Abstract: A rotary heat exchanger includes: a tubular-shaped heat transfer tubular body (3) which is rotatable with a central axis (C) as a rotation center, which allows a first medium (11) to flow therein, and outside of which a second medium (12) having a temperature different from a temperature of the first medium (11) flows; a central member (2) which is provided on an inner side of the heat transfer tubular body (3) in a radial direction and which is fixed coaxially with the heat transfer tubular body (3); and an outer sliding contact member (6) which is in sliding contact with an outer circumferential surface of the heat transfer tubular body (3), and the heat transfer tubular body (3) is rotatably supported with respect to the central member (2) via bearings (17, 18) disposed at two end portions of the central member (2) in an axial direction.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1), wherein a content of the compound is 10% by mass or less based on the total amount of the electrolytic solution, wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a nitrogen atom.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a sulfur atom.

Abstract: The present invention provides, as one aspect, an electrolytic solution comprising a compound represented by the following formula (1) and a compound represented by the following formula (2): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group comprising a sulfur atom and not comprising a nitrogen atom; and wherein R6 to R8 each independently represent an alkyl group or a fluorine atom, R9 represents an alkylene group, and R10 represents an organic group comprising a nitrogen atom and not comprising a sulfur atom.

Abstract: A lithium ion secondary battery includes: a cathode; an anode: a separator; and an electrolytic solution containing lithium hexafluorophosphate (LiPF6) as a lithium salt, wherein the cathode includes a current collector and a cathode mixture formed on the current collector, and wherein the cathode mixture contains an aluminum oxide, a part or an entirety of a surface of the aluminum oxide being coated with carbon.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1), wherein a content of the compound is 10% by mass or less based on the total amount of the electrolytic solution, wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a nitrogen atom.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a sulfur atom.

Abstract: The present invention provides, as one aspect, an electrolytic solution comprising a compound represented by the following formula (1) and a compound represented by the following formula (2): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group comprising a sulfur atom and not comprising a nitrogen atom; and wherein R6 to R8 each independently represent an alkyl group or a fluorine atom, R9 represents an alkylene group, and R10 represents an organic group comprising a nitrogen atom and not comprising a sulfur atom.

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract: A lithium ion secondary battery includes: a cathode; an anode: a separator; and an electrolytic solution containing lithium hexafluorophosphate (LiPF6) as a lithium salt, wherein the cathode includes a current collector and a cathode mixture formed on the current collector, and wherein the cathode mixture contains an aluminum oxide, a part or an entirety of a surface of the aluminum oxide being coated with carbon.

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Abstract: The adhesive composition of the present invention includes (A) flake silver particles wherein an oxygen state ratio derived from silver oxide measured by X-ray photoelectron spectroscopy is less than 15% and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or more.

Abstract: An adhesive composition having high electrical conductibility and thermal conductivity under no load and even at a curing temperature of 200° C. or lower, and having a high adhesive force even at 260° C., and a semiconductor device produced by using the adhesive composition are provided. Disclosed is an adhesive composition comprising (A) silver particles having a state ratio of oxygen derived from silver oxide of less than 15% as measured by X-ray photoelectron spectroscopy, and (B) an alcohol or carboxylic acid having a boiling point of 300° C. or higher.

Abstract: A connecting material that includes metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy and a mean particle size between 0.1 ?m and 50 ?m; and especially a connecting material that includes metallic particles that have been subjected to treatment for removal of a surface oxide film and subjected to surface treatment with a surface protective material, so as to provide a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C.; as well as a semiconductor device employing the connecting material to bond a semiconductor element to a support member.

Abstract: The invention provides a connecting material comprising metallic particles with an oxygen state ratio of less than 15% as measured by X-ray photoelectron spectroscopy, and especially a connecting material comprising metallic particles that have been subjected to treatment for removal of the surface oxide film and to surface treatment with a surface protective material, for the purpose of providing a connecting material having a high coefficient of thermal conductivity even when joined at a curing temperature of up to 200° C. without application of a load, and that has sufficient bonding strength even when the cured product has been heated at 260° C., as well as a semiconductor device employing it.

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).