Abstract: A touch-sensitive conductive film, and a touch-sensitive assembly, a touch-sensitive display screen and an electronic device having the conductive film. The touch-sensitive conductive film comprises a sensing area and a key area. The key area is provided with a bonding area configured to bond a flexible circuit board, and a key. The key area is provided with a through-hole in a thickness direction of the touch-sensitive conductive film, and the through-hole is located at a side of the bonding area, so that the flexible circuit board is able to pass through the touch-sensitive conductive film via the through-hole. The flexible circuit board passes through the through-hole with two ends of the flexible circuit board being located at two sides of the touch-sensitive conductive film respectively, after the flexible circuit board is bonded to the touch-sensitive conductive film.

Abstract: A touch-sensitive conductive film (200), and a touch-sensitive assembly, a touch-sensitive display screen and an electronic device having the conductive film (200). The touch-sensitive conductive film (200) comprises a sensing area (210) and a key area (220). The key area (220) is provided with a bonding area (224) configured to bond a flexible circuit board (400), and a key (222). The key area (220) is provided with a through-hole (226) in a thickness direction of the touch-sensitive conductive film (200), and the through-hole (226) is located at a side of the bonding area (224), so that the flexible circuit board (400) is able to pass through the touch-sensitive conductive film (200) via the through-hole (226). The flexible circuit board (400) passes through the through-hole (226) with two ends of the flexible circuit board (400) being located at two sides of the touch-sensitive conductive film (200) respectively, after the flexible circuit board (400) is bonded to the touch-sensitive conductive film (200).

Abstract: A backlight module is disclosed. The backlight module comprises a circuit board, at least one light source disposed on the circuit board, and a positive probe-point and a negative probe-point, both provided on the circuit board. The positive and negative probe-points are electrically connected to the light source, and the positive probe-point and the negative probe-point are electrically connected with a current dividing element so that the light source is connected in parallel with the current dividing element. The positive probe-point and the negative probe-point are also collectively configured to detect an electrostatic damage of the backlight module.

Abstract: A backlight module is disclosed. The backlight module comprises a circuit board, at least one light source disposed on the circuit board, and a positive probe-point and a negative probe-point, both provided on the circuit board. The positive and negative probe-points are electrically connected to the light source, and the positive probe-point and the negative probe-point are electrically connected with a current dividing element so that the light source is connected in parallel with the current dividing element. The positive probe-point and the negative probe-point are also collectively configured to detect an electrostatic damage of the backlight module.