Abstract: A method for manufacturing a semiconductor device includes a resin sealing step for sealing a semiconductor chip with a resin material in a state where the semiconductor chip is bonded on a lead frame in which a depressed portion is formed, a laser light irradiation step for irradiating the depressed portion with laser light to remove the resin material in the depressed portion by the laser light so that a part of the resin material remains in the depressed portion, and a cutting step for cutting a bottom face of the depressed portion in the lead frame together with the part of the resin material in the depressed portion.

Abstract: A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multiple-irradiated region of the lead frame, and the multiple-irradiated region prevents the laser light emitted to the back surface from reaching portions of the resin material on the front surface of the lead frame, the portions being located at a position corresponding to the corner regions.

Abstract: A cutting device includes: an imaging module for capturing first marks and third marks, to produce primary image data; and a control module for aligning, by a conveyance mechanism, a cutting jig and an object to be cut that is placed on the cutting jig. The control module compares first positional information including positional information of a specific first mark stored or first positional information with third positional information to calculate a primary displacement amount showing a relative positional displacement between a plurality of cutting grooves and the plurality of third marks, respectively. The conveyance mechanism picks up the object from the cutting jig, and the conveyance mechanism and the cutting jig are moved relative to each other based on the primary displacement amount, to move the object by the primary displacement amount to a primary target position. The cutting mechanism cuts the object along a plurality of cutting lines.

Abstract: A cutting device includes: an imaging module for capturing first marks and third marks, to produce primary image data; and a control module for aligning, by a conveyance mechanism, a cutting jig and an object to be cut that is placed on the cutting jig. The control module compares first positional information including positional information of a specific first mark stored or first positional information with third positional information to calculate a primary displacement amount showing a relative positional displacement between a plurality of cutting grooves and the plurality of third marks, respectively. The conveyance mechanism picks up the object from the cutting jig, and the conveyance mechanism and the cutting jig are moved relative to each other based on the primary displacement amount, to move the object by the primary displacement amount to a primary target position. The cutting mechanism cuts the object along a plurality of cutting lines.