of the inkjet head. The drive unit is configured to move the cleaning blade in a direction parallel to the inkjet head bottom. The cleaning blade includes a flat upper surface parallel to the inkjet head bottom, and an ink film is produced between the flat upper surface of the cleaning blade and the inkjet head bottom. The cleaning blade also includes an elongated groove longitudinally in the upper surface of the cleaning blade.

Abstract: Example embodiments are directed to an ink discharge device that discharges uniform amounts of ink droplets from an inkjet head, and a control method thereof. Voltages applied to plural nozzles of the ink-head are changed based on different characteristics of the respective nozzles to discharge uniform amounts of ink droplets from the nozzles. Voltage increments are calculated using a fixed target color value so as to set color value dispersion and voltage increments are calculated using different target color values according to the nozzles so as to satisfy color value differences between the neighboring pixels and thus time required for a DPN process is shortened, and excessive changes of the applied voltages are prevented and thus a preparatory period required to mass-produce an LCD panel is shortened and yield of the LCD panel is increased.