Patents by Inventor Kanzi Murakami

Kanzi Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for production of printed circuits by electroless metal plating
    Patent number: 4293592
    Abstract: A method is provided for producing printed circuits by electroless deposition of metal on an insulating substrate to form a circuit film which comprises contacting an insulating substrate having initiator on a negative pattern of a thermo-setting resin whose activity for deposition of initiator for electroless metal plating is substantially reduced and on a positive pattern for circuit with an aqueous solution of an organic acid and hydrochloric acid and/or nitric acid before electroless plating the positive pattern by immersing the substrate in an electroless metal plating solution to substantially dissolve and remove the initiator on the surface of said negative pattern.
    Type: Grant
    Filed: December 6, 1976
    Date of Patent: October 6, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Hirosada Morishita, Mineo Kawamoto, Kanzi Murakami