Abstract: A vehicle includes a center transmission plate, a first center turnable portion configured to turn about a first center turning axis extending in an up-down direction, a second center turnable portion configured to turn about a second center turning axis extending in a front-rear direction, a left transmission plate, a first left turnable portion configured to turn about a first left turning axis extending in the up-down direction, a second left turnable portion configured to turn about a second left turning axis extending in the front-rear direction, a right transmission plate, a first right turnable portion configured to turn about a first right turning axis extending in the up-down direction, and a second right turnable portion configured to turn about a second right turning axis extending in the front-rear direction. A tie rod is supported on the second center turnable portion, the second left turnable portion, and the second right turnable portion.

Abstract: A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

Abstract: A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

Abstract: A temperature sensor with a reduced number of components is provided. In the temperature sensor (10) in accordance with the present invention, a cap part (44A) of a sensor cover (44) covers an opening (14) of a holder (12) as a whole, whereby water droplets and the like are prevented from entering between the holder (12) and a filler resin part (42). A neck part (44B) of the sensor cover (44) keeps a harness pair (34A, 34B) from breaking by bending in excess. Both of the cap part (44A) and neck part (44B) are a part of the sensor cover (44) and are integrated together. The number of components in the temperature sensor (10) employing such a sensor cover (44) is smaller than that in a temperature sensor (50) in which a cap and a lead drawing member are separate from each other.

Abstract: A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

Abstract: A temperature sensor with a reduced number of components is provided. In the temperature sensor (10) in accordance with the present invention, a cap part (44A) of a sensor cover (44) covers an opening (14) of a holder (12) as a whole, whereby water droplets and the like are prevented from entering between the holder (12) and a filler resin part (42). A neck part (44B) of the sensor cover (44) keeps a harness pair (34A, 34B) from breaking by bending in excess. Both of the cap part (44A) and neck part (44B) are a part of the sensor cover (44) and are integrated together. The number of components in the temperature sensor (10) employing such a sensor cover (44) is smaller than that in a temperature sensor (50) in which a cap and a lead drawing member are separate from each other.

Abstract: An integrated circuit is formed in each region of a front surface of a semiconductor device. The semiconductor device is mechanically ground so as to be left having a thickness enough to prevent a defect on the back surface from reaching its opposed front surface. Thereafter, the back surface of the semiconductor device is subjected to etching in mainly chemical reaction to thereby smoothe concaves and convexes caused on the back surface of the semiconductor device in mechanical grinding, so that the semiconductor device is made thinner by the amount corresponding to a concave/convex difference.

Abstract: A semiconductor integrated device comprises: a light-shielding film which shields at least some part of a transfer section of the semiconductor integrated device from light; a first wiring formed in the same layer as the light-shielding film, with one end connected to a pad electrode and an other end extended to a side edge of the semiconductor substrate; a second wiring arranged to go around a side face of the semiconductor substrate, and connected to the first wiring; and a sealing member which seals the solid-state image sensor.

Abstract: A motor cycle incorporates a sensor detecting a condition of the tire, such as, for example, tire pressure. A transmitter transmits the tire condition and a receiver receives the tire condition. An indicator indicates the tire condition. A battery supplies electric power to an engine of the motorcycle, the receiver and the indicator. A control device controls the power supply to the engine, the receiver and the indicator from the battery. A main switch assembly and an activating switch, which activates the receiver and the indicator, are interposed between the battery and the control device. The control device allows power supply to the engine, the receiver and the indicator when the main switch assembly is turned on. The control device also allows power supply to the receiver and the indicator when the activating switch is turned on. In some arrangements, the activating switch is automatically turned on when another sensor detects a condition change of a frame assembly of the motorcycle.

Abstract: An integrated circuit is formed in each region of a front surface of a semiconductor device. The semiconductor device is mechanically ground so as to be left having a thickness enough to prevent a defect on the back surface from reaching its opposed front surface. Thereafter, the back surface of the semiconductor device is subjected to etching in mainly chemical reaction to thereby smoothe concaves and convexes caused on the back surface of the semiconductor device in mechanical grinding, so that the semiconductor device is made thinner by the amount corresponding to a concave/convex difference.

Abstract: A semiconductor device manufacturing method comprises a step of forming a laminated structure by adhering, on a semiconductor substrate including a plurality of integrated circuits, a carrier member covering a region in which the plurality of integrated circuits are formed, with an insulating resin interposed between the semiconductor substrate and the carrier member, a step of cutting a notch into the laminated structure so as to cut the semiconductor substrate together with the insulating resin while allowing at least a portion of the carrier member to remain uncut, and a dicing step for dividing the laminated structure by cutting the carrier member. The notch cutting step is performed while cooling a dicing saw used to cut the semiconductor substrate.

Abstract: A wheeled vehicle includes a tire condition detecting system in which a sensor (or possible a plurality of sensors) of the system detects one or more tire conditions (e.g., pressure and/or temperature) of at least one wheel of the vehicle. A transmitter transmits a signal indicative of the tire conditions sensed by the sensor at various transmission intervals. A receiver located on a frame assembly of the vehicle receives the signals from the transmitter. A controller is provided to control the transmitter. The controller determines the transmission intervals based upon the tire condition signal(s) sent by the sensor(s) so as to reduce power consumption by the system when possible. A rechargeable power source preferably powers at least the transmitter or the controller. The power source can be recharged using a hole in a rim of the wheel.

Abstract: A motor cycle incorporates a sensor detecting a condition of the tire, such as, for example, tire pressure. A transmitter transmits the tire condition and a receiver receives the tire condition. An indicator indicates the tire condition. A battery supplies electric power to an engine of the motorcycle, the receiver and the indicator. A control device controls the power supply to the engine, the receiver and the indicator from the battery. A main switch assembly and an activating switch, which activates the receiver and the indicator, are interposed between the battery and the control device. The control device allows power supply to the engine, the receiver and the indicator when the main switch assembly is turned on. The control device also allows power supply to the receiver and the indicator when the activating switch is turned on. In some arrangements, the activating switch is automatically turned on when another sensor detects a condition change of a frame assembly of the motorcycle.