Abstract: The present invention relates to a pharmaceutical composition containing ?-lapachone as an active ingredient for prevention or treatment of cholestatic liver disease, and can provide agents for effectively preventing and treating cholestatic liver disease.

Abstract: A display includes: a display panel; and a panel bottom sheet disposed below the display panel, the panel bottom sheet including: a first heat dissipation layer; a second heat dissipation layer over the first heat dissipation layer, including a first opening formed completely through the second heat dissipation layer in a thickness direction; a heat dissipation coupling interlayer between the first heat dissipation layer and the second heat dissipation layer, and a heat dissipation substrate on the second heat dissipation layer.

Abstract: A method of supporting divided screen areas and a mobile terminal employing the same are disclosed. The method includes: generating input signals for one of sequentially and simultaneously activating a plurality of user functions; activating the user functions according to generated input signals; dividing a screen into divided screen areas that correspond to activated user functions; and outputting functional view areas associated with the activated user functions to the corresponding divided screen areas.

Abstract: A microelectronic fabrication system that includes a service area, a process area in the service area where microelectronic devices are processed, and a transfer area in the service area where microelectronic devices are transferred to and from the process area, is cleaned by maintaining higher pressure in the process area than in the transfer area, to thereby reduce particle flow from the transfer area to the process area. It has been found that conventional microelectronic fabrication system cleaning methods and systems can allow air to flow backward to the wafer process area. By allowing backward flow of air to the wafer process area, air may be induced from a place where a lower degree of cleanliness is maintained to a place where a higher degree of cleanliness should be maintained. Due to the backward flow of air, particles contained in the transfer area, that may be generated by the transfer system, may flow onto the wafer that is being processed in the process area.