Abstract: A biological information measurement device includes a housing, a measurement unit disposed in the housing and sending and receiving light to and from a subject, and an arithmetic unit disposed in the housing and estimating first information related to a biological body from a signal depending on the light received by the measurement unit, wherein the housing includes an attachment portion for attachment of a second information measurement device configured to obtain, from the subject, second information related to the biological body, the second information being different from the first information.

Abstract: For a sensor module that is easily positioned at a position at which biological information can be obtained when attached to an object under detection and a biological information displaying system that includes the sensor module, provided is a biological information displaying system 1 that includes a sensor module 10 that includes a light emitting part 11 including a light emitting element 11a1 and a light emitting element 11a2 arranged at an interval; and a light receiving part 12 including one light receiving element 12-1 sensitive to near-infrared light. The one light receiving element 12-1 is arranged to receive light emitted by the light emitting element 11a1 and the light emitting element 11b1, and the light emitting element 11a1 and the light emitting element 11b1 emit near-infrared light having a same central wavelength ?1.

Abstract: By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in board. By putting the burn-in board in this state into a burn-in tester, the plurality of semiconductors can be collectively tested. Accordingly, the semiconductors and sockets for holding the semiconductors need not be provided in the one-to-one relation, whereby a larger number of semiconductors can be tested at once.

Abstract: In the present invention, a microphone body 20 has recesses 20b. Bases 22 included in terminal portions are embedded in the recesses so that element-side terminals 23 fixed to the bases are electrically connected to the microphone body 20. The element-side terminals 23 are resiliently deformable terminals. Thus, the element-side terminals 23 are resiliently deformed to become conductively connected to the microphone body 20. This eliminates the need for joining the element-side terminals 23 to the microphone body 20 by soldering or the like, whereby the microphone body 20 can be properly protected from influence of heat. In addition, the terminal portions can be readily and properly attached to the element body by automatic mounting.

Abstract: A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various tests are performed. If the result of the test is pass, the holder is heated so that the adhesive member becomes hard and rigid by being heated. This can perform securing while a good connection between the first bare chip and the holder is maintained. If the result of the test is fail, only the first bare chip is removed and replaced with a new bare chip.

Abstract: An inter-member connection structure is provided. The inter-member connection structure has a contact-attached sheet having spiral contactors and a flexible printed circuit having electrode portions thereon that face each other. An elastic member and a fixed member are installed on the contact-attached sheet, and both ends of the fixed member are fixed on the mother board by mounting members. As an elastic force is applied to the spiral contactor from the elastic member, the spiral contactor appropriately comes in contact with the electrode portion, and the contact-attached sheet and the flexible printed circuit can be securely supported on the board. A method of manufacturing an inter-member connection structure is provided.

Abstract: An upper side and a lower side of a coupling member are provided with spiral contacts including elastic deforming portions. The elastic deforming portions are made contact with connectors of an IC package. Thereby, contact pressure on the IC package can be reduced. Further, the coupling member is replaceably positioned with respect to a substrate. Accordingly, only the coupling member can be replaced as needed, and therefore, maintenance fee can be reduced.

Abstract: A connecting component is provided. The connecting component includes an elastic contact and a base. The base includes a substrate, a sheet member, and a fixed contact. At least one of the substrate, the sheet member, and the fixed contact is formed using a damping alloy.

Abstract: An inter-member connection structure is provided. The inter-member connection structure has a contact-attached sheet having spiral contactors and a flexible printed circuit having electrode portions thereon that face each other. An elastic member and a fixed member are installed on the contact-attached sheet, and both ends of the fixed member are fixed on the mother board by mounting members. As an elastic force is applied to the spiral contactor from the elastic member, the spiral contactor appropriately comes in contact with the electrode portion, and the contact-attached sheet and the flexible printed circuit can be securely supported on the board. A method of manufacturing an inter-member connection structure is provided.

Abstract: An electronically functioning device module, an input device having the electronically functioning device module, and electronic equipment having the input device is provided. LEDs or a microphone device are mounted to a back surface of a seat member on which reversing plates are mounted.

