Patents by Inventor Kaoru Nakashima

Kaoru Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6388311
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring. The semiconductor device comprises grooves formed on a semiconductor element mounting surface of the pad to surround the semiconductor element, plated portions formed on only a ground bond area of the semiconductor element mounting surface of the pad, a thin portion formed on an entire peripheral edge portions on the back of the pad, and thin portions formed at portions which connect with the pad, on backs of support bars extending from the pad.
    Type: Grant
    Filed: December 6, 1999
    Date of Patent: May 14, 2002
    Assignee: Mitsui High-Tec Incorporated
    Inventors: Kaoru Nakashima, Chikaya Mimura, Seiichiro Sakata
  • SEMICONDUCTOR DEVICE
    Publication number: 20020050640
    Abstract: A semiconductor device capable of preventing moisture from entering into a package and also capable of preventing peeling between a pad and the package from occurring.
    Type: Application
    Filed: December 6, 1999
    Publication date: May 2, 2002
    Inventors: KAORU NAKASHIMA, CHIKAYA MIMURA, SEIICHIRO SAKATA