Patents by Inventor Kangbin BAE

Kangbin BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PLASMA-RESISTANT MEMBER HAVING STACKED STRUCTURE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20240026521
    Abstract: A plasma-resistant member includes a lower layer disposed on a substrate and including yttrium oxide, a buffer layer disposed on the lower layer, and an upper layer disposed on the buffer layer and including yttrium oxyfluoride or fluorine-rich yttrium oxide, wherein the buffer layer has a thermal expansion coefficient between a thermal expansion coefficient of the upper layer and a thermal expansion coefficient of the lower layer.
    Type: Application
    Filed: April 13, 2023
    Publication date: January 25, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., Korea University Research and Business Foundation
    Inventors: Inhwan LEE, Kangbin BAE