Abstract: A method for forming a pattern, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n?2) are formed on a support, includes forming a first resist layer on the support surface; and repeating: forming a guide hole through a kth resist layer by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, removing the kth resist layer, and forming a (k+1)th resist layer on the support and all pattern materials, regarding kth (k=1 to n?1) pattern material and resist layer in order of k=1 to n?1; forming a guide hole and nth pattern material filling similarly, and removing the nth resist layer.

Abstract: Provided are a varnish for porous polyimide film production, providing an unburned composite film that is less likely to have a sea-island structure, and a method for producing a porous polyimide film using the same. The varnish according to the present invention comprises a resin including polyamide acid and/or polyimide, fine particles, and a solvent, and has a fine particle content of not less than 65% by volume relative to the total of the resin and the fine particles and a viscosity at 25° C. of not less than 550 mPa·s. Preferably, the varnish further comprises a dispersant. The method for producing a porous polyimide film according to the present invention comprises: forming an unburned composite film using the varnish; burning the unburned composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Abstract: Provided is a method for producing a porous polyimide film with which it is possible to suppress the occurrence of curling in the polyimide-fine particle composite film obtained by firing the unfired composite film. The method for producing a porous polyimide film of the present invention includes, in the following order: forming an unfired composite film using a varnish that contains a resin including polyamide acid and/or polyimide, fine particles, and a solvent; immersing the unfired composite film in a solvent including water; firing the unfired composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Abstract: A nonaqueous secondary battery which can be made thinner without deterioration of battery performance, and a method for manufacturing the battery. The nonaqueous secondary battery includes a positive electrode and a negative electrode which are substantially arranged in the same plane so that respective end surfaces face each other at a distance; a substrate by which the positive electrode and the negative electrode are affixed and supported; a cover member having gas barrier properties, which defines an airtight chamber together with the substrate, in the chamber in which the positive electrode and the negative electrode are contained; and an electrolyte which is contained in the airtight chamber so as to be positioned at least between the facing end surfaces of the positive electrode and the negative electrode, and which relates to the battery reaction between the positive electrode and the negative electrode.

Abstract: Provided are a varnish for porous polyimide film production, providing an unburned composite film that is less likely to have a sea-island structure, and a method for producing a porous polyimide film using the same. The varnish according to the present invention comprises a resin including polyamide acid and/or polyimide, fine particles, and a solvent, and has a fine particle content of not less than 65% by volume relative to the total of the resin and the fine particles and a viscosity at 25° C. of not less than 550 mPa·s. Preferably, the varnish further comprises a dispersant. The method for producing a porous polyimide film according to the present invention comprises: forming an unburned composite film using the varnish; burning the unburned composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Abstract: Provided is a method for producing a porous polyimide film with which it is possible to suppress the occurrence of curling in the polyimide-fine particle composite film obtained by firing the unfired composite film. The method for producing a porous polyimide film of the present invention includes, in the following order: forming an unfired composite film using a varnish that contains a resin including polyamide acid and/or polyimide, fine particles, and a solvent; immersing the unfired composite film in a solvent including water; firing the unfired composite film to obtain a polyimide-fine particle composite film; and removing the fine particles from the polyimide-fine particle composite film.

Abstract: According to one embodiment, an electronic apparatus includes a hardware processor and a memory connected to the hardware processor. The hardware processor is configured to determine whether the electronic apparatus is vulnerable, shut down the electronic apparatus if the electronic apparatus is determined as vulnerable, and the electronic apparatus executes a first operation, and lock the electronic apparatus to prohibit startup of the electronic apparatus in a Basic Input Output System (BIOS) which runs on the electronic apparatus.

Abstract: First, there is provided a crystal growth control agent which is capable of suppressing an increase in a crystal size of a p-type semiconductor, and performing chemical modification on a surface of p-type semiconductor microparticle. Second, there is provided a composition for forming a hole transport layer which is capable of prompting crystallization and fine pulverization of the p-type semiconductor and performing the chemical modification on the surface of the p-type semiconductor microparticle even in the case where an organic salt (an ionic liquid) containing an anion other than the thiocyanate ion is used. According to the present invention, the crystal growth control agent contains at least one of sulfur-containing compounds (except for thiocyanate) selected from the group consisting of a compound, which generates a thiolate anion due to dissociation of a proton or a cation, and a disulfide compound, and controls crystal growth of a p-type semiconductor.

