Abstract: A three-dimensional light reflection plate that can successfully prevent deformation of the light reflection plate, reduce initial cost and product cost, and facilitate increase in size and reflectance. The light reflection plate includes a bottom plate in which a plurality of mutually parallel slit holes are formed on a flat, light-reflective plate material and a mountain plate that is rectangular from a planar view of which a width direction cross-sectional shape is a mountain shape and in which insertion sections are formed in both width-direction end sections. The mountain plate is fixed to the bottom plate by the insertion sections of the mountain plate being inserted into the slit holes of the bottom plate.

Abstract: A three-dimensional light reflection plate that can successfully prevent deformation of the light reflection plate, reduce initial cost and product cost, and facilitate increase in size and reflectance. The light reflection plate includes a bottom plate in which a plurality of mutually parallel slit holes are formed on a flat, light-reflective plate material and a mountain plate that is rectangular from a planar view of which a width direction cross-sectional shape is a mountain shape and in which insertion sections are formed in both width-direction end sections. The mountain plate is fixed to the bottom plate by the insertion sections of the mountain plate being inserted into the slit holes of the bottom plate.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber along an optical axis. The base includes a structural support member configured to prevent warping of the base, where the structural support member extends along the base in a direction generally parallel to the optical axis.

Abstract: A laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system, an optical system mounting member supporting at least a portion of the optical system, a laser diode mounting member, and a bottom plate supporting the laser diode, the optical system, the optical system mounting member, and the laser diode mounting member. The optical system receives and transmits a beam emitted from the laser diode through a lens portion to an optical fiber. The optical system mounting member is attached to the laser diode mounting member. The laser diode module preferably includes a thermo module having a first plate member attached to the laser diode mounting member.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. A portion of the base is made of a material having a first thermal expansion coefficient and the bottom plate is constructed of a material having a second thermal expansion coefficient, where the first thermal expansion coefficient is substantially equal to the second thermal expansion coefficient. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber.

Abstract: When laser welding is performed by irradiating a laser beam to a objected joint portion of metals adjacently arranged, the irradiation of the laser beam is terminated after power of the laser beam is reduced in comparison with an irradiation starting time without constantly setting the power of the laser beam from the irradiation start to the irradiation termination. When the power of the laser beam is constant from the irradiation start to the irradiation termination, the metals melted by the irradiation of the laser beam are suddenly cooled and solidified by the irradiation termination of the laser beam so that various problems are caused. In contrast to this, the sudden cooling solidification of the molten metals can be restrained by terminating the irradiation of the laser beam after the power of the laser beam is reduced. Thus, it is possible to reduce the generation of a crack and an air bubble in a welding portion. Further, residual stress of the welding portion can be reduced and restrained.

Abstract: A laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system, an optical system mounting member supporting at least a portion of the optical system, a laser diode mounting member, and a bottom plate supporting the laser diode, the optical system, the optical system mounting member, and the laser diode mounting member. The optical system receives and transmits a beam emitted from the laser diode through a lens portion to an optical fiber. The optical system mounting member is attached to the laser diode mounting member. The laser diode module preferably includes a thermo module having a first plate member attached to the laser diode mounting member.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber along an optical axis. The base includes a structural support member configured to prevent warping of the base, where the structural support member extends along the base in a direction generally parallel to the optical axis.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a base configured to support the laser diode and at least a portion of the optical system, and a bottom plate configured to support the laser diode, the optical system, and the base. A portion of the base is made of a material having a first thermal expansion coefficient and the bottom plate is constructed of a material having a second thermal expansion coefficient, where the first thermal expansion coefficient is substantially equal to the second thermal expansion coefficient. The optical system is configured to receive and transmit a beam emitted from the laser diode through the lens portion to the optical fiber.

Abstract: A semiconductor laser diode module in which a laser diode and an optical fiber are optically coupled with each other efficiently irrespective of an ambient temperature change within the laser diode module. The laser diode module includes a laser diode, an optical system including an optical fiber and a lens portion, a holder configured to receive a portion of the optical system, a base having a holder mounting member and a fastening member, and a bottom plate configured to support the base. The holder is mounted to the fastening member at a first joint position, and the fastening member is mounted to the holder mounting member at a second joint position, where the first and second joint positions are located at substantially a same distance from the bottom plate. Alternatively, the first and second joint positions are coplanar with an active layer of the diode.