Abstract: A pump apparatus which can save space and is easy to handle is proposed. The pump apparatus includes a pipe-shaped casing including a suction port and a discharge port arranged in the same straight line and defining a flow channel that connects the suction port and the discharge port; a motor disposed inside the casing, the motor including a rotating shaft extending along a flow channel direction directing from the suction port to the discharge port, a rotor rotating integrally with the rotating shaft, a stator provided on an outer peripheral side of the rotor, and a can for isolating a rotor chamber and a stator chamber, the rotor chamber having the rotor disposed therein and the stator chamber having the stator disposed therein; and an inverter disposed in the interior of the casing for exercising variable speed control over the motor.

Abstract: Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.

Abstract: Disclosed is an electroless palladium plating solution which can form a plating layer having excellent soldering properties onto electronic components and the like and excellent wire bonding properties. The electroless palladium plating solution comprises a palladium compound, an amine compound, an inorganic sulfur compound and a reducing agent, wherein a combination of hypophosphorous acid or a hypophosphorous acid compound and formic acid or a formic acid compound is used as the reducing agent, and wherein the palladium compound, the amine compound, the inorganic sulfur compound, the hypophosphorous acid compound, and formic acid or the formic acid compound are contained in amounts of 0.001 to 0.1 mole/l, 0.05 to 5 mole/l, 0.01 to 0.1 mole/l, 0.05 to 1.0 mole/l and 0.001 to 0.1 mole/l, respectively. The electroless palladium plating solution is characterized by having excellent soldering properties and excellent wire bonding properties.

Abstract: A fluid machinery for generating a pressure by rotating an impeller with a motor has a frequency converter (F) for supplying electric power to the motor, a detector for detecting a frequency and a current value, and a program for specifying in advance the relationship between the frequency and the current value. A frequency and a current value in an actual operation are compared with the specified program, and the frequency generated by the frequency converter (F) is varied so that an operating point of the fluid machinery approaches the specified program.

Abstract: The present invention relates to a fluid machinery for generating a pressure by rotating an impeller with a motor. The fluid machinery has a frequency converter (F) for supplying electric power to the motor, a detector for detecting a frequency and a current value, and a program for specifying in advance the relationship between the frequency and the current value. A frequency and a current value in an actual operation are compared with the specified program, and the frequency generated by the frequency converter (F) is varied so that an operating point of the fluid machinery approaches the specified program.

Abstract: A pump having an improved fluid passage has an inner casing which houses at least one impeller and an outer casing which houses the inner casing. The pump also has a communicating pipe disposed outside of the outer casing for guiding a main flow of a fluid being handled from a space defined in the outer casing into another space defined in the outer casing.

Abstract: A mixture of 2-piperidone and an N-acyllactam compound for use as a soil amending agent which is provided in a molar ratio of 2-piperidone to N-acyllactam compound in the range from 0.1:1 to 10:1 is effective in the promotion of plant growth.