Abstract: The present invention relates to a semiconductor device and a method for manufacturing the same that prevent deformation or cracking caused by a difference in coefficient of thermal expansion. Elastic contacts provided on upper and lower surfaces of an interposer are elastically biased against the relatively displaced electrodes. The interposer thus compensates for displacement caused by different coefficients of thermal expansion so that an electrical connection between the electrodes of the first electronic component and the electrodes of the second electronic component is constantly maintained. Accordingly, this prevents separation or cracking in electrode connection areas.

Abstract: A substrate is formed with a plurality of spiral contactors on an upper surface serving as a first surface and a plurality of connecting terminals on a lower surface serving as a second surface. Since the spiral contactors are arranged in a matrix on the upper surface serving as the first surface, a lot of spiral contactors can be provided on the substrate of the present invention, and a mount area can be enlarged, and the size of the connector can be decreased.

Abstract: By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in board. By putting the burn-in board in this state into a burn-in tester, the plurality of semiconductors can be collectively tested. Accordingly, the semiconductors and sockets for holding the semiconductors need not be provided in the one-to-one relation, whereby a larger number of semiconductors can be tested at once.

Abstract: An upper side and a lower side of a coupling member are provided with spiral contacts including elastic deforming portions. The elastic deforming portions are made contact with connectors of an IC package. Thereby, contact pressure on the IC package can be reduced. Further, the coupling member is replaceably positioned with respect to a substrate. Accordingly, only the coupling member can be replaced as needed, and therefore, maintenance fee can be reduced.

Abstract: A spiral contactor is provided on a substrate. An electronic function part and the substrate are adhered with an anisotropic conductive paste while an electrode portion of the electronic function part is being contacted with the spiral contactor. Thus, the electronic function part and the substrate can be securely fixed together while an adequate electrical connection between the electrode portion of the electronic function part and the spiral contactor is ensured.

Abstract: A first cavity in a holder is provided with a plurality of spiral contactors and a thermosetting adhesive member. In a state where a first bare chip is mounted in the first cavity and spherical contactors on the first bare chip are pressed against the plurality of spiral contactors, various tests are performed. If the result of the test is pass, the holder is heated so that the adhesive member becomes hard and rigid by being heated. This can perform securing while a good connection between the first bare chip and the holder is maintained. If the result of the test is fail, only the first bare chip is removed and replaced with a new bare chip.

Abstract: A substrate is formed with a plurality of spiral contactors on an upper surface serving as a first surface and a plurality of connecting terminals on a lower surface serving as a second surface. Since the spiral contactors are arranged in a matrix on the upper surface serving as the first surface, a lot of spiral contactors can be provided on the substrate of the present invention, and a mount area can be enlarged, and the size of the connector can be decreased. Also, the spiral contact terminal can improve a high-frequency characteristic.

Abstract: A compact, simple connection unit for mounting an electronic component to a substrate includes connectors having one or more arm portions. The connectors are provided with internal stress, which allows the arm portions to grip the electronic component so that the electronic component can be firmly fixed to the substrate.

Abstract: In order to be able to prevent devices from being degraded in high frequency property and to prevent damages to respective junction terminals, thereby achieving lengthening of the junction terminals in service life, a connector device comprising a plurality of substantially semi-spherical junction terminals arranged on one surface of a board, substantially semi-spherical junction terminals arranged in positions on the other surface of the board, corresponding to those positions, in which the respective junction terminals are arranged, to be conducted to the respective junction terminals, and a plurality of contactors corresponding to the respective junction terminals, and wherein the respective contactors comprise a through-hole and contact pieces arranged in the through-hole, and each of the junction terminals are inserted into the through-hole whereby a surface of each of the junction terminals is brought into contact with surfaces of the contact pieces.

Abstract: In order to be able to prevent devices from being degraded in high frequency property and to prevent damages to respective junction terminals, thereby achieving lengthening of the junction terminals in service life, a connector device comprising a plurality of substantially semi-spherical junction terminals arranged on one surface of a board, substantially semi-spherical junction terminals arranged in positions on the other surface of the board, corresponding to those positions, in which the respective junction terminals are arranged, to be conducted to the respective junction terminals, and a plurality of contactors corresponding to the respective junction terminals, and wherein the respective contactors comprise a through-hole and contact pieces arranged in the through-hole, and each of the junction terminals are inserted into the through-hole whereby a surface of each of the junction terminals is brought into contact with surfaces of the contact pieces.