Patents by Inventor Kaoru IWASA

Kaoru IWASA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermoplastic resin composition for wire-coating and heat resistant wire
    Patent number: 11512194
    Abstract: The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: November 29, 2022
    Assignee: RIKEN TECHNOS CORPORATION
    Inventors: Kaoru Iwasa, Shinichi Kishimoto
  • THERMOPLASTIC RESIN COMPOSITION FOR WIRE-COATING AND HEAT RESISTANT WIRE
    Publication number: 20200369865
    Abstract: The invention provides a thermoplastic resin composition having (A) a thermoplastic polymer comprising (a1) 5 mass % to less than 50 mass % of a propylene polymer having a melting point of 150° C. or higher, (a2) 10 mass % to less than 60 mass % of an ethylene polymer, (a3) 5 mass % to less than 50 mass % of, for example, a hydrogenated product of a block copolymer of an aromatic vinyl compound and a conjugated diene compound, and (a4) 1 mass % to less than 30 mass % of, for example, an unsaturated carboxylic acid-modified olefin polymer; (B) a softener for nonaromatic rubbers; (C) a metal hydrate; (D) an organic peroxide; (E) an antioxidant; and (F) a coupling agent.
    Type: Application
    Filed: August 8, 2017
    Publication date: November 26, 2020
    Applicant: RIKEN TECHNOS CORPORATION
    Inventors: Kaoru IWASA, Shinichi KISHIMOTO