Abstract: In a chip type capacitor formed by attaching a seat plate to a capacitor, generation of voids or cracks due to flux gas generated at the time of soldering is suppressed. When providing auxiliary terminals for increasing the soldering strength on a seat plate for chipping, which enables a lead same direction type capacitor to be surface mounted, a gas release groove, preferably formed as a slit to release flux gas generated at the time of soldering, is formed on each of the auxiliary terminals.

Abstract: An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, and a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.

Abstract: An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, and a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.

Abstract: An aluminum electrolytic capacitor includes a capacitor element having lead terminals; an armor case housing the capacitor element; and a rubber seal having a terminal passage hole for the lead terminals drilled therein and mounted on an opening section of the armor case. A hole diameter of a lead wire passage hole is smaller than an outside diameter of an outside lead wire, a conical guide surface of progressively smaller diameter is formed between a round bar mating hole and the lead wire passage hole within a terminal passage hole. A passage guide part of progressively smaller diameter from a lead wire body is integrally furnished at an end of the outside lead wire so as to have a smaller diameter than the hole diameter of the lead wire passage hole, forming a conical sloped surface having a predetermined angle on a peripheral surface of the passage guide part.

Abstract: A lead terminal is passed through a terminal passage hole of a rubber seal, without imposing an excessive burden such that the characteristics of the capacitor element would be degraded, and while maintaining a state of reliable isolation from the outside air. In an aluminum electrolytic capacitor in which the hole diameter f2 of a lead wire passage hole (52) is smaller than the outside diameter f1 of an outside lead wire (22), the outside lead wire (22) being forcibly passed to the outside through lead wire passage hole (52), a conical guide surface (53) of progressively smaller diameter is formed between a round bar mating hole (51) and the lead wire passage hole (52) within a terminal passage hole (5).

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) an epoxy resin, (B) an imidazole compound, and (C) a maleimide compound, a semiconductor device encapsulated by the liquid epoxy resin composition, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and a semiconductor die. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.

Abstract: A liquid epoxy resin composition for semiconductor encapsulation comprising: (A) at least one epoxy resin, (B) at least one curing accelerator and (C) at least one acid anhydride terminated polyamic acid, and an assembly in which a cured material of the liquid epoxy resin is positioned between a printed circuit substrate and semiconductor die. The liquid epoxy resin composition provides a cured material that has an excellent adhesiveness to a semiconductor chip surface and has an excellent moisture resistance.