Abstract: A method for forming a pattern multiple patterns of identical or different pattern materials can be formed on a support in a short time, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n?2) are formed on a support, includes forming a first resist layer on the support surface; repeating: forming a guide hole through all resist layers by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, and forming a (k+1)th resist layer on the kth resist layer and the pattern materials, regarding kth (k=1 to n?1) pattern material and resist layer in order of k=1 to n?1; performing guide hole formation and nth pattern material filling similarly, and removing all of the resist layers.

Abstract: A nonaqueous secondary battery which can be made thinner without deterioration of battery performance, and a method for manufacturing the battery. The nonaqueous secondary battery includes a positive electrode and a negative electrode which are substantially arranged in the same plane so that respective end surfaces face each other at a distance; a substrate by which the positive electrode and the negative electrode are affixed and supported; a cover member having gas barrier properties, which defines an airtight chamber together with the substrate, in the chamber in which the positive electrode and the negative electrode are contained; and an electrolyte which is contained in the airtight chamber so as to be positioned at least between the facing end surfaces of the positive electrode and the negative electrode, and which relates to the battery reaction between the positive electrode and the negative electrode.

Abstract: An object of the present invention is to provide a negative electrode for a lithium ion secondary battery, capable of obtaining a lithium ion secondary battery which is excellent in initial charge characteristics and is also excellent in charge/discharge cycle characteristics, and a method for producing the same, as well as a lithium ion secondary battery comprising the negative electrode for a lithium ion secondary battery. A negative electrode for a lithium ion secondary battery according to the present invention comprises a current collector layer, and a negative electrode active material layer composed of a tin structure, the tin structure includes a plurality of protrusions which protrude approximately perpendicularly to a main surface of the current collector layer, and a cross-sectional area of the tip portion parallel to the main surface of the current collector layer of the protrusion is smaller than that of the base end portion.

Abstract: A method for forming a pattern multiple patterns of identical or different pattern materials can be formed on a support in a short time, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n?2) are formed on a support, includes forming a first resist layer on the support surface; repeating: forming a guide hole through all resist layers by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, and forming a (k+1)th resist layer on the kth resist layer and the pattern materials, regarding kth (k=1 to n?1) pattern material and resist layer in order of k=1 to n?1; performing guide hole formation and nth pattern material filling similarly, and removing all of the resist layers.

Abstract: A method for forming a pattern, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n?2) are formed on a support, includes forming a first resist layer on the support surface; and repeating: forming a guide hole through a kth resist layer by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, removing the kth resist layer, and forming a (k+1)th resist layer on the support and all pattern materials, regarding kth (k=1 to n?1) pattern material and resist layer in order of k=1 to n?1; forming a guide hole and nth pattern material filling similarly, and removing the nth resist layer.

Abstract: According to one embodiment, an electronic device includes: a display; a touch panel configured to detect a position on a display region of the display; a connection module configured to be connected to a device comprising a keyboard module, and a controller configured to deactivate a position detection function on the touch panel when the device is connected to the connection module and to activate the position detection function on the touch panel when the device is not connected to the connection module.

Abstract: This process for producing a resist pattern is a process for producing a resist pattern including: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type negative photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to the photoresist laminate, and the step of developing the (c) photoresist layer together with the (b) inorganic substance layer to form a resist pattern.

Abstract: This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.

Abstract: This process for producing a resist pattern includes: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type positive photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to said photoresist laminate, and the step of developing said (c) photoresist layer together with said (b) inorganic substance layer to form a resist pattern.

Abstract: There is provided a developer composition which can from a good thick-film resist pattern and is less likely to cause frothing. This composition is a developer composition used to form a thick-film resist pattern on a substrate, and contains an organic quaternary ammonium base as a main component, an anionic surfactant represented by the following general formula (I), and a defoaming agent selected from the group consisting of a silicone-based defoaming agent, an alcohol-based defoaming agent and a nonionic surfactant-based defoaming agent: R1 in the formula (I) represents an alkyl or alkoxy group having 5 to 18 carbon atoms; “a” represents 1 or 2; R2 and R3 independently represent an ammonium sulfonate group, a substituted ammonium sulfonate group, or a group represented by the following general formula (II); “b” represents an integer of 0 or 1 to 3; and “c” represents an integer of 1 to 3; and —SO3M??(II) wherein M in the formula (II) represents a metal atom.

Abstract: This process for producing a resist pattern is a process for producing a resist pattern including: the step of laminating (a) a support having an upper surface on which copper exists, (b) an inorganic substance layer consisting of an inorganic substance supplied from an inorganic substance source, and (c) a photoresist layer consisting of a chemically amplified type negative photoresist composition, to obtain a photoresist laminate, the step of selectively irradiating active light or radioactive rays to the photoresist laminate, and the step of developing the (c) photoresist layer together with the (b) inorganic substance layer to form a resist pattern.