Abstract: Provided is a light-emitting device having a plurality of light-emitting elements with high operation stability and light extraction efficiency. The light-emitting device includes: a light-emitting element; a translucent member which is disposed on the light-emitting element and has a columnar first portion having a bottom surface opposed to an upper surface of the light-emitting element, a second portion formed continuously with the first portion on the first portion and narrowed upward, and a columnar third portion formed continuously with the second portion on the second portion; and a reflective member configured to cover the side surfaces of the translucent member. In this light-emitting device, the height of the first portion of the translucent member in a direction perpendicular to the bottom surface thereof is ? or more the height of the translucent member in the direction perpendicular to the bottom surface.

Abstract: To improve light emission efficiency and suppress color unevenness on a light emitting surface. Provided is a semiconductor light emitting device including a light emitting element, a wavelength conversion layer for converting light emitted from the light emitting element to light having a predetermined wavelength, a light reflection member covering at least the side surfaces of the wavelength conversion layer, and a thin film provided on the outermost surface from which the light wavelength-converted by the wavelength conversion layer exits, having a property for shedding the uncured light reflection member, and having a coarse surface.

Abstract: A light-emitting device having light-emitting elements with high operation stability and light extraction efficiency is provided. The light-emitting device includes: a substrate; light-emitting elements aligned and arranged on the substrate in an arrangement direction; wavelength conversion layers each disposed on each of the light-emitting elements with a light-transmitting adhesive interposed therebetween, each of the wavelength conversion layers having an upper surface smaller than a bottom surface, and a side surface shape in which a length in a lateral direction parallel to the bottom surface and perpendicular to the arrangement direction decreases from the bottom surface toward the upper surface; a light-transmitting plate disposed over the wavelength conversion layers; and a reflective resin covering side surfaces of the light-emitting elements, the wavelength conversion layers, and the light-transmitting plate.

Abstract: Provided is a light-emitting device having a plurality of light-emitting elements with high operation stability and light extraction efficiency. The light-emitting device includes: a light-emitting element; a translucent member which is disposed on the light-emitting element and has a columnar first portion having a bottom surface opposed to an upper surface of the light-emitting element, a second portion formed continuously with the first portion on the first portion and narrowed upward, and a columnar third portion formed continuously with the second portion on the second portion; and a reflective member configured to cover the side surfaces of the translucent member. In this light-emitting device, the height of the first portion of the translucent member in a direction perpendicular to the bottom surface thereof is ? or more the height of the translucent member in the direction perpendicular to the bottom surface.

Abstract: A semiconductor light-emitting apparatus is constructed by a wiring substrate, at least one semiconductor light-emitting element provided on the wiring substrate, at least one wavelength-converting member provided on the semiconductor light-emitting element, and a light reflection adjusting member directly covering a sidewall of the semiconductor light-emitting element and a sidewall of the wavelength-converting member. The light reflection adjusting member is formed of gray resin including light reflecting fillers and light absorbing fillers for visible light.

Abstract: A high-quality semiconductor light emitting device is provided, which include: a semiconductor light emitting element; and a light transmitting member disposed on or above the semiconductor light emitting element and including a wavelength conversion material at least in part. The light transmitting member includes: a first portion having side surfaces all being a vertical surface; a second portion disposed on the first portion and including an inclined surface on at least part of the side surfaces; and a third portion disposed on the second portion and having side surfaces all being a vertical surface. The third portion has an upper surface of which a size is smaller than a size of a lower surface of the first portion.

Abstract: A method for manufacturing a semiconductor light-emitting apparatus includes: forming multiple eutectic material layers on multiple first electrode patterns, respectively, of a wiring substrate; mounting multiple semiconductor light-emitting elements on the multiple eutectic material layers, respectively; mounting a plate on the multiple semiconductor light-emitting elements via multiple eutectic temperature liquid layers, respectively, the multiple eutectic temperature liquid layers maintaining a liquid state even at a eutectic temperature of the multiple eutectic material layers; and heating and cooling the multiple eutectic material layers and the multiple temperature liquid layers while the plate is adhered via the multiple eutectic temperature liquid layers to the multiple semiconductor light-emitting elements by the surface tension phenomenon.

Abstract: A semiconductor light-emitting apparatus is constructed by a wiring substrate, at least one semiconductor light-emitting element provided on the wiring substrate, at least one wavelength-converting member provided on the semiconductor light-emitting element, and a light reflection adjusting member directly covering a sidewall of the semiconductor light-emitting element and a sidewall of the wavelength-converting member. The light reflection adjusting member is formed of gray resin including light reflecting fillers and light absorbing fillers for visible light.

