Patents by Inventor Kao Hsin CHEN

Kao Hsin CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230187367
    Abstract: An electronic package structure includes a lower circuit pattern structure, an upper circuit pattern structure, a reflowable material and at least one core element. The upper circuit pattern structure is disposed above the lower circuit pattern structure. The reflowable material is disposed between the upper circuit pattern structure and the lower circuit pattern structure. The core element attaches to the reflowable material and is configured to inhibit displacement of the at least one core element during a reflow process.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Kao Hsin CHEN