Patents by Inventor Kang-Min JEON

Kang-Min JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma processing apparatus and method of fabricating semiconductor device using same
    Patent number: 11538660
    Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: December 27, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoong Chung, Nam Kyun Kim, Naohiko Okunishi, Kyung-Sun Kim, Seung Bo Shim, Sang-Ho Lee, Kang Min Jeon
  • PLASMA PROCESSING APPARATUS AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING SAME
    Publication number: 20220139669
    Abstract: A plasma processing apparatus includes; a chamber, a lower electrode disposed within the chamber and including a lower surface and an opposing upper surface configured to seat a wafer, an RF rod disposed on the lower surface of the lower electrode and extending in a vertical direction. The RF plate includes a first portion contacting the lower surface of the lower electrode, a second portion protruding from the first portion towards the RF rod, and a third portion extending from the second portion to connect the RF rod. A grounding electrode is spaced apart from the RF plate and at least partially surrounds a side wall of the RF rod and a side wall of the second portion of the RF plate. The grounding electrode includes a first grounding electrode facing each of the side wall of the RF rod and the second portion of the RF plate, and a second grounding electrode at least partially surrounding the first grounding electrode, and configured to horizontally rotate.
    Type: Application
    Filed: April 27, 2021
    Publication date: May 5, 2022
    Inventors: YOONG CHUNG, NAM KYUN KIM, NAOHIKO OKUNISHI, KYUNG-SUN KIM, SEUNG BO SHIM, SANG-HO LEE, KANG MIN JEON
  • UPPER ELECTRODE FOR PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING APPARATUS HAVING THE SAME
    Publication number: 20170178868
    Abstract: An upper electrode for a plasma processing apparatus includes a body portion having a plurality of through-holes, a showerhead disposed below the body portion and having a plurality of jet holes connected to the plurality of through-holes, and a buffer layer interposed between the body portion and the showerhead.
    Type: Application
    Filed: August 26, 2016
    Publication date: June 22, 2017
    Inventors: Seong Moon HA, Kyung Sun KIM, Kang Min JEON
  • APPARATUS FOR SENSING OPTICAL SIGNALS AND APPARATUS FOR REMOTE- CONTROLLING USING OPTICAL SIGNALS
    Publication number: 20100014100
    Abstract: There are provided an apparatus for sensing optical signals and a system for remote-controlling using optical signals.
    Type: Application
    Filed: July 17, 2009
    Publication date: January 21, 2010
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Min-Yang YANG, Kang-Min JEON, Hong-Seok YOUN, Seong-Beom KIM