Patents by Inventor Kaoru Hamaura

Kaoru Hamaura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10879086
    Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 29, 2020
    Assignee: EBARA CORPORATION
    Inventors: Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Mitsuru Miyazaki, Koji Maruyama
  • Publication number: 20180308716
    Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.
    Type: Application
    Filed: June 26, 2018
    Publication date: October 25, 2018
    Inventors: Takeshi SAKURAI, Eiji HIRAI, Kaoru HAMAURA, Mitsuru MIYAZAKI, Koji MARUYAMA
  • Patent number: 10032655
    Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: July 24, 2018
    Assignee: EBARA CORPORATION
    Inventors: Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Mitsuru Miyazaki, Koji Maruyama
  • Patent number: 9919403
    Abstract: When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: March 20, 2018
    Assignee: Ebara Corporation
    Inventors: Kaoru Hamaura, Takeshi Sakurai, Suguru Ogura
  • Patent number: 9855638
    Abstract: A dressing apparatus capable of bringing an overall dressing surface of a dresser into uniform sliding contact with a polishing surface of a polishing pad and capable of uniformly dressing the overall polishing surface of the polishing pad is disclosed. The dressing apparatus includes a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate, a dresser shaft that applies a load to the dresser, at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, and an operation controller configured to control operation of the load-applying device.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: January 2, 2018
    Assignee: Ebara Corporation
    Inventors: Satoshi Nagai, Suguru Ogura, Kaoru Hamaura
  • Publication number: 20150118944
    Abstract: The work of replacing a polishing pad is easily performed, and thermal damage is prevented from occurring in a polishing table. A polishing apparatus 100 includes a polishing table 110 having an attachment surface 110a to which a polishing pad 108 used to polish a substrate 102 is attached. The polishing apparatus 100 also includes a silicone layer 111 provided on the attachment surface 110a of the polishing table 110 and interposed between the polishing table 110 and the polishing pad 108. By interposing the silicone layer 111, it is possible to easily detach and attach the polishing pad 108. In addition, since a heat treatment for coating the silicone layer 111 on the polishing table 110 is performed at a relatively low temperature, it is possible to prevent thermal damage from occurring in the polishing table 110 due to the heat treatment.
    Type: Application
    Filed: January 29, 2014
    Publication date: April 30, 2015
    Inventors: Ryuichi Kosuge, Tadakazu Sone, Soichi Isobe, Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Suguru Ogura
  • Publication number: 20150020851
    Abstract: A substrate cleaning device 1 includes a substrate holding unit 10 configured to hold a substrate W, a first cleaning unit 11 having a first cleaning member 11a caused to come into contact with a first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, a second cleaning unit 12 having a second cleaning member 12a caused to come into contact with the first surface WA of the substrate W held by the substrate holding unit 10 to clean the first surface WA, and a controller 50 configured to control the first and second cleaning units 11, 12 so that, when any one of the first cleaning member 11a and the second cleaning member 12a cleans the first surface WA of the substrate W held by the substrate holding unit 10, the other cleaning member is at a position apart from the substrate W held by the substrate holding unit 10.
    Type: Application
    Filed: July 17, 2014
    Publication date: January 22, 2015
    Inventors: Takeshi Sakurai, Eiji Hirai, Kaoru Hamaura, Mitsuru Miyazaki, Koji Maruyama
  • Publication number: 20150004886
    Abstract: When a polishing pad is attached to a polishing table, the polishing pad can be easily positioned on and attached to the polishing table and air pockets are prevented from forming. As a position guide member 130 is inserted into a guide hole 109 with an attachment surface of a polishing pad 108 downward, the polishing pad 108 is positioned on and attached to a polishing table 110. At this time, the guide hole 109 of the polishing pad 108 is guided by the position guide member 130 and the polishing pad 108 is easily positioned so as to match the upper surface of the polishing table 110 with the outer periphery thereof. Then, as release paper is gradually peeled off from a rear surface of the polishing pad 108, the portion where the release paper is peeled off is attached to the polishing table 110.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 1, 2015
    Inventors: Kaoru HAMAURA, Takeshi SAKURAI, Suguru OGURA
  • Publication number: 20140349552
    Abstract: A dressing apparatus capable of bringing an overall dressing surface of a dresser into uniform sliding contact with a polishing surface of a polishing pad and capable of uniformly dressing the overall polishing surface of the polishing pad is disclosed. The dressing apparatus includes a dresser configured to rub against a polishing surface to dress the polishing surface that is used for polishing a substrate, a dresser shaft that applies a load to the dresser, at least one load-applying device configured to apply a downward load to a part of a peripheral portion of the dresser, and an operation controller configured to control operation of the load-applying device.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 27, 2014
    Inventors: Satoshi Nagai, Suguru Ogura, Kaoru Hamaura