Abstract: Disclosed is a method of processing a substrate. The method includes: a first etching operation of rotating a substrate having a first film and a second film and etching the second film by supplying an etchant to the substrate; and after the first etching operation, a second etching operation of etching the second film by supplying the etchant to the rotating substrate, in which a second temperature, which is a temperature for etching the second film in the second etching operation, is lower than a first temperature for etching the second film in the first etching operation.

Abstract: Disclosed is a method of processing a substrate. The method includes: an etchant supply operation of rotating a substrate on which a first film and a second film are formed and supplying an etchant for etching the first film onto the substrate; and a puddle operation of stopping the supply of the etchant, forming a puddle made of the etchant on the substrate, and selectively etching the first film with respect to the second film by the puddle, in which the puddle is a liquid film made of the etchant, and a temperature of the puddle is adjusted in the puddle operation.

Abstract: The present invention relates to a treatment liquid discharge assembly and a treatment liquid discharge method, and the treatment liquid discharge assembly includes a drain manifold connected to at least one discharge line of the substrate treatment apparatus and configured to define a predetermined accommodation space to temporarily accommodate a treatment liquid, and a drain pipe connected to a bottom surface of the accommodation space, in which the drain pipe defines a level difference with a predetermined height in the accommodation space of the drain manifold, and the drain pipe protrudes by the predetermined height from a bottom surface of the accommodation space toward an upper side of the accommodation space to define a buffer space in which the treatment liquid.

Abstract: Provided are a substrate treating method and a substrate treating apparatus. The substrate treating method includes: a treating operation of discharging a treatment liquid onto a substrate through a nozzle and treating the substrate with the treatment liquid; a moving operation of stopping the discharge of the treatment liquid and moving the nozzle to a homeport where the nozzle waits; a cleaning operation of cleaning the nozzle with a cleaning liquid in the homeport; and a discharging operation of discharging the treatment liquid from the nozzle into the homeport. Accordingly, it is possible to efficiently remove foreign substances remaining on a surface and the inside of the nozzle.

Abstract: Disclosed is a method of processing a substrate, the method including: a fluid supply operation of supplying fluid to a lower surface of a rotating substrate; a treatment solution supply operation of supplying a treatment solution containing a polymer and a volatile solvent to an upper surface of the rotating substrate; after the treatment solution supply operation, a liquid film forming operation of forming a liquid film of the treatment solution by volatilizing the volatile solvent in the treatment solution and solidifying or curing the treatment solution; and after the liquid film forming operation, a liquid film removing operation of removing the liquid film of the treatment solution by supplying a removal solution to the substrate, in which the fluid supply operation, the supply of the fluid starts before the liquid film forming operation.

Abstract: Provided is a substrate treating apparatus including a treating module, in which the treating module includes: a polishing treatment unit for polishing a substrate with a polishing pad; a cleaning treatment unit for cleaning the substrate by supplying a treatment liquid to the substrate; and a transfer chamber in which a transfer robot transferring the substrate is placed, a liquid treating chamber is provided in the cleaning treatment unit, the liquid treating chamber includes: a support unit for supporting and rotating the substrate; a treatment liquid supply nozzle for supplying a treatment liquid containing a polymer and a volatile solvent onto the substrate; a first removal liquid supply nozzle for supplying a first removal liquid onto the substrate; and a second removal liquid supply nozzle for supplying a second removal liquid onto the substrate.

Abstract: The present invention provides a substrate treating apparatus, including: a treatment container having a treatment space therein; a support unit for supporting and rotating the substrate in the treatment space; and a liquid supply unit for supplying a liquid onto the substrate, in which wherein the support unit includes: a body on which the substrate is seated; and a support shaft coupled to the body, and an upper surface of the body is provided with a central portion including a center of the body and an edge portion surrounding the central portion, and a vacuum hole is formed in the central portion, and a groove is formed in the edge portion.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.

Abstract: Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.

Abstract: A liquid supply apparatus is provided.

Abstract: Disclosed is a method of treating a substrate, the method including: a liquid treatment operation of treating a substrate by supplying a treatment solution to a rotating substrate to form a liquid film on the substrate; after the liquid treatment operation, a gas treatment operation of discharging gas to the substrate and removing an upper layer of the liquid film from the substrate; and after the gas treatment operation, a liquid film removal operation of removing a lower layer in the liquid film on the substrate.

Abstract: Disclosed is a method of processing a substrate, the method including: a coating operation of supplying a coating liquid containing a volatile component to a top surface of the substrate to form a cleaning film; and a cleaning film processing operation of processing the cleaning film, in which the cleaning film processing operation includes: a crack formation operation of generating a crack in the cleaning film formed on the substrate to form film flakes; and a delamination operation of delaminating the film flakes from the top surface of the substrate by volatilizing the volatile component contained in the film flake.

Abstract: A substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate, and supplying a rinse liquid onto the substrate may be provided.

Abstract: The present invention relates to a treatment liquid discharge assembly and a treatment liquid discharge method, and the treatment liquid discharge assembly includes a drain manifold connected to at least one discharge line of the substrate treatment apparatus and configured to define a predetermined accommodation space to temporarily accommodate a treatment liquid, and a drain pipe connected to a bottom surface of the accommodation space, in which the drain pipe defines a level difference with a predetermined height in the accommodation space of the drain manifold, and the drain pipe protrudes by the predetermined height from a bottom surface of the accommodation space toward an upper side of the accommodation space to define a buffer space in which the treatment liquid.

Abstract: Provided is a substrate processing apparatus and substrate processing method capable of allowing a liquid chemical to penetrate deeply into patterns of a substrate, the substrate processing apparatus including a housing for forming a treatment space where a substrate is processed, a substrate supporter mounted in the treatment space to rotate about a rotational axis, and provided to support the substrate, a liquid chemical supplier provided above the substrate supporter to eject a liquid chemical toward an upper surface of the substrate supported by the substrate supporter, and an ejector provided at a side of the treatment space to eject a heat transfer medium with a temperature different from the temperature of the liquid chemical onto the substrate.

Abstract: A liquid supply apparatus is provided.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.

Abstract: Disclosed are a substrate processing apparatus that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a housing having a processing space defined therein in which a substrate is processed; a substrate support installed in the processing space so as to be rotatable about a rotation axis and configured to support the substrate; a chemical liquid supply disposed on top of the substrate support and configured to spray a chemical liquid toward an upper surface of the substrate supported on the substrate support; and a controller configured to repeatedly apply a first rotation control signal and a second rotation control signal indicating different rotation speeds to the substrate support so as to generate an inertial behavior of the chemical liquid coated on the substrate.

Abstract: There are provided a substrate treating apparatus and a substrate treating method. The substrate treating apparatus includes: a stage on which a substrate is seated, in a chamber; and a treatment liquid supply apparatus supplying a treatment liquid containing a solvent and a solute onto the substrate, wherein the treatment liquid supply apparatus supplies the treatment liquid onto the substrate while moving from a center of the substrate to an outer peripheral surface of the substrate.

Abstract: An exemplary embodiment of the present invention provides a substrate treating method including removing particles formed on a substrate by continuously performing a process of supplying a treatment liquid including a polymer and a solvent onto the substrate, forming a solidified liquid film by volatilizing the solvent in the treatment liquid, removing the solidified liquid film from the substrate by supplying a stripping liquid onto the substrate; and supplying a rinse liquid onto the substrate.