Patents by Inventor Kaoru Yajima

Kaoru Yajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for low loop wire bonding
    Patent number: 7475802
    Abstract: A method is provided for low loop wire bonding. The method includes forming a first bond between a first bonding ball disposed at an end of a first wire and a bond pad of a die coupled to a leadframe having one or more leads. The method also includes forming a second bond between a portion of the wire and a lead of the leadframe. The length of wire between the first and second bonds forms a loop in the wire having a first loop height. The method further includes disposing a second bonding ball on top of the first bonding ball, a portion of the loop being compressed between the first and second bonding balls. The compressed loop has a second loop height less than the first loop height. The method also includes forming a third bond between the second bonding ball, the wire, and the first bonding ball.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: January 13, 2009
    Assignee: Texas Instruments Incorporated
    Inventor: Kaoru Yajima
  • System and method for low loop wire bonding
    Publication number: 20050242159
    Abstract: A method is provided for low loop wire bonding. The method includes forming a first bond between a first bonding ball disposed at an end of a first wire and a bond pad of a die coupled to a leadframe having one or more leads. The method also includes forming a second bond between a portion of the wire and a lead of the leadframe. The length of wire between the first and second bonds forms a loop in the wire having a first loop height. The method further includes disposing a second bonding ball on top of the first bonding ball, a portion of the loop being compressed between the first and second bonding balls. The compressed loop has a second loop height less than the first loop height. The method also includes forming a third bond between the second bonding ball, the wire, and the first bonding ball.
    Type: Application
    Filed: April 28, 2004
    Publication date: November 3, 2005
    Inventor: Kaoru Yajima