Patents by Inventor Kangsheng Lin

Kangsheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096577
    Abstract: A temperature fuse assembly for a high-power DC circuit is provided. The temperature fuse assembly includes a case extending from a first case end to a second case end and an isolated lead projecting from the second case end. A bushing electrically isolates the isolated lead from the case. A high-gauge wire is electrically connected to the case at a first wire end and electrically connected to the isolated lead at a second wire end. A portion of the high-gauge wire is helically wound about an exterior of the bushing. When a temperature of the temperature fuse assembly exceeds a threshold temperature, the temperature fuse assembly is configured to conduct a DC current of the high-power DC circuit through the high-gauge wire. The high-gauge wire is configured to melt under a load of the DC current and interrupt the high-power DC circuit.
    Type: Application
    Filed: September 15, 2023
    Publication date: March 21, 2024
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Changcai ZHAO, Lijuan HUANG, Wei SHI, Kangsheng LIN, Guojun XIAO, Rong GUAN, Xiang GONG, Qiang ZHAO
  • Publication number: 20230420210
    Abstract: The present disclosure relates to thermal cutoff device pellet composition. Provided is a pellet composition having enhanced aging performance, electrical performance, pellet output, pellet density and pellet crush strength for use in a thermally-actuated, current cutoff device. The solid thermal pellet composition comprises an organic compound having a low vapor pressure at room temperature, such as tetraphenylsilane. The thermal pellet composition comprising tetraphenylsilane can significantly improve interruption performance, pellet output, pellet density, pellet crush strength and aging performance of the thermal cutoff device.
    Type: Application
    Filed: June 9, 2023
    Publication date: December 28, 2023
    Applicant: Therm-O-Disc, Incorporated
    Inventors: Changcai ZHAO, Wei SHI, Guojun XIAO, Rong Guan, Qiang Zhao, Xinping Shi, Kangsheng Lin