Abstract: A light-emitting device having light-emitting elements with high operation stability and light extraction efficiency is provided. The light-emitting device includes: a substrate; light-emitting elements aligned and arranged on the substrate in an arrangement direction; wavelength conversion layers each disposed on each of the light-emitting elements with a light-transmitting adhesive interposed therebetween, each of the wavelength conversion layers having an upper surface smaller than a bottom surface, and a side surface shape in which a length in a lateral direction parallel to the bottom surface and perpendicular to the arrangement direction decreases from the bottom surface toward the upper surface; a light-transmitting plate disposed over the wavelength conversion layers; and a reflective resin covering side surfaces of the light-emitting elements, the wavelength conversion layers, and the light-transmitting plate.

Abstract: A semiconductor light-emitting apparatus includes: a wiring substrate; multiple semiconductor light-emitting elements mounted via multiple eutectic layers, respectively, on the wiring substrate; and a wavelength-converting plate via multiple transparent adhesive layers on upper surfaces of the semiconductor light-emitting elements, respectively. A standard deviation of thicknesses of the transparent adhesive layers is smaller than a standard deviation of thicknesses of the eutectic layers.

Abstract: A high-quality semiconductor light emitting device is provided, which include: a semiconductor light emitting element; and a light transmitting member disposed on or above the semiconductor light emitting element and including a wavelength conversion material at least in part. The light transmitting member includes: a first portion having side surfaces all being a vertical surface; a second portion disposed on the first portion and including an inclined surface on at least part of the side surfaces; and a third portion disposed on the second portion and having side surfaces all being a vertical surface. The third portion has an upper surface of which a size is smaller than a size of a lower surface of the first portion.

Abstract: To improve light emission efficiency and suppress color unevenness on a light emitting surface. Provided is a semiconductor light emitting device including a light emitting element, a wavelength conversion layer for converting light emitted from the light emitting element to light having a predetermined wavelength, a light reflection member covering at least the side surfaces of the wavelength conversion layer, and a thin film provided on the outermost surface from which the light wavelength-converted by the wavelength conversion layer exits, having a property for shedding the uncured light reflection member, and having a coarse surface.

Abstract: Methods for manufacturing semiconductor light-emitting devices and semiconductor light-emitting devices having a high radiating performance and can include a metallic laminate substrate, a semiconductor light-emitting chip and a transparent resin. The metallic laminate substrate can include a cavity so as to be able to accurately mount the light-emitting chip, and also can structures to efficiently radiate heat generated from the light-emitting chip. The transparent resin to encapsulate the semiconductor light-emitting chip in the cavity can include various wavelength converting materials. Additionally, the light-emitting devices can be manufactured in manufacturing processes similar to conventional light-emitting devices.

Abstract: Methods for manufacturing semiconductor light-emitting devices and semiconductor light-emitting devices having a high radiating performance and can include a metallic laminate substrate, a semiconductor light-emitting chip and a transparent resin. The metallic laminate substrate can include a cavity so as to be able to accurately mount the light-emitting chip, and also can structures to efficiently radiate heat generated from the light-emitting chip. The transparent resin to encapsulate the semiconductor light-emitting chip in the cavity can include various wavelength converting materials. Additionally, the light-emitting devices can be manufactured in manufacturing processes similar to conventional light-emitting devices.

Abstract: A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.

Abstract: A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.

Abstract: A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.

Abstract: A light emitting device comprises a substrate having a plurality of light emitting elements mounted thereon; a side wall structure having a partition wall portion separating a plurality of light emitting areas that each include at least one of the light emitting elements; and encapsulating resin filled in the light emitting areas to bury the light emitting elements therein. The side wall structure is separated by a space from the substrate at, at least, the partition wall portion so as to be in noncontact with the substrate, and the encapsulating resin is formed so as to integrally, continuously fill the light emitting areas and the space without producing any interface therein.

Abstract: A semiconductor light emitting device can be configured to maintain high luminance and to suppress the possibility of the occurrence of wire breakage with high quality and reliability. A method for producing such a semiconductor light emitting device with a high process yield is also disclosed. The semiconductor light emitting device can include a sealing member into which a reflective filler can be mixed in such an amount (concentration) range that luminous flux with a predetermined amount can be maintained and the possibility of the occurrence of wire breakage can be lowered. Various sealing members containing a reflective filler with a plurality of concentrations within this range can be prepared in advance.

Abstract: A semiconductor light emitting device and method of manufacturing the same can provide a light source that has less variation in color and brightness and can reduce radiation of light that is possibly harmful to humans. The device can include a casing that has a first cavity having an oblique surface with a reflective surface formed thereon and a second cavity having an almost vertical side. A reflective frame having an oblique surface with a third reflective surface formed thereon can be formed on the casing. A semiconductor light emitting element can be mounted on the bottom in the first cavity. A first resin composed of a light-transmissive resin can be filled in the first cavity and then cured. Further, a second resin containing a fluorescent material dispersed in a light-transmissive resin can be filled in the second cavity and then cured while the casing is turned upside down to form a high-density fluorescent material layer near the surface of the second resin.