Abstract: Provided is a more appropriate method of producing lithium sulfide having high ionic conductivity and no by-products generated. The method of producing lithium sulfide includes a temperature rising step (Step S14) of reducing lithium sulfate fed into a furnace in a state of heating to a temperature of more than 700° C. under an atmosphere of a reduced pressure of 0.05 MPa or less.

Abstract: In production of a solid electrolyte member, the amount or kinds of sulfides used as raw materials are reduced. A method of producing a solid electrolyte member is a method of producing a solid electrolyte member based on sulfide, the method including: a preparation step (S10) of preparing an aggregate of starting materials, in which the starting materials include elemental sulfur, and a non-sulfide raw material that is at least one of an element as an elemental substance other than sulfur that constitutes the solid electrolyte member, and a compound of elements other than sulfur that constitute the solid electrolyte member; and a forming step (S12) of heating the aggregate of starting materials to form the solid electrolyte member. The non-sulfide raw material contains no elements other than elements except sulfur that constitute the solid electrolyte member, except inevitable impurities.

Abstract: A method for producing lithium sulfide includes: a preparation process (step S12) at which a raw material and a reducing agent are charged into a furnace, the raw material being mainly composed of lithium sulfate having a property of weight loss of 5% or more to 25% or less upon heating to 120° C.; and a temperature raising process (step S14) at which the raw material and the reducing agent are heated in the furnace to raise the temperature.

Abstract: The present invention is directed to an Sn—Ag—Cu-based solder powder which comprises solder powder having an average particle size of 5 ?m or less, and a dried material of a solution of hydroxybenzoic acid or an ester thereof having a melting point of 250° C. or lower being attached onto a surface of the solder powder as an additive, wherein the additive is preferably salicylic acid, ethyl 3,4-dihydroxybenzoate or ethyl 3,5-dihydroxybenzoate, an attached amount of the additive is preferably 0.01 to 1.0 part by mass based on 100 parts by mass of the total amount of the components of tin, silver and copper contained in the solder powder, a content of the silver is 0.1 to 10% by mass when the total amount of the components of tin, silver and copper is made 100% by mass, a content of the copper is 0.1 to 2.0% by mass when the total amount of the components of tin, silver and copper is made 100% by mass, and a remainder being tin.

Abstract: An object and a problem of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin(II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin(II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25° C. and stirred, then the powder dissolves therein within 180 seconds.

Abstract: An object of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Sn2+ ion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step (11) of preparing an aqueous acidic solution containing Sn2+ ions, Step (12) of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step (13) of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step (14) of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step (15) of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step (16) of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution.

Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

Abstract: In solder powder having an average particle size of 5 ?m or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.

Abstract: An object and a problem of the present invention is to provide tin (II) oxide powder which has extremely high solubility in an acid or an acidic plating solution and excellent in storage stability in the air. The tin (II) oxide powder of the present invention is for replenishing a tin component of a tin-alloy plating solution, and comprises 100 to 5000 ppm of an antioxidant being contained in the powder with a mass ratio, and has such a dissolution rate that when 0.1 g of the tin (II) oxide powder is added to 100 ml of 100 g/L aqueous alkylsulfonic acid solution at a temperature of 25° C. and stirred, then the powder dissolves therein within 180 seconds.

Abstract: An object of the present invention is to provide tin(II) oxide powder which has extremely high solubility in an acid or an acidic plating solution, excellent in storage stability in the air and can heighten oxidation-preventive effect of Sn2+ ion in the plating solution. The method for manufacturing tin(II) oxide powder of the present invention comprises Step (11) of preparing an aqueous acidic solution containing Sn2+ ions, Step (12) of neutralizing the aqueous acidic solution by adding an aqueous alkaline solution to prepare a slurry of tin(II) hydroxide, Step (13) of dehydrating the prepared slurry to obtain a slurry of tin(II) oxide, Step (14) of separating the slurry of tin(II) oxide into a solid and a liquid to obtain tin(II) oxide, Step (15) of treating the obtained tin(II) oxide with an aqueous antioxidant solution, and Step (16) of vacuum drying the tin(II) oxide treated with the aqueous antioxidant solution.

Abstract: A method for producing fine silver particles which is characterized by making an aqueous silver ammine complex solution and a reducing agent solution come in contact with each other in an open space to reduce the silver ammine complex and deposit fine silver particles, either in which the contacting is conducted by (i) a method of spraying an aqueous silver ammine complex solution and a reducing agent solution through nozzles or (ii) a method of discharging an aqueous silver ammine complex solution and a reducing agent solution from obliquely downward nozzles opposite to each other to thereby produce fine silver particles which are free from coarse particles having particle sizes of 5 ?m or more and have a mean particle size of primary particles of 0.08 to 1.0 ?m and crystallite sizes of 20 to 150 nm or in which an aqueous silver ammine complex solution having a silver concentration of 20 to 180 g/L and an organic reducing agent solution having a reducing agent concentration of about 0.6 to about 1.