Abstract: A substrate includes a circuit board and a first reflective layer. The first reflective layer is disposed on the substrate. The first reflective layer has a central region and a peripheral region surrounding the central region. The first reflective layer includes at least one first buffer structure group, and an orthogonal projection of the first buffer structure group on the circuit board falls into the peripheral region. Each first buffer structure group includes a plurality of first slits spaced apart from each other, and a plurality of first slits in any first buffer structure group are disposed around the central region.

Abstract: A light-emitting substrate includes a circuit board, an electronic component, a first reflective layer and a first bonding layer. The first reflective layer includes a hollow region and a first slit group. An orthogonal projection of the electronic component on the circuit board is located within an orthogonal projection of the hollow region on the circuit board. The first slit group includes first slits arranged at intervals. A sum of a length of a first slit and a length of a connection line between the first slit and another first slit adjacent to the first slit is a first length. A ratio of the first length to a perimeter of a first closed figure is in a range of 1/4 to 1/3. The first closed figure is composed of the first slits belonging to same first slit group that are connected end to end in a clockwise or counterclockwise direction.

Abstract: A substrate includes a circuit board and a first reflective layer. The first reflective layer is disposed on the substrate. The first reflective layer has a central region and a peripheral region surrounding the central region. The first reflective layer includes at least one first buffer structure group, and an orthogonal projection of the first buffer structure group on the circuit board falls into the peripheral region. Each first buffer structure group includes a plurality of first slits spaced apart from each other, and a plurality of first slits in any first buffer structure group are disposed around the central region.

Abstract: The present disclosure discloses an unmanned aerial vehicle. The unmanned aerial vehicle includes a wing and a fuselage that are detachably connected to each other, a first protruding portion and a second protruding portion are formed at a position of the fuselage that corresponds to the wing, the first protruding portion and the second protruding portion are arranged opposite to each other, a mounting groove configured to accommodate a middle portion of the wing is formed between the first protruding portion and the second protruding portion, a mounting hole is formed on the first protruding portion and/or the second protruding portion, a pin hole is formed at a position of the middle portion of the wing that corresponds to the mounting hole, an index pin is arranged on the fuselage, the index pin is fixed on the first protruding portion and/or the second protruding portion, the index pin includes a bolt, and the bolt partially runs through the mounting hole and extends into the pin hole.

Abstract: An unmanned aerial vehicle (UAV) is disclosed by some embodiments of the present application. The UAV may include a fuselage, a wing, and a power device mounted on the fuselage to provide lift. The fuselage includes a battery compartment with an upward-facing opening and a battery interface positioned near the opening. The battery compartment has an open, upward structure, allowing the battery to be directly installed or removed without detaching a cover plate.

Abstract: A light-emitting substrate includes a substrate, a plurality of signal lines, one or more support structures and a device layer. The substrate includes a first surface. The plurality of signal lines are disposed on the first surface. The one or more support structures are disposed on the first surface. The device layer is disposed on a side of the plurality of signal lines away from the first surface. A ratio of an overlapping area of an orthographic projection of any signal line of the plurality of signal lines on the substrate and an orthographic projection of at least one support structure of the one or more support structures on the substrate to an area of the orthographic projection of the at least one support structure on the substrate is greater than or equal to zero and less than or equal to 0.1.

Abstract: A method and device for controlling a flight of an unmanned aerial vehicle (UAV) is provided. The UAV includes a fuselage, two wings, two supporting arms, two rotor wing structures, two second power modules, two third power modules, two steering modules, a lifting module, an altitude sensor, and a speed sensor. The two wings are fixed to the fuselage, the supporting arms are fixed to the wings, the rotor wing structure includes a first power module and a driving module, the driving module of the rotor wing structure is fixed to the supporting arm, and the driving module is configured to drive the first power module to rotate such that the first power module switches between the level flight mode and the lifting mode.

Abstract: An unmanned aerial vehicle (UAV) is disclosed by some embodiments of the present application. The UAV may include a fuselage, a wing, and a power device mounted on the fuselage to provide lift. The fuselage includes a battery compartment with an upward-facing opening and a battery interface positioned near the opening. The battery compartment has an open, upward structure, allowing the battery to be directly installed or removed without detaching a cover plate.

Abstract: A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein, and a light-emitting device is located in an opening. The support layer is disposed on a side of the circuit board away from the reflective layer.

Abstract: A method and an apparatus for protecting an unmanned aerial vehicle and an unmanned aerial vehicle are provided. After a positioning system of the unmanned aerial vehicle fails, a flight speed of the unmanned aerial vehicle is acquired at a time point before the positioning system fails, and then a flight state of the unmanned aerial vehicle is determined according to the flight speed, where the flight state includes a low-speed flight state and a high-speed flight state; and then a flight protection strategy of the unmanned aerial vehicle is adjusted according to the flight state. By implementing the method, after the positioning system of the unmanned aerial vehicle is in failure, explosion probability of the unmanned aerial vehicle can be reduced, and flight safety of the unmanned aerial vehicle can be improved.

Abstract: A light emitting substrate has a functional area and a bonding area. The bonding area and the functional area are arranged along a first direction in sequence. The light-emitting substrate includes a substrate, a plurality of functional element groups, and a first electrostatic pathway. The plurality of functional element groups are located on a side of the substrate and located in the functional area. The first electrostatic pathway is located on a same side of the substrate with the plurality of functional element groups. The first electrostatic pathway is electrically connected to the bonding area, a portion of the first electrostatic pathway is located in the functional area, and the first electrostatic pathway is configured to conduct static electricity from the functional area to the bonding area.

Abstract: A light-emitting substrate includes a first substrate, a reflective layer and support columns. The reflective layer is disposed on the first substrate and provided with first openings. At least for two of cross-sections, parallel to a place where the first substrate is located, of a first opening, an area of a cross-section relatively proximate to the first substrate is less than an area of a cross-section relatively away from the first substrate. The support columns are located on a side of the reflective layer away from the first substrate and fixed on the first substrate. An orthographic projection of a support column on the first substrate is a first projection, an orthographic projection a minimum cross-section of the cross-sections is a second projection, and the second projection lies within a range of the first projection.

Abstract: A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein, and a light-emitting device is located in an opening. The support layer is disposed on a side of the circuit board away from the reflective layer.

Abstract: A light emitting element includes a base substrate, light emitting structures on the base substrate, a filling layer among the light emitting structures, a connecting electrode layer, an insulating layer, and pads. The connecting electrode layer is located at a side, away from the base substrate, of the filling layer. The insulating layer is located at a side, away from the filling layer, of the connecting electrode layer. The pads are located at a side, away from the connecting electrode layer, of the insulating layer. Each light emitting structure includes a first pole and a second pole. The connecting electrode layer includes connecting electrodes each connected to the first pole or the second pole of at least one light emitting structure. The light emitting element further includes holes in the insulating layer. The pads are connected to the connecting electrodes through the holes.

Abstract: Provided are an array substrate and an electronic apparatus. The array substrate includes: a base substrate; a first conductive layer on the base substrate, where the first conductive layer includes a plurality of pads, each pad includes a first metal layer, a material of the first metal layer includes Cu, a content of the Cu is greater than or equal to 99%, and a thickness of the first metal layer is greater than 2 ?m; and an electronic element disposed on a side of the first conductive layer facing away from the base substrate, where the electronic element includes an electronic element body and a plurality of pins disposed on a side of the electronic element body facing the base substrate, and the pins are connected with the pads.

Abstract: The embodiments is an unmanned aerial vehicle. The unmanned aerial vehicle includes: an airframe; and a fixed-wing assembly and a rotor assembly, both replaceably connected to the airframe. The fixed-wing assembly is connected to the airframe to form a vertical take-off and landing fixed-wing unmanned aerial vehicle and the rotor assembly is connected to the airframe to form a multi-rotor unmanned aerial vehicle, thereby implementing an unmanned aerial vehicle that can switch between the vertical take-off and landing fixed-wing unmanned aerial vehicle and the multi-rotor unmanned aerial vehicle.

Abstract: The present disclosure provides a method and an apparatus for detecting and positioning an inspection target, a device, and a storage medium.

Abstract: The present disclosure provides a method, apparatus and device for detecting and positioning an inspection target and a storage medium. The method includes: detecting a first inspection target and a first geographical position of the first inspection target in a target inspection sub-area of an inspection device, the target inspection sub-area being a sub-area inspected by the inspection device during a process of performing an inspection task; and displaying the first inspection target at the first geographical position in an inspection map. In this technical solution, there is no need for a user to monitor an inspection screen in real time.

Abstract: A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein, and a light-emitting device is located in an opening. The support layer is disposed on a side of the circuit board away from the reflective layer.

Abstract: A substrate includes a circuit board and a first reflective layer. The first reflective layer is disposed on the substrate. The first reflective layer has a central region and a peripheral region surrounding the central region. The first reflective layer includes at least one first buffer structure group, and orthogonal projection of the first buffer structure group on the circuit board falls into the peripheral region. Each first barrier structure group includes a plurality of first slits spaced apart from each other, and a plurality of first slits in any first buffer structure group are disposed around the central region.