Patents by Inventor Kaoru Oginuma

Kaoru Oginuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aqueous solution for activation accelerating treatment
    Patent number: 5254156
    Abstract: An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.
    Type: Grant
    Filed: November 18, 1992
    Date of Patent: October 19, 1993
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Akishi Nakaso, Kaoru Oginuma, Takeshi Shimazaki, Akio Takahashi
  • Electroless plating process
    Patent number: 5206052
    Abstract: An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.
    Type: Grant
    Filed: May 2, 1990
    Date of Patent: April 27, 1993
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Akishi Nakaso, Kaoru Oginuma, Takeshi Shimazaki, Akio Takahashi