Abstract: A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units. A polyimide precursor resin composition in accordance with the present invention contains either such a polyimide precursor or resins separately containing the structural units. Polyimide precursors in accordance with the present invention and resin compositions based on the same therefore have excellent properties and are suitably used in particular to form a particular pattern and for other purposes by impart photosensitivity to them.

Abstract: A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

Abstract: A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

Abstract: The present invention provides a photosensitive resin composition and a photosensitive dry film resist produced therefrom, and further provides a photosensitive dry film resist having excellent flame-retardant properties. More specifically, the present invention provides a photosensitive dry film resist and photosensitive coverlay film produced from a photosensitive resin composition consisting mainly of soluble polyimide, a compound having a carbon-carbon double bond, and a photoreactive initiator and/or sensitizer that have excellent workability, can be developed in an alkaline solution, and meet the standard for tests for flammability of plastic materials known as UL94V-0. The photosensitive coverlay film of the present invention can be attached without any adhesives and has an excellent heat resistance, so that it is suitably used for a printed wiring board to be used in the electronic material field, for hard disc suspension, and for a hard disc head for a personal computer.

Abstract: The present invention relates to a photosensitive resin composition having excellent heat resistance, processability, and adhesion, and a solder resist comprising the composition, a cover lay film, and a printed circuit board obtained from or with these. The cover lay film is excellent in processability and adhesion at relatively low temperatures and has a low elastic coefficient after curing while keeping sufficient mechanical strength, so that the cover lay film is preferably used for a printed circuit board or a hard disk. The cover lay film is soluble and can be laminated at temperatures of not higher than 150° C., and a solder resist having excellent properties, such as heat resistance which can be laminated directly onto FPC without any adhesives and a cover lay film having few warps when laminated onto the FPC can be provided according to the present invention.

Abstract: A polyimide precursor in accordance with the present invention contains amide acid ester units, either imide units or amide acid units, and fluorine atoms bonded to some of these structural units. A polyimide precursor resin composition in accordance with the present invention contains either such a polyimide precursor or resins separately containing the structural units. Polyimide precursors in accordance with the present invention and resin compositions based on the same therefore have excellent properties and are suitably used in particular to form a particular pattern and for other purposes by impart photosensitivity to them.