Patents by Inventor Kanji Shimo-Ohsako
Kanji Shimo-Ohsako has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8313831Abstract: The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 ?m to 1 ?m measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.Type: GrantFiled: December 12, 2003Date of Patent: November 20, 2012Assignee: Kaneka CorporationInventors: Shigeru Tanaka, Takashi Itoh, Masaru Nishinaka, Kanji Shimo-Ohsako, Mutsuaki Murakami
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Publication number: 20080312383Abstract: A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.Type: ApplicationFiled: February 19, 2008Publication date: December 18, 2008Applicant: Kaneka CorporationInventors: Shigeru Tanaka, Kanji Shimo-Ohsako, Takashi Itoh, Mutsuaki Murakami
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Patent number: 7115681Abstract: The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.Type: GrantFiled: July 8, 2002Date of Patent: October 3, 2006Assignee: Kaneka CorporationInventors: Kanji Shimo-Ohsako, Takashi Itoh, Masaru Nishinaka, Shigeru Tanaka, Mutsuaki Murakami
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Patent number: 7101619Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.Type: GrantFiled: May 20, 2005Date of Patent: September 5, 2006Assignee: Kaneka CorporationInventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako
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Publication number: 20060115670Abstract: The present invention provides a laminate having a two-layer or three-layer structure including a non-thermoplastic polyimide film and a thermoplastic polyimide layer provided on one or both of the surfaces thereof, the surface of the thermoplastic polyimide layer being surface-treated; a laminate including a polymer film and a layer provided on one or both of the surfaces thereof, the layer including a polyimide resin composition comprising a polyimide resin with a specified structure and a thermosetting component; and a resin film and a laminate including the same which provided one, at least, of surface having a Ra1 value of arithmetic mean roughness of 0.05 ?m to 1 ?m measured with a cutoff value of 0.002 mm, and a Ra1/Ra2 ratio of 0.4 to 1, Ra2 being a value measured with a cutoff value of 0.1 mm. These laminates can provide a printed circuit board with excellent adhesiveness, on which a micro-wiring circuit can be formed.Type: ApplicationFiled: December 12, 2003Publication date: June 1, 2006Inventors: Shigeru Tanaka, Takashi Itoh, Masaru Nishinaka, Kanji Shimo-Ohsako, Mutsuaki Murakami
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Publication number: 20050221080Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.Type: ApplicationFiled: May 20, 2005Publication date: October 6, 2005Inventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako
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Patent number: 6911265Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 ?m.Type: GrantFiled: October 26, 2001Date of Patent: June 28, 2005Assignee: Kaneka CorporationInventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako
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Publication number: 20050119381Abstract: A thermosetting resin composition of the present invention includes (A) a polyimide resin, and as thermosetting components, at least one of (B) a multifunctional cynate ester and (C) an epoxy resin. The (A) polyimide resin is soluble polyimide obtained by reacting, with diamines, acid dianhydride including an ether bond. As (B) the multifunctional cynate esters, a compound having a specific structure, and/or an oligomer thereof is used. As (C) the epoxy resin, an epoxy resin having a dicyclopentadiene bone structure and/or an alkoxy-group-including silane denatured epoxy resin (suitable epoxy resin) is preferably used.Type: ApplicationFiled: March 6, 2003Publication date: June 2, 2005Inventors: Shigeru Tanaka, Kanji Shimo-Ohsako, Takashi Itoh, Mutsuaki Murakami
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Publication number: 20040231141Abstract: A laminate is prepared by forming metal layer A on one face of a polymer film by dry plating method. When circuit is formed by using the laminate according to the semi-additive method, a high-density printed wiring board having excellent circuit shape, insulating property between the circuits and adhesion with the substrate can be obtained. By forming an adhesive layer on the other side of the polymer film of the laminate, an interlayer adhesive film is prepared. By thermally fusing or curing the adhesive layer after laminating the interlayer adhesive film on the inner layer circuit board, a multi-layer printed wiring board can be prepared. When preparing the circuit board by etching the first metal coating, an etchant which selectively etches the first metal coating is preferably used.Type: ApplicationFiled: January 5, 2004Publication date: November 25, 2004Inventors: Masaru Nishinaka, Kanji Shimo-Ohsako, Takashi Itoh, Mutsuaki Murakami
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Publication number: 20040176526Abstract: The present invention provides a resin composition comprising a polyimide containing particular dianhydride and diamine, and an epoxy resin. The resin composition can be bonded at a relatively low temperature, has excellent heat resistance, adhesion property, soldering heat resistance and retaining ratio of peeling strength after PCT. By forming a circuit using the polyimide resin sheet or the polyimide resin sheet with metal foil, which comprises the resin composition, according to the semi-additive method, a printed wiring board having a good wiring shape, firm adhesion of circuit and high insulating resistance in the microcircuit space can be obtained.Type: ApplicationFiled: January 5, 2004Publication date: September 9, 2004Inventors: Kanji Shimo-Ohsako, Takashi Itoh, Masaru Nishinaka, Shigeru Tanaka, Mutsuaki Murakami
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Publication number: 20030113521Abstract: The present invention provides a laminate used for a printed wiring substrate and a multilayer printed wiring board which have high heat resistance, wiring patterns with narrow pitches, vias with a small diameter, insulating layer having uniform thickness and stable adhesion between the metal layer and the synthetic resin film, and which contribute to miniaturization, high capability and functional improvement of electronic equipment. The present invention relates to a metal laminate comprising a metal layer laminated on one or both faces of a synthetic resin film, wherein the metal layer is a metal foil having a thickness of at most 5 &mgr;m.Type: ApplicationFiled: October 28, 2002Publication date: June 19, 2003Inventors: Masaru Nishinaka, Takashi Itoh, Kanji Shimo-Ohsako