Abstract: A head-up display includes a display panel, a reflective optical element, a controller, and an obtainer. The display panel displays a first image. The reflective optical element reflects image light from the first image displayed by the display panel. The controller controls a position at which the first image is displayed on the display panel. The obtainer obtains, as positional information, a position of an eye of a user. The controller changes the position at which the first image is displayed on the display panel in accordance with the positional information.

Abstract: A multilayer wiring board includes an insulating layers stacked on one another, lands formed on an upper surface part of the multilayer wiring board, and a differential transmission line formed on or in each of the insulating layer. An electronic component is mounted on the lands. The differential transmission line is constituted of a pair of signal lines which extend from the lands toward a signal receiving end. Each of the signal lines is provided with an open stub which extends in a stacking direction of the insulating layers, and has a same width as a width of the signal lines, one end of the open stub being connected to a corresponding one of the signal lines, and another end of the open stub being open.

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract: The conductive material comprises a first metal material having a melting point of not more than 250° C. and a second metal material having a melting point of not less than 500° C., and is paste at a temperature not more than 250° C. Whereby the conductive material can have much higher conductivity than the resin paste. The conductive material can be used in paste, whereby the conductive material can be buried in the via-hole in the same way as the resin paste.

Abstract: In a method of manufacturing piezoelectric ceramics by molding pre-fired or calcined powders of ingredients of a piezoelectric ceramic material and sintering the powder mold at a high pressure, the powder mold is pre-sintered at an atmospheric pressure before sintering at high pressure (HIP). Preferably, after the sintering HIP step, a thermal treatment is performed at a temperature of from 500 to 1000.degree. C. under an oxidizing atmosphere. For a Pb(Zn.sub.1/3 Nb.sub.2/3)O.sub.3 --PbTiO.sub.3 based piezoelectric ceramic, the composition is preferably set to (Pb.sub.1-x Ba.sub.x)[(Zn.sub.1/3 Nb.sub.2/3).sub.1-y Ti.sub.y ]O.sub.3, where 0.001<x<0.055 and 0.05<y<0.20.

Abstract: A bump forming step forms a predetermined number of bumps on at least a first one of two components. A height measuring step measures the heights of the predetermined number of bumps. A fixing step fixes the two components together by means of the bumps with the distance between the two components determined, using the result of the height measurement, so that all of the predetermined number of bumps should come in contact with the second one of the two components. An oxide-film removing step removes the oxide film formed on the predetermined number of bumps after the height measuring step and before the fixing step. The fixing step comprises a press fixing step for press fixing the two components at the above distance by means of a press fixing method, and a melting step for causing the bumps to melt in a predetermined atmosphere so that the bumps firmly join the two components together. The distance is established by at least one of the press fixing step and the melting step.

Abstract: A first contact member comprises a liquid conductor which comes into contact with a second contact member so as to establish the electric connection between the two contact members. A container contains the first contact member therein. The second contact member is pin-shaped. The container is tube-shaped and has a containing portion, which is filled with the liquid conductor, and has an opening through which the second contact member is inserted. An area contraction portion for contracting the cross sectional area of the container is formed at a position between the containing portion and the opening. The container is installed in a through hole provided in a base member. The container includes a pipe member of an electric conductor which comes into direct contact with the liquid conductor and a plug member to be inserted into the hole, before the pipe member is inserted, for preventing the liquid conductor from escaping from the container. The container is formed of elastic material.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: A first contact member comprises a liquid conductor which comes into contact with a second contact member so as to establish the electric connection between the two contact members. A container contains the first contact member therein. The second contact member is pin-shaped. The container is tube-shaped and has a containing portion, which is filled with the liquid conductor, and has an opening through which the second contact member is inserted. An area contraction portion for contracting the cross sectional area of the container is formed at a position between the containing portion and the opening. The container is installed in a through hole provided in a base member. The container includes a pipe member of an electric conductor which comes into direct contact with the liquid conductor and a plug member to be inserted into the hole, before the pipe member is inserted, for preventing the liquid conductor from escaping from the container. The container is formed of elastic material.

Abstract: Metal such as solder is immersed in a heating medium containing a rosin or derivative thereof and an organic solvent and heated to a temperature above the melting point of the metal, to remove the oxide film of the metal and make the metal spherical. If a hardened caster oil or high softening point rosin or derivative thereof is further added as a thickener to the heating medium, the size increase of the metal particle can be prevented. By heating at a temperature lower than the melting point of the metal, the oxide film can be removed without making the particles spherical. Using thus obtained solder particles, fluxless soldering can be done. Also, a fluxless soldering method is provided.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and the terminals are electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: An electrical connecting device including a first circuit board providing thereon with input/output terminals, each of the terminals having a tip surface coated with gallium and a second circuit board providing thereon with contact terminals, each of the terminals having a tip surface coated with indium or tin. A low-melting point alloy layer is formed by a mutual action between gallium and indium or tin, when the input/output terminals of the first circuit board are in contact with the respective terminals of the second circuit board and electrically connected to each other. The second metal layer includes a plurality of wire-like metal supports extending substantially perpendicular to the surface of the terminal and a low-melting point metal retained by the wire-like metal supports.

Abstract: An electrical connecting method connects a first contact of a first object to a second contact of a second object. The electrical connecting method includes the steps of coating a Ga system liquid metal on at least one of the first and second contacts, where the Ga system liquid metal includes a predetermined weight percent of Bi, and contacting the first contact to the second contact via the Ga system liquid metal. The predetermined weight percent of Bi is selected such that the liquid state of the Ga system liquid metal is maintained when the first and second contacts make contact via the Ga system liquid metal.

Abstract: A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

Abstract: A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.

Abstract: In the production of a hollow FRP article such as a wood type carbon black golf club head, a hollow resin shell is formed via blow molding, heat-resistant fine particles are filled as a filler into the interior of the resin shell, the interior of the resin shell is decompressed to form an inner mold, the inner mold is covered with FRP prepreg including thermoplastic resin to form a prepreg composite, the prepreg composite is heated in a metallic mold under pressure and the fine articles are removed after demolding. A golf club shaft is formed by heating a mandrel, applying thermoplastic resin powder to the mandrel and then winding a lamellar prepreg around the mandrel to thereby form a hollow shaft. A golf club is formed from a head and shaft formed as described above by enlarging the end of the shaft, placing the shaft and the head in a mold and heating the mold under pressure.

Abstract: An image processing system having operating and stand-by modes of operation which are to be selectively put into effect, including a plurality of slave data processors each operative to execute a set of predetermined functions assigned thereto, a master data processor for controlling the operation of each data processor, the master data processor being operative to output a data processing command requesting any of the slave data processors to execute any of the predetermined functions assigned to the slave data processor and a control command predominant over the communication of data dictating the operation of each slave data processor, and an interface bus providing connection between the master data processor and each slave data processor for allowing transmission therethrough of the data processing command and the control command to any of the slave data processors, the master data processor being operative to detect a state in which the master data processor is currently coupled to any one of the slave