Abstract: This invention relates to a method of soldering electronic components for a printed circuit board by dipping the printed circuit board into a molten solder inside a soldering bath. When the printed circuit board is dipped into the molten solder inside the soldering bath, it is dipped together with a member that attracts the molten solder, and when the printed circuit board is pulled up from the molten solder, it is pulled up while the edge of the member keeps contact with a solder connection portion of the printed circuit board. After the printed circuit board is pulled from the molten solder, the edge of the member is separated from the printed circuit board to remove any excessive solder adhering to the connection portion by the surface tension of the solder.

Abstract: Method and system of detecting a configuration of a three-dimensional object, in which use is made of a spot beam to be directed to the object. The spot beam is caused to scan the object in a horizontal direction and the resulting spot image is detected through observation in a direction transverse to the horizontal direction. The system includes a laser light source, two Fourier transformation lenses having their Fourier transformation planes intersecting each other on the optical axes of the lenses on a light deflector, a photoelectric converter provided on the object plane of one of the lenses, the laser light source being disposed on the same meridian as the converter, and at least one reflecting mirror provided for forming a real image of the spot of the beam on the object.

Abstract: A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head.