Abstract: Provided are a shape inspection device, a processing device, a height image processing method, and a height image processing program capable of accurately inspecting a measurement object. A profile data generation unit sequentially generates a plurality of pieces of profile data as the measurement object relatively moves in a Y-axis direction. A height image generation unit extracts characteristic points for the respective pieces of profile data, and moves the respective pieces of profile data in a plane intersecting with a Y axis such that the extracted characteristic points are aligned in a line in a direction corresponding to the Y axis. Then, the height image generation unit arranges the moved profile data in a direction corresponding to the Y axis to correct a height image.

Abstract: A non-crystalline ether-imide type high purity bismaleimide composition represented by formula (I): ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 each represent a hydrogen atom, a halogen atom, or an alkyl group having from 1 to 4 carbon atoms; R.sup.5 represents a hydrogen atom or a methyl group; and R.sup.6 represents a hydrogen atom, a methyl group or a phenyl group. The non-crystalline bismaleimide (I) has a purity of 95 wt % or higher, a melting point of not higher than 130.degree. C., and exhibits excellent solubility in a solvent.

Abstract: A heat resistant composite film is described, which comprises (I) a thermoplastic film and (II) a cured layer of a thermosetting resin composition comprising (A) 100 parts by weight of an aliphatic diamine having a spiroacetal ring, (B) from 5 to 150 parts by weight of an ester derived from maleic acid and an alcohol represented by formula (I), and (C) from 20 to 250 parts by weight of an ester derived from a tetracarboxylic acid and an alcohol represented by formula (I),R.sup.1 --(OR.sup.2).sub.n --OH (I)wherein R.sup.1 represents an alkyl group having from 1 to 4 carbon atoms; R.sup.2 represents an alkylene group having from 2 to 4 carbon atoms; and n represents 0 or an integer of from 1 to 3. The composite film is resistant to temperatures of 150.degree. C. or higher while exhibiting flexibility.

Abstract: A process for producing an allyl-substituted phenol compound is described, which comprises a combination of a first step in which a phenol is reacted with an allyl halide in the presence of an alkaline aqueous medium to allyl-etherify the phenol and a second step in which the reaction product obtained in the first step and containing the allyl-etherified phenol is subjected to a Claisen rearangement reaction in the absence of a medium. Also, a compound obtained by the above process is described.

Abstract: A polyalkenylphenol compound represented by formula (I): ##STR1## wherein R represents a hydrogen atom or a methyl group; X represents a hydrogen atom or a halogen atom; and n represents 0 or an integer of from 1 to 10. The compound is useful as a curing agent for epoxy resins or maleimide resins or a starting material for epoxy resins.

Abstract: A process for producing a polyglycidyl ether which comprises reacting a mixture of 4-oxy-3-methoxybenzaldehyde and 4-oxybenzaldehyde in the molar ratio of 5/95 to 95/5 with pentaerythritol to give a bisphenol having a spiroacetal ring, and further reacting the bisphenol with epihalohydrin or .beta.-methylepihalohydrin is disclosed. The polyglycidyl ether obtained has excellent solubility in solvents, and the cured product obtained therefrom has excellent elongation, modulus of elasticity, impact resistance, and heat resistance.

Abstract: A process for producing a polymaleimide which comprises reacting an aromatic dialdehyde with 2 to 60 moles, per mole of the aromatic dialdehyde, of aromatic amine represented by the formula (I): ##STR1## wherein X is a hydrogen atom, a halogen atom or an alkyl or alkoxy group each having 1 to 4 carbon atoms to obtain a polyamine, reacting the polyamine with maleic anhydride to obtain a polyamide acid, and dehydration-cyclizing the polyamide acid to obtain a polymaleimide.

Abstract: 1. An epoxy resin composition is described, comprising(1) a mixture of epoxides of Components (A), (B) and (C)Component (A):20 to 60 wt % of an epoxy compound having a spiroacetal ring represented by the formula: ##STR1## Component (B): 10 to 50 wt % of a brominated epoxy resinComponent (C):10 to 50 wt % of an epoxy resin selected from the group consisting of diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, novolac type epoxy resins and N,N,O-triglycidyl-aminophenol type epoxy resins, and(2) a hardening agent.

Abstract: A curable epoxy resin composition of substantially improved curing time and high temperature properties comprising a polyepoxide of the formula: ##STR1## wherein R is H or an alkyl of up to about 18 carbon atoms, X is H or halogen, Y is an alkyl of up to about 18 carbon atoms or methoxy, Z' is H or CH.sub.3, m is an integer of not less than 1, n is an integer of up to 2, and from about 25 to about 120 parts by weight, per 100 parts by weight of the polyepoxide, of an epoxy resin hardener.

Abstract: An epoxy resin curing agent comprising a compound represented by the formula (I): ##STR1## wherein k, m and n, which may be the same or different, each is an integer of 1 to 6, and l is an integer of 0 to 6, and/or a modified product thereof, a curable epoxy resin composition comprising an epoxy resin and the epoxy resin curing agent represented by the formula (I), and a cured product obtained from the epoxy resin composition.