Patents by Inventor Kao-Ping Lo

Kao-Ping Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778773
    Abstract: A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: October 3, 2023
    Assignee: PHIHONG TECHNOLOGY CO., LTD.
    Inventor: Kao-Ping Lo
  • Publication number: 20220394857
    Abstract: A method for forming a silicon carbide module integrated structure includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.
    Type: Application
    Filed: August 15, 2022
    Publication date: December 8, 2022
    Inventor: Kao Ping Lo
  • Publication number: 20220192052
    Abstract: A choke structure with water cooling includes a water-cooled device, a choke assembly mounted on the water-cooled device, a ceramic heat spreader with high thermal conductivity set between the choke assembly and the water-cooled device, a metal housing having upper and lower openings installed on the water-cooled device to surround the choke assembly and the ceramic heat spreader with high thermal conductivity, and a printed circuit board is arranged on the upper opening of the metal housing, wherein the generated heat while operating the choke assembly is transmitted through a first heat conduction path formed by the ceramic heat spreader with high thermal conductivity in contact with the choke assembly and the water-cooled device for dissipating heat.
    Type: Application
    Filed: March 11, 2021
    Publication date: June 16, 2022
    Inventor: Kao-Ping LO
  • Publication number: 20210296201
    Abstract: A silicon carbide module integrated with a heat sink includes a heat sink and a silicon carbide module, which is fixedly connected with the heat sink. The solder paste is arranged between the heat sink and the silicon carbide module, and the heat sink and the silicon carbide module are hot pressed through a welding process to weld the silicon carbide module and the heat sink together.
    Type: Application
    Filed: May 7, 2020
    Publication date: September 23, 2021
    Inventor: Kao Ping Lo
  • Publication number: 20040012730
    Abstract: A liquid crystal display (LCD) light guide is provided for use in a portable electronic device. The electronic device contains electronic components, a ground pad, an electrically conductive sponge, an LCD module, a light guide, and a light source. The light guide includes a translucent plate having a metallic reflector disposed on one face. The light guide provides illumination to an LCD module and simultaneously acts as a shield against electrostatic discharge and electromagnetic radiation.
    Type: Application
    Filed: July 17, 2002
    Publication date: January 22, 2004
    Inventors: Long-Jyh Pan, Kao-Ping